Bondwireless power module with three-dimensional current routing

• US 8,350,376 B2
• Filed: 04/18/2011
• Issued: 01/08/2013
• Est. Priority Date: 04/18/2011
• Status: Active Grant

• Current Assignee: Infineon Technologies Americas Corp. (Infineon Technologies AG)
• Original Assignee: International Rectifier Corporation (Infineon Technologies AG)
• Inventors: Hauenstein, Henning M., Gorgerino, Andrea
• Primary Examiner(s): ZARNEKE, DAVID A
• Application Number:
  US13/088,573
• Publication Number:
  US 20120262100A1
• Time in Patent Office: 631 Days
• Field of Search: 257/691, 257/685, 257/779, 257/704, 257/707
• US Class Current: 257/691
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/06181 On opposite sides of the body
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/33181 On opposite sides of the body
• CPC Class Codes: H01L 2224/37147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/40139 with an intermediate bond, e.g. continuous strap daisy chain
• CPC Class Codes: H01L 2224/40227 Connecting the strap to a bond pad of the item
• CPC Class Codes: H01L 2224/84 using a strap connector
• CPC Class Codes: H01L 23/492 Bases or plates or solder therefor
• CPC Class Codes: H01L 23/49844 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 24/37 of an individual strap connector
• CPC Class Codes: H01L 24/40 of an individual strap connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/1306 Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Abstract

According to an exemplary embodiment, a bondwireless power module includes a common output pad coupling an emitter/anode node of a high side device to a collector/cathode node of a low side device. The bondwireless power module also includes a high side conductive clip connecting a collector of the high side device to a cathode of the high side device, and causing current to traverse through the high side conductive clip to another high side conductive clip in another power module. The bondwireless power module further includes a low side conductive clip connecting an emitter of the low side device to an anode of the low side device, and causing current to traverse through the low side conductive clip to another low side conductive clip in the another power module. The bondwireless power module can be a motor drive inverter module.

Claims

1. A bondwireless power module comprising:

a common output pad coupling an emitter/anode node of a high side device to a collector/cathode node of a low side device;

a high side conductive clip connecting a collector of said high side device to a cathode of said high side device, and causing current to traverse through said high side conductive clip to another high side conductive clip in another power module;

a low side conductive clip connecting an emitter of said low side device to an anode of said low side device, and causing current to traverse through said low side conductive clip to another low side conductive clip in said another power module.

2. The bondwireless power module of claim 1, wherein said bondwireless power module is a motor drive inverter module.

3. The bondwireless power module of claim 1, wherein said high side device comprises an IGBT in parallel with a diode.

4. The bondwireless power module of claim 1, wherein said low side device comprises an IGBT in parallel with a diode.

5. The bondwireless power module of claim 1, wherein said common output pad is situated under said high side and low side conductive clips.

6. The bondwireless power module of claim 1, wherein said high side conductive clip is part of a high side supply bus.

7. The bondwireless power module of claim 1, wherein said high side conductive clip causes current to traverse through said high side conductive clip and over said common output pad.

8. The bondwireless power module of claim 1, wherein said common output pad is situated on a direct bonded copper (DBC) substrate.

9. The bondwireless power module of claim 1, wherein said low side conductive clip causes current to traverse through said low side conductive clip and over said common output pad.

10. The bondwireless power module of claim 1, wherein said high side device and said low side device are connected in a half-bridge between a high side supply bus and a low side supply bus.

11. The bondwireless power module of claim 1, wherein said high side conductive clip is connected to said another high side conductive clip through a high side supply pad.

12. A bondwireless three-phase motor drive inverter module comprising:

a U-phase, a V-phase, and a W-phase each including a respective common output pad coupling an emitter/anode node of a high side device to a collector/cathode node of a low side device, a high side conductive clip connecting a collector of said high side device to a cathode of said high side device, and a low side conductive clip connecting an emitter of said low side device to an anode of said low side device;

said high side conductive clip of said U-phase causing current to traverse through said high side conductive clip of said U-phase to said high side conductive clip of said V-phase;

said low side conductive clip of said U-phase causing current to traverse through said low side conductive clip of said U-phase to said low side conductive clip of said V-phase.

13. The bondwireless three-phase motor drive inverter module of claim 12, wherein said high side conductive clip of said V-phase causes current to traverse through said high side conductive clip of said V-phase to said high side conductive clip of said W-phase.

14. The bondwireless three-phase motor drive inverter module of claim 12, wherein said low side conductive clip of said V-phase causes current to traverse through said low side conductive clip of said V-phase to said low side conductive clip of said W-phase.

15. The bondwireless three-phase motor drive inverter module of claim 12, wherein said high side device comprises an IGBT in parallel with a diode.

16. The bondwireless three-phase motor drive inverter module of claim 12, wherein said low side device comprises an IGBT in parallel with a diode.

17. The bondwireless three-phase motor drive inverter module of claim 12, wherein said high side device comprises a IGBT in parallel with a diode, said diode being monolithically integrated with said IGBT on a single die.

18. The bondwireless three-phase motor drive inverter module of claim 12, wherein said high side device comprises a IGBT in parallel with a diode, said diode being monolithically integrated with said IGBT on a single die and formed on a backside of said single die.

19. The bondwireless three-phase motor drive inverter module of claim 12, wherein said high side device comprises a MOSFET in parallel with a diode, said diode being monolithically integrated with said MOSFET on a single die.

20. The bondwireless three-phase motor drive inverter module of claim 12, wherein said high side device comprises a MOSFET in parallel with a diode, said diode being a body diode of said MOSFET.

21. The bondwireless three-phase motor drive inverter module of claim 12, wherein said high side conductive clip is part of a high side supply bus.

22. The bondwireless three-phase motor drive inverter module of claim 12, wherein said low side conductive clip is part of a low side supply bus.

23. The bondwireless three-phase motor drive inverter module of claim 12, wherein said high side conductive clip causes current to traverse through said high side conductive clip and over said common output pad.

24. The bondwireless three-phase motor drive inverter module of claim 12, wherein said low side conductive clip causes current to traverse through said low side conductive clip and over said common output pad.