Combined serial/parallel light configuration and single layer PCB containing the same

• US 8,351,013 B2
• Filed: 01/25/2010
• Issued: 01/08/2013
• Est. Priority Date: 03/03/2008
• Status: Active Grant

• Current Assignee: Manufacturing Resources International, Inc.
• Original Assignee: Manufacturing Resources International, Inc.
• Inventors: Dunn, William, Williams, David
• Primary Examiner(s): CHIEN, LUCY P
• Application Number:
  US12/693,148
• Publication Number:
  US 20100220258A1
• Time in Patent Office: 1,079 Days
• Field of Search: None
• US Class Current: 349/161
• CPC Class Codes: A61N 5/06 using light
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133612 Electrical details
• CPC Class Codes: H05B 45/40 Details of LED load circuits
• CPC Class Codes: H05B 45/50 responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
• CPC Class Codes: H05B 47/10 Controlling the light source

Abstract

An LED circuit using a combination of series and parallel arrangements for optimum current sharing between LEDs. The current paths allow an LED to fail while minimizing the effect on other LEDs and noticeable luminance variance across the circuit. Some embodiments use metallic PCB technology which permits optimal thermal regulation of heat generated by the LEDs. Exemplary embodiments can be used with a single-layer PCB where only one layer of conducting material must be placed on the substrate. This results in a thinner, lighter, and cheaper assembly. The rear surface of the PCB may contain heat sinks or fins and may have air (or other gaseous matter) moved across the surface and/or heat sinks to facilitate cooling of the assembly. An LCD assembly using the same is also disclosed.

Claims

1. An LED circuit comprising:

a power source;

a positive conduction line connected to the power source;

a first group of LEDs connected in parallel with each other and connected to the positive conduction line;

a second group of LEDs connected in parallel with each other and connected to the first group of LEDs in series;

a third group of LEDs connected in parallel with each other and connected to the second group of LEDs in series;

a fourth group of LEDs connected in parallel with each other and connected to the positive conduction line;

a fifth group of LEDs connected in parallel with each other and connected to the fourth group of LEDs in series;

a sixth group of LEDs connected in parallel with each other and connected to the firth group of LEDs in series; and

a negative conduction line connected to the third and sixth groups of LEDs and returning to the power source.

2. The LED circuit of claim 1 wherein:

the positive and negative conduction lines are defined by a single layer.

3. The LED circuit of claim 1 further comprising:

a seventh group of LEDs connected in parallel with each other and connected in series with the third group of LEDs and the negative conduction line.

4. An LED illumination assembly comprising:

a substrate having front and rear sides;

a layer of dielectric material placed on the front side;

a single layer of conductive material placed atop the layer of dielectric material and electrically connecting;

a positive conduction line;

a first group of LEDs connected in parallel with each other and connected to the positive conduction line;

a second group of LEDs connected in parallel with each other and connected to the first group of LEDs in series;

a third group of LEDs connected in parallel with each other and connected to the second group of LEDs in series;

a fourth group of LEDs connected in parallel with each other and connected to the positive conduction line;

a fifth group of LEDs connected in parallel with each other and connected to the fourth group of LEDs in series;

a sixth group of LEDs connected in parallel with each other and connected to the firth group of LEDs in series; and

a negative conduction line connected to the third and sixth groups of LEDs.

5. The LED illumination assembly of claim 4 further comprising:

a power source in electrical communication with the positive and negative conduction lines.

6. The LED illumination assembly of claim 4 wherein:

the substrate is metallic.

7. The LED illumination assembly of claim 5 wherein:

the substrate is aluminum.

8. The LED illumination assembly of claim 4 further comprising:

heat sinks attached to the rear surface of the substrate.

9. The LED illumination assembly of claim 6 further comprising:

a fan which moves gaseous matter across the rear surface of the substrate.

10. A liquid crystal assembly comprising:

a liquid crystal cell;

a backlight assembly placed behind the liquid crystal cell, the backlight assembly having;

a single-layer PCB having oppositely facing front and rear surfaces;

a positive conduction line on the PCB;

a power source electrically connected to the positive conduction line;

a plurality of LEDs attached to the front surface of the single-layer PCB and electrically connected such that;

a first group of LEDs connected in parallel with each other and connected to the positive conduction line;

a second group of LEDs connected in parallel with each other and connected to the first group of LEDs in series;

a third group of LEDs connected in parallel with each other and connected to the second group of LEDs in series;

a fourth group of LEDs connected in parallel with each other and connected to the positive conduction line;

a fifth group of LEDs connected in parallel with each other and connected to the fourth group of LEDs in series;

a sixth group of LEDs connected in parallel with each other and connected to the firth group of LEDs in series; and

a negative conduction line connected to the third and sixth group of LEDs and returning to the power source.

11. The liquid crystal assembly of claim 10 wherein:

the PCB is a metal core PCB.

12. The liquid crystal assembly of claim 10 wherein:

the PCB is aluminum.

13. The liquid crystal assembly of claim 10 further comprising:

heat sinks attached to the rear surface of the PCB.

14. The liquid crystal assembly of claim 13 further comprising:

a fan which moves gaseous matter across the rear surface of the PCB.