×

Fully integrated RF transceiver integrated circuit

  • US 8,351,982 B2
  • Filed: 05/23/2007
  • Issued: 01/08/2013
  • Est. Priority Date: 05/23/2007
  • Status: Active Grant
First Claim
Patent Images

1. A multi-mode transceiver, comprising:

  • a substrate in a package;

    a bare die formed on the substrate, the bare die including a transmit module operably disposed to receive outgoing pulses that represent digital data and a receive module operable to produce ingoing data pulses, wherein the transmit and receive modules are formed on the bare die;

    at least one antenna formed on the packaged substrate and sized to transmit and receive very high radio frequency signals having a frequency that is at least 20 GHz wherein both the transmit and receive modules are both operably coupled to the at least one antenna; and

    a transmit processing module operable to provide routine digital signal processing for inter-device transmissions to a remote device wherein the routine signal processing includes at least one of scrambling, interleaving, forward error correction coding, and QPSK or higher order modulation encoding, wherein the transmit processing module is operable generate a radio frequency signal characterized by a frequency of greater than or equal to 20 GHz and a transmission power level adequate for transmissions through a dielectric substrate to reach a substrate receiver, and wherein the transmit processing module is operable to produce upsampled digital signals and further wherein the upsampled digital signals are phase shifted to one of two phase values based upon a data value of a data bit being transmitted.

View all claims
  • 6 Assignments
Timeline View
Assignment View
    ×
    ×