Fully integrated RF transceiver integrated circuit
First Claim
1. A multi-mode transceiver, comprising:
- a substrate in a package;
a bare die formed on the substrate, the bare die including a transmit module operably disposed to receive outgoing pulses that represent digital data and a receive module operable to produce ingoing data pulses, wherein the transmit and receive modules are formed on the bare die;
at least one antenna formed on the packaged substrate and sized to transmit and receive very high radio frequency signals having a frequency that is at least 20 GHz wherein both the transmit and receive modules are both operably coupled to the at least one antenna; and
a transmit processing module operable to provide routine digital signal processing for inter-device transmissions to a remote device wherein the routine signal processing includes at least one of scrambling, interleaving, forward error correction coding, and QPSK or higher order modulation encoding, wherein the transmit processing module is operable generate a radio frequency signal characterized by a frequency of greater than or equal to 20 GHz and a transmission power level adequate for transmissions through a dielectric substrate to reach a substrate receiver, and wherein the transmit processing module is operable to produce upsampled digital signals and further wherein the upsampled digital signals are phase shifted to one of two phase values based upon a data value of a data bit being transmitted.
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Accused Products
Abstract
A radio transceiver device includes circuitry for radiating electromagnetic signals at a very high radio frequency both through space, as well as through wave guides that are formed within a substrate material. In one embodiment, the substrate comprises a dielectric substrate formed within a board, for example, a printed circuit board. In another embodiment of the invention, the wave guide is formed within a die of an integrated circuit radio transceiver. A plurality of transceivers with different functionality is defined. Substrate transceivers are operable to transmit through the wave guides, while local transceivers are operable to produce very short range wireless transmissions through space. A third and final transceiver is a typical wireless transceiver for communication with remote (non-local to the device) transceivers. Additionally, a multi-mode transceiver is operable to configure transmit and receive circuitry based upon transmission path.
66 Citations
31 Claims
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1. A multi-mode transceiver, comprising:
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a substrate in a package; a bare die formed on the substrate, the bare die including a transmit module operably disposed to receive outgoing pulses that represent digital data and a receive module operable to produce ingoing data pulses, wherein the transmit and receive modules are formed on the bare die; at least one antenna formed on the packaged substrate and sized to transmit and receive very high radio frequency signals having a frequency that is at least 20 GHz wherein both the transmit and receive modules are both operably coupled to the at least one antenna; and a transmit processing module operable to provide routine digital signal processing for inter-device transmissions to a remote device wherein the routine signal processing includes at least one of scrambling, interleaving, forward error correction coding, and QPSK or higher order modulation encoding, wherein the transmit processing module is operable generate a radio frequency signal characterized by a frequency of greater than or equal to 20 GHz and a transmission power level adequate for transmissions through a dielectric substrate to reach a substrate receiver, and wherein the transmit processing module is operable to produce upsampled digital signals and further wherein the upsampled digital signals are phase shifted to one of two phase values based upon a data value of a data bit being transmitted. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A multi-mode transceiver, comprising:
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a substrate in a package; a bare die formed on the substrate, the bare die including a transmit module operably disposed to receive outgoing pulses that represent digital data and a receive module operable to produce ingoing data pulses, wherein the transmit and receive modules are formed on the bare die; at least one antenna formed on the packaged substrate and sized to transmit and receive very high radio frequency signals having a frequency that is at least 20 GHz, wherein both the transmit and receive modules are both operably coupled to the at least one antenna; and a transmit processing module operable to provide routine digital signal processing for inter-device transmissions to a remote device wherein the routine signal processing includes at least one of scrambling, interleaving, forward error correction coding, and QPSK or higher order modulation encoding, wherein the transmit processing module is operable generate a radio frequency signal characterized by a frequency of greater than or equal to 20 GHz and a transmission power level adequate for transmissions through a dielectric substrate to reach a substrate receiver, and wherein the transmit processing module is operable to produce upsampled digital signals and further wherein the upsampled digital signals are phase shifted to at least four phase values based upon a data value of a data bit being transmitted. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. A multi-mode transceiver, comprising:
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a substrate in a package; a bare die formed on the substrate, the bare die including a transmit module operably disposed to receive outgoing pulses that represent digital data and a receive module operable to produce ingoing data pulses, wherein the transmit and receive modules are formed on the bare die; at least one antenna formed on the packaged substrate and sized to transmit and receive very high radio frequency signals having a frequency that is at least 20 GHz, wherein both the transmit and receive modules are both operably coupled to the at least one antenna; and a transmit processing module operable to provide routine digital signal processing for inter-device transmissions to a remote device wherein the routine signal processing includes at least one of scrambling, interleaving, forward error correction coding, and QPSK or higher order modulation encoding, wherein the transmit processing module is operable generate a radio frequency signal characterized by a frequency of greater than or equal to 20 GHz and a transmission power level adequate for transmissions through a dielectric substrate to reach a substrate receiver, and wherein the transmit processing module is operable to produce an upsampled digital signals and further wherein the upsampled digital signals are amplitude shifted to one of plurality of levels based upon a data value being transmitted.
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Specification