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Semiconductor device and method for manufacturing the same

  • US 8,353,459 B2
  • Filed: 03/26/2008
  • Issued: 01/15/2013
  • Est. Priority Date: 04/06/2007
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • an integrated circuit portion provided over a substrate;

    an insulating film provided over the integrated circuit portion;

    an antenna provided over the insulating film; and

    a conductive film configured to electrically connect the integrated circuit portion and the antenna through a seed layer,wherein the insulating film and the antenna have an opening, andwherein the conductive film and the seed layer are provided in the opening and over a top surface of the antenna.

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