Advanced finishing control

• US 8,353,738 B2
• Filed: 08/01/2011
• Issued: 01/15/2013
• Est. Priority Date: 11/06/1998
• Status: Expired due to Fees

• Current Assignee: Semcon Tech LLC (IPNav)
• Original Assignee: Semcon Tech LLC (IPNav)
• Inventors: Molnar, Charles J.
• Primary Examiner(s): Eley, Timothy V
• Application Number:
  US13/136,437
• Publication Number:
  US 20110294399A1
• Time in Patent Office: 533 Days
• Field of Search: 156/345, 216/38, 216/88, 216/89, 216/91, 252/79.1, 438690-693, 438/745, 438/753, 438/756, 438/757, 451/5, 451/8, 451/36, 451/37, 451/41, 451285-289, 451/4, 451/9, 451/10, 451/11, 700/266, 702/179, 702/182, 703/12, 705/1, 705/7, 705/8, 716/2
• US Class Current: 451/5
• CPC Class Codes: B24B 37/042 operating processes therefor
• CPC Class Codes: G05B 19/41865 characterised by job scheduling, process planning, material flow
• CPC Class Codes: G05B 2219/31265 Control process by combining history and real time data
• CPC Class Codes: G05B 2219/31415 Cost calculation in real time for a product manufactured
• CPC Class Codes: G05B 2219/45031 Manufacturing semiconductor wafers
• CPC Class Codes: G06Q 10/06 Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
• CPC Class Codes: G06Q 50/04 Manufacturing
• CPC Class Codes: H01L 21/67248 Temperature monitoring
• CPC Class Codes: H01L 21/68785 characterised by the mechanical construction of the susceptor, stage or support
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
• CPC Class Codes: Y02P 90/30 Computing systems specially adapted for manufacturing
• CPC Class Codes: Y02P 90/80 Management or planning

Abstract

Methods of using in situ finishing information for finishing workpieces and semiconductor wafers are described. Methods of using yield information at least in part related to cost of manufacture for finishing workpieces and semiconductor wafers are described. Changes or improvements to cost of manufacture of a workpiece using current in-process cost of manufacture information, tracked current in-process cost of manufacture information, or current cost of manufacture parameters are discussed. Appreciable changes to quality or cost of manufacture of a workpiece using tracking, using in-process tracked information, networks including a multiplicity of apparatus, and using in situ finishing information are discussed. A factory, apparatus, and methods to change or improve process control are discussed. A factory, apparatus, and methods to change or improve real-time process control are discussed. A factory, apparatus, and methods to change or improve feedforward and feedback control are discussed. The workpieces can be tracked individually or by process group such as a process batch.

Claims

1. A method for processing a workpiece, the method comprising:

providing i) an at least one finishing apparatus “

A”

for an at least one finishing operation, ii) an at least one piece of workpiece fabrication machinery “

B”

other than the at least one finishing apparatus “

A”

, iii) an at least one piece of metrology equipment, iv) an at least one processor readable memory device, v) an at least one operative computerized network connecting the at least one processor readable memory device, the at least one finishing apparatus “

A”

, the at least one piece of workpiece fabrication machinery “

B”

, and the at least one piece of metrology equipment;

finishing the workpiece with the at least one finishing apparatus;

sensing an in situ finishing information with an operative sensor;

determining a change for a process control parameter using an at least one processor, the at least one operative computerized network, and a family of processing information comprising (i) an at least one yield information at least in part related to a cost of manufacture, (ii) the in situ finishing information, (iii) an information from the at least one piece of metrology equipment at least in part related to the at least one finishing operation, (iv) an information at least in part related to the at least one finishing apparatus “

A”

, and (v) an information at least in part related to the at least one workpiece fabrication machinery “

B” and

at least in part related to the at least one finishing operation; and

changing the process control parameter to change a processing control with an operative controller and wherein the processing control comprises a processing control at least in part related to the at least one finishing operation.

2. The method of claim 1 wherein the at least one piece of workpiece fabrication machinery “

B”

comprises a patterning apparatus and a cleaning apparatus and wherein the information at least in part related to the at least one workpiece fabrication machinery “

B” and

at least in part related to the at least one finishing operation comprises an information at least in part related to the patterning apparatus, at least in part related to the cleaning apparatus, and at least in part related to the at least one finishing operation.

3. The method of claim 2 wherein the process control parameter is changed in situ.

4. The method of claim 2 wherein the process control parameter is changed in real time.

5. The method of claim 1 wherein the process control parameter is changed in situ.

6. The method of claim 1 wherein the process control parameter is changed in real time.

7. A method for processing a workpiece, the method comprising:

providing i) an at least one planarizing apparatus “

A”

for an at least one planarizing operation, ii) an at least one piece of workpiece fabrication machinery “

B”

other than the at least one planarizing apparatus “

A”

, iii) an at least one piece of metrology equipment, iv) an at least one processor readable memory device, v) an at least one operative computerized network connecting the at least one processor readable memory device, the at least one planarizing apparatus “

A”

, the at least one piece of workpiece fabrication machinery “

B”

, and the at least one piece of metrology equipment;

planarizing the workpiece with the at least one planarizing apparatus;

sensing an in situ planarizing information with an operative sensor;

determining a change for a process control parameter using an at least one processor, the at least one operative computerized network, and a family of processing information comprising (i) an at least one yield information at least in part related to a cost of manufacture, (ii) the in situ planarizing information, (iii) an information from the at least one piece of metrology equipment at least in part related to the at least one planarizing operation, (iv) an information at least in part related to the at least one planarizing apparatus “

A”

, and (v) an information at least in part related to the at least one workpiece fabrication machinery “

B” and

at least in part related to the at least one planarizing operation; and

changing the process control parameter to change a processing control with an operative controller and wherein the processing control comprises a processing control at least in part related to the at least one planarizing operation.

8. The method of claim 7 wherein the at least one piece of workpiece fabrication machinery “

B”

comprises a patterning apparatus and a cleaning apparatus and wherein the information at least in part related to the at least one workpiece fabrication machinery “

B” and

at least in part related to the at least one planarizing operation comprises an information at least in part related to the patterning apparatus, at least in part related to the cleaning apparatus, and at least in part related to the at least one planarizing operation.

9. The method of claim 8 wherein the process control parameter is changed in situ.

10. The method of claim 8 wherein the process control parameter is changed in real time.

11. The method of claim 7 wherein the process control parameter is changed in situ.

12. The method of claim 7 wherein the process control parameter is changed in real time.

13. A method for processing a workpiece, the method comprising:

providing i) an at least one polishing apparatus “

A”

for an at least one polishing operation, ii) an at least one piece of workpiece fabrication machinery “

B”

other than the at least one polishing apparatus “

A”

, iii) an at least one piece of metrology equipment, iv) an at least one processor readable memory device, v) an at least one operative computerized network connecting the at least one processor readable memory device, the at least one polishing apparatus “

A”

, the at least one piece of workpiece fabrication machinery “

B”

, and the at least one piece of metrology equipment;

polishing the workpiece with the at least one polishing apparatus;

sensing an in situ polishing information with an operative sensor;

determining a change for a process control parameter using an at least one processor, the at least one operative computerized network, and a family of processing information comprising (i) an at least one yield information at least in part related to a cost of manufacture, (ii) the in situ polishing information, (iii) an information from the at least one piece of metrology equipment at least in part related to the at least one polishing operation, (iv) an information at least in part related to the at least one polishing apparatus “

A”

, and (v) an information at least in part related to the at least one workpiece fabrication machinery “

B” and

at least in part related to the at least one polishing operation; and

changing the process control parameter to change a processing control with an operative controller and wherein the processing control comprises a processing control at least in part related to the at least one polishing operation.

14. The method of claim 13 wherein the at least one piece of workpiece fabrication machinery “

B”

comprises a patterning apparatus and a cleaning apparatus and wherein the information at least in part related to the at least one workpiece fabrication machinery “

B” and

at least in part related to the at least one polishing operation comprises an information at least in part related to the patterning apparatus, at least in part related to the cleaning apparatus, and at least in part related to the at least one polishing operation.

15. The method of claim 14 wherein the process control parameter is changed in situ.

16. The method of claim 14 wherein the process control parameter is changed in real time.

17. The method of claim 13 wherein the process control parameter is changed in situ.

18. The method of claim 13 wherein the process control parameter is changed in real time.

19. The method of claim 14 additionally comprising using a lubricant during polishing.

20. The method of claim 13 additionally comprising using a lubricant during polishing.