Method of making a semiconductor chip assembly with a bump/base/ledge heat spreader, dual adhesives and a cavity in the bump
First Claim
1. A method of making a semiconductor chip assembly, comprising:
- providing a bump, a ledge, a first adhesive and a first conductive layer, whereinthe bump defines a cavity that faces in a first vertical direction, covers the cavity in a second vertical direction opposite the first vertical direction, is adjacent to and integral with the ledge, extends vertically from the ledge in the second vertical direction, extends into a first opening in the first adhesive and is aligned with a first aperture in the first conductive layer,the ledge extends laterally from the bump in lateral directions orthogonal to the vertical directions,the first adhesive is mounted on the ledge, is sandwiched between the ledge and the first conductive layer and is non-solidified, andthe first conductive layer is mounted on the first adhesive;
thenflowing the first adhesive in the second vertical direction into a gap located in the first aperture between the bump and the first conductive layer;
solidifying the first adhesive;
thenproviding a heat spreader that includes the bump, a base and the ledge, wherein the bump is adjacent to the base and extends vertically from the base in the first vertical direction and the base covers the bump in the second vertical direction, extends laterally from the bump and includes a portion of the first conductive layer that is adjacent to the first aperture and spaced from the bump;
thenmounting a conductive trace and a second adhesive on the ledge, wherein the conductive trace includes a pad and a terminal and is located outside the cavity and beyond the ledge in the first vertical direction, the second adhesive is sandwiched between the conductive trace and the ledge and includes a second opening, the bump is aligned with and spaced from the second opening and the ledge is sandwiched between the adhesives and covers the conductive trace in the second vertical direction;
thenmounting a semiconductor device on the bump, wherein the semiconductor device extends into the cavity;
electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and
thermally connecting the semiconductor device to the bump, thereby thermally connecting the semiconductor device to the base.
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Abstract
A method of making a semiconductor chip assembly includes providing a bump and a ledge, mounting a first adhesive on the ledge including inserting the bump into an opening in the first adhesive, mounting a conductive layer on the first adhesive including aligning the bump with an aperture in the conductive layer, then flowing the first adhesive between the bump and the conductive layer, solidifying the first adhesive, then providing a heat spreader that includes the bump, a base and the ledge, then mounting a second adhesive on the ledge, mounting a conductive trace that includes a pad and a terminal on the second adhesive, then mounting a semiconductor device on the bump in a cavity in the bump, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
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Citations
30 Claims
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1. A method of making a semiconductor chip assembly, comprising:
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providing a bump, a ledge, a first adhesive and a first conductive layer, wherein the bump defines a cavity that faces in a first vertical direction, covers the cavity in a second vertical direction opposite the first vertical direction, is adjacent to and integral with the ledge, extends vertically from the ledge in the second vertical direction, extends into a first opening in the first adhesive and is aligned with a first aperture in the first conductive layer, the ledge extends laterally from the bump in lateral directions orthogonal to the vertical directions, the first adhesive is mounted on the ledge, is sandwiched between the ledge and the first conductive layer and is non-solidified, and the first conductive layer is mounted on the first adhesive;
thenflowing the first adhesive in the second vertical direction into a gap located in the first aperture between the bump and the first conductive layer; solidifying the first adhesive;
thenproviding a heat spreader that includes the bump, a base and the ledge, wherein the bump is adjacent to the base and extends vertically from the base in the first vertical direction and the base covers the bump in the second vertical direction, extends laterally from the bump and includes a portion of the first conductive layer that is adjacent to the first aperture and spaced from the bump;
thenmounting a conductive trace and a second adhesive on the ledge, wherein the conductive trace includes a pad and a terminal and is located outside the cavity and beyond the ledge in the first vertical direction, the second adhesive is sandwiched between the conductive trace and the ledge and includes a second opening, the bump is aligned with and spaced from the second opening and the ledge is sandwiched between the adhesives and covers the conductive trace in the second vertical direction;
thenmounting a semiconductor device on the bump, wherein the semiconductor device extends into the cavity; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the bump, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of making a semiconductor chip assembly, comprising:
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providing a bump and a ledge, wherein the bump defines a cavity that faces in a first vertical direction, is adjacent to and integral with the ledge and extends vertically from the ledge in a second vertical direction opposite the first vertical direction, the ledge extends laterally from the bump in lateral directions orthogonal to the vertical directions and the cavity is covered by the bump in the second vertical direction; providing a first adhesive, wherein a first opening extends through the first adhesive; providing a first conductive layer, wherein a first aperture extends through the first conductive layer; mounting the first adhesive on the ledge, including inserting the bump into the first opening; mounting the first conductive layer on the first adhesive, including aligning the bump with the first aperture, wherein the first adhesive is sandwiched between the ledge and the first conductive layer and is non-solidified;
thenapplying heat to melt the first adhesive; moving the ledge and the first conductive layer towards one another, thereby moving the bump in the second vertical direction in the first aperture and applying pressure to the molten adhesive between the ledge and the first conductive layer, wherein the pressure forces the molten adhesive to flow in the second vertical direction into a gap located in the first aperture between the bump and the first conductive layer; applying heat to solidify the molten adhesive, thereby mechanically attaching the bump and the ledge to the first conductive layer;
thendepositing a plated layer on the bump, the first adhesive and the first conductive layer, wherein the plated layer covers the bump in the second vertical direction and extends laterally from the bump to the first conductive layer; providing a base that includes a portion of the first conductive layer that is adjacent to the first aperture and spaced from the bump and a portion of the plated layer that is adjacent to the bump, the first conductive layer and the first adhesive; providing a heat spreader that includes the bump, the base and the ledge, wherein the bump is adjacent to the base and extends vertically from the base in the first vertical direction and the base covers the bump in the second vertical direction and extends laterally from the bump;
thenmounting a conductive trace and a second adhesive on the ledge, wherein the conductive trace includes a pad and a terminal and is located outside the cavity and beyond the ledge in the first vertical direction, the second adhesive is sandwiched between the conductive trace and the ledge, a second opening extends through the second adhesive, the bump is aligned with and spaced from the second opening and the ledge is sandwiched between the adhesives and covers the conductive trace in the second vertical direction; mechanically attaching the conductive trace to the ledge using the second adhesive;
thenmounting a semiconductor device on the bump, wherein the semiconductor device extends into the cavity; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the bump, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of making a semiconductor chip assembly, comprising:
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providing a bump and a ledge, wherein the bump defines a cavity that faces in a first vertical direction, is adjacent to and integral with the ledge and extends vertically from the ledge in a second vertical direction opposite the first vertical direction, the ledge extends laterally from the bump in lateral directions orthogonal to the vertical directions and the cavity is covered by the bump in the second vertical direction; providing a first adhesive, wherein a first opening extends through the first adhesive; providing a first substrate that includes a first conductive layer and a first dielectric layer, wherein a first aperture extends through the first substrate; mounting the first adhesive on the ledge, including inserting the bump through the first opening; mounting the first substrate on the first adhesive, including inserting the bump into the first aperture, wherein the first adhesive is sandwiched between the ledge and the first dielectric layer and is non-solidified, the first dielectric layer is sandwiched between the first conductive layer and the first adhesive and is solidified and the first conductive layer is spaced from the first adhesive;
thenapplying heat to melt the first adhesive; moving the ledge and the first conductive layer towards one another, thereby moving the bump in the second vertical direction in the first aperture and applying pressure to the molten adhesive between the ledge and the first substrate, wherein the pressure forces the molten adhesive to flow in the second vertical direction into a gap located in the first aperture between the bump and the first substrate; applying heat to solidify the molten adhesive, thereby mechanically attaching the bump and the ledge to the first substrate;
thendepositing a plated layer on the bump, the first adhesive and the first conductive layer, wherein the plated layer covers the bump in the second vertical direction and extends laterally from the bump to the first conductive layer; providing a base that includes a portion of the first conductive layer that is adjacent to the first dielectric layer and the first aperture and spaced from the bump and a portion of the plated layer that is adjacent to the bump, the first conductive layer and the first adhesive; providing a heat spreader that includes the bump, the base and the ledge, wherein the bump is adjacent to the base and extends vertically from the base in the first vertical direction and the base covers the bump in the second vertical direction and extends laterally from the bump;
thenmounting a second substrate and a second adhesive on the ledge, wherein the second substrate includes a conductive trace and a second dielectric layer, the conductive trace includes a pad and a terminal and is located outside the cavity and beyond the ledge in the first vertical direction, the second dielectric layer is sandwiched between the conductive trace and the second adhesive and is solidified, the second adhesive is sandwiched between the second dielectric layer and the ledge, a second aperture extends through the second substrate, a second opening extends through the second adhesive, the bump is aligned with and spaced from the second opening and the second aperture and the ledge is sandwiched between the adhesives and covers the conductive trace in the second vertical direction; mechanically attaching the second substrate to the ledge using the second adhesive;
thenmounting a semiconductor device on the bump, wherein the semiconductor device extends into the cavity and the bump provides a recessed die paddle and a reflector for the semiconductor device; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the bump, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (22, 23, 24, 25)
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26. A method of making a semiconductor chip assembly, comprising:
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providing a bump and a ledge, wherein the bump defines a cavity that faces in a first vertical direction, is adjacent to and integral with the ledge and extends vertically from the ledge in a second vertical direction opposite the first vertical direction, the ledge extends laterally from the bump in lateral directions orthogonal to the vertical directions and the cavity is covered by the bump in the second vertical direction; providing a first adhesive, wherein a first opening extends through the first adhesive; providing a first substrate that includes a first conductive layer and a first dielectric layer, wherein a first aperture extends through the first substrate; mounting the first adhesive on the ledge, including inserting the bump through the first opening; mounting the first substrate on the first adhesive, including inserting the bump into the first aperture, wherein the first adhesive is sandwiched between the ledge and the first dielectric layer and is non-solidified, the first dielectric layer is sandwiched between the first conductive layer and the first adhesive and is solidified and the first conductive layer is spaced from the first adhesive;
thenapplying heat to melt the first adhesive; moving the ledge and the first conductive layer towards one another, thereby moving the bump in the second vertical direction in the first aperture and applying pressure to the molten adhesive between the ledge and the first substrate, wherein the pressure forces the molten adhesive to flow in the second vertical direction into a gap located in the first aperture between the bump and the first substrate; applying heat to solidify the molten adhesive, thereby mechanically attaching the bump and the ledge to the first substrate;
thendepositing a plated layer on the bump, the first adhesive and the first conductive layer, wherein the plated layer covers the bump in the second vertical direction and extends laterally from the bump to the first conductive layer; providing a base that includes a portion of the first conductive layer that is adjacent to the first dielectric layer and the first aperture and spaced from the bump and a portion of the plated layer that is adjacent to the bump, the first conductive layer and the first adhesive; providing a heat spreader that includes the bump, the base and the ledge, wherein the bump is adjacent to the base and extends vertically from the base in the first vertical direction and the base covers the bump in the second vertical direction and extends laterally from the bump;
thenproviding a solder mask on the ledge, wherein a window extends through the solder mask and the bump is aligned with and spaced from the window; depositing a reflective coating on the bump using the solder mask as a plating mask, thereby providing the bump with a reflective surface finish at the cavity;
thenmounting a second substrate and a second adhesive on the solder mask, thereby mounting the second substrate and the second adhesive on the ledge, wherein the second substrate includes a conductive trace and a second dielectric layer, the conductive trace includes a pad and a terminal and is located outside the cavity and beyond the ledge in the first vertical direction, the second dielectric layer is sandwiched between the conductive trace and the second adhesive and is solidified, the second adhesive is sandwiched between the second dielectric layer and the solder mask, the solder mask is sandwiched between the second adhesive and the ledge, a second aperture extends through the second substrate, a second opening extends through the second adhesive, the bump is aligned with and spaced from the second opening and the second aperture and the ledge is sandwiched between the first adhesive and the solder mask and covers the conductive trace in the second vertical direction; mechanically attaching the second substrate to the solder mask using the second adhesive, thereby mechanically attaching the conductive trace to the ledge;
thenmounting a semiconductor device on the bump, wherein the semiconductor device extends into the cavity and the bump provides a recessed die paddle and a reflector for the semiconductor device; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the bump, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (27, 28, 29, 30)
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Specification