Finned semiconductor device with oxygen diffusion barrier regions, and related fabrication methods
First Claim
1. A method of fabricating a semiconductor device, the method comprising:
- forming a fin arrangement overlying a substrate that contains regions of oxide material, the fin arrangement comprising one or more semiconductor fin structures;
creating an oxygen diffusion barrier in the substrate;
thereafter, conformally forming a layer of insulating material overlying the fin arrangement and overlying and in direct contact with the oxygen diffusion barrier;
conformally forming a layer of metal material overlying the layer of insulating material; and
etching the layer of insulating material and the layer of metal material to form a gate structure transversely overlying the fin arrangement, and overlying the oxygen diffusion barrier, wherein the oxygen diffusion barrier substantially inhibits diffusion of oxygen from the oxide material into the gate structure.
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Accused Products
Abstract
A semiconductor device and related fabrication methods are provided. One exemplary fabrication method forms a fin arrangement overlying an oxide layer, where the fin arrangement includes one or more semiconductor fin structures. The method continues by nitriding exposed portions of the oxide layer without nitriding the one or more semiconductor fin structures, resulting in nitrided portions of the oxide layer. Thereafter, a gate structure is formed transversely overlying the fin arrangement, and overlying the exposed portions of the oxide layer. The nitrided portions of the oxide layer substantially inhibit diffusion of oxygen from the oxide layer into the gate structure.
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Citations
26 Claims
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1. A method of fabricating a semiconductor device, the method comprising:
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forming a fin arrangement overlying a substrate that contains regions of oxide material, the fin arrangement comprising one or more semiconductor fin structures; creating an oxygen diffusion barrier in the substrate; thereafter, conformally forming a layer of insulating material overlying the fin arrangement and overlying and in direct contact with the oxygen diffusion barrier; conformally forming a layer of metal material overlying the layer of insulating material; and etching the layer of insulating material and the layer of metal material to form a gate structure transversely overlying the fin arrangement, and overlying the oxygen diffusion barrier, wherein the oxygen diffusion barrier substantially inhibits diffusion of oxygen from the oxide material into the gate structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of fabricating a semiconductor device, the method comprising:
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providing a semiconductor-on-insulator substrate having an oxide insulator layer and a layer of semiconductor material overlying the oxide insulator layer; forming fin structures from the layer of semiconductor material, each of the fin structures extending above an exposed upper surface of the oxide insulator layer; thereafter, treating exposed portions of the oxide insulator layer to create oxygen diffusion barrier regions near the exposed upper surface of the oxide insulator layer; thereafter, forming a layer of insulating material overlying the fin structures and overlying and in direct contact with the oxygen diffusion barrier regions; forming a layer of metal material overlying the layer of insulating material; and etching the layer of insulating material and the layer of metal material to form a gate structure transversely overlying the fin structures, and overlying the oxygen diffusion barrier regions, wherein the oxygen diffusion barrier regions substantially inhibit diffusion of oxygen from the oxide insulator layer into the gate structure. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A semiconductor device structure comprising:
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a layer of oxide insulation material having an upper surface; semiconductor fin structures formed overlying the layer of oxide insulation material; a gate structure transversely formed overlying the semiconductor fin structures such that base sections of the gate structure overlie the upper surface between adjacent semiconductor fin structures, and wherein the base sections of the gate structure include a layer of insulating material and a layer of metal material overlying the layer of insulating material; and oxygen diffusion barrier regions of the oxide insulation material, located near the upper surface and adjacent and in direct contact with the layer of insulating material of the base sections of the gate structures, wherein the oxygen diffusion barrier regions substantially inhibit diffusion of oxygen from the layer of oxide insulation material into the base sections of the gate structure. - View Dependent Claims (17, 18, 19, 20, 21)
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22. A semiconductor device structure comprising:
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a substrate of semiconductor material; semiconductor fin structures formed from the semiconductor material; oxide isolation regions between the semiconductor fin structures; a gate structure transversely formed overlying the semiconductor fin structures, wherein the gate structure includes a layer of insulating material and a layer of metal material overlying the layer of insulating material, and wherein portions of the layer of insulating material and portions of the layer of metal material are located between the semiconductor fin structures; and oxygen diffusion barrier regions of the oxide isolation regions, wherein the oxygen diffusion barrier regions substantially inhibit diffusion of oxygen from the oxide isolation regions into the gate structure. - View Dependent Claims (23)
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24. A method of fabricating a semiconductor device, the method comprising:
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providing a semiconductor-on-insulator substrate having an oxide insulator layer, a layer of semiconductor material overlying the oxide insulator layer, and an oxygen diffusion barrier between the oxide insulation layer and the layer of semiconductor material; forming fin structures from the layer of semiconductor material; thereafter, forming a layer of insulating material overlying the fin structures and overlying and in direct contact with the oxygen diffusion barrier; forming a layer of metal material overlying the layer of insulating material; and etching the layer of insulating material and the layer of metal material to form a gate structure transversely overlying the fin structures, and overlying the oxygen diffusion barrier, wherein the oxygen diffusion barrier substantially inhibits diffusion of oxygen from the oxide insulator layer into the gate structure. - View Dependent Claims (25, 26)
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Specification