Electronic device and method of manufacturing same

• US 8,356,406 B2
• Filed: 11/13/2007
• Issued: 01/22/2013
• Est. Priority Date: 01/18/2007
• Status: Expired due to Fees

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Kobayashi, Hiroshi
• Primary Examiner(s): Estrada, Angel R
• Assistant Examiner(s): LOPEZ, DIMARY S
• Application Number:
  US11/983,931
• Publication Number:
  US 20090114435A1
• Time in Patent Office: 1,897 Days
• Field of Search: 174/260, 174/259, 174/255, 174/250, 361/737, 361/757, 361/760, 361/807, 361/811, 296/031.5, 296/031.6, 296/23, 298/32, 298/41, 298/42, 298/54, 298/55, 296/030.6, 298/25, 298/29, 438/118, 438/106, 438/126, 438/63, 156/153, 156/154, 156/278, 257/783
• US Class Current: 29/832
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/75251 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/75252 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83203 Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/83862 Heat curing
• CPC Class Codes: H01L 2224/92125 the second connecting process involving a layer connector
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/3511 : Warping
• CPC Class Codes: H05K 1/189 : characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 2201/10977 : Encapsulated connections applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: H05K 2203/0195 : Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 2203/0278 : Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• CPC Class Codes: H05K 3/305 : Affixing by adhesive
• CPC Class Codes: H05K 3/3494 : Heating methods for reflowing of solder using integral heating means H05K1/0212
• CPC Class Codes: H05K 3/381 : by special treatment of the substrate
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49169 : Assembling electrical component directly to terminal or elongated conductor

Abstract

A method of manufacturing an electronic device includes: roughening an underside surface of a film made of a resin, opposite to a mounting surface of the film for mounting a circuit chip; forming a conductor pattern on the mounting surface of the film, thereby obtaining a substrate made of the film where the conductor pattern is formed; and attaching a thermoset adhesive to a conductor-pattern-formed surface of the substrate. The method further includes: mounting the circuit chip to be connected to the conductor pattern on the substrate via the thermoset adhesive; clamping the substrate by a heating apparatus having a presser section and a support section, the presser section abutting the circuit chip mounted on the substrate and the support section abutting the underside surface of the roughened film; and fixing the circuit chip to the conductor pattern by heating and hardening the thermoset adhesive using the heating apparatus.

Claims

1. A method of manufacturing an electronic device, comprising:

roughening an underside surface of a film made of a resin material, which is opposite to a mounting surface of the film, the mounting surface being a surface on which a circuit chip is to be mounted;

forming a conductor pattern on the mounting surface of the film, thereby obtaining a substrate made of the film on which the conductor pattern is formed;

attaching a thermoset adhesive to a surface of the substrate, on which surface the conductor pattern is formed;

mounting the circuit chip to be connected to the conductor pattern on the substrate via the thermoset adhesive;

clamping the substrate by a heating apparatus having a presser section and a support section for heating the thermoset adhesive, such that the presser section abuts on the circuit chip mounted on the substrate and the support section abuts on the underside surface of the film roughened in the roughening; and

fixing the circuit chip to the conductor pattern by heating and hardening the thermoset adhesive using the heating apparatus, wherein

the support section has a surface abutting on the film and being coarser than the film prior to being roughened in the roughening so that frictional force against the film is increased by the roughening.

2. The method of manufacturing an electronic device according to claim 1, wherein the electronic device is an RFID tag that makes the conductor pattern function as a communications antenna and carries out wireless communication via the conductor pattern using the circuit chip.