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Flowable dielectric equipment and processes

  • US 8,357,435 B2
  • Filed: 09/15/2008
  • Issued: 01/22/2013
  • Est. Priority Date: 05/09/2008
  • Status: Active Grant
First Claim
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1. A method of depositing and curing a dielectric material on a substrate, the method comprising the steps of:

  • providing a processing chamber partitioned into a first plasma region and a second plasma region;

    delivering the substrate to the processing chamber, wherein the substrate occupies a portion of the second plasma region;

    forming a first plasma in the first plasma region while forming little or no plasma in the second plasma region, wherein the first plasma does not directly contact with the substrate;

    depositing the dielectric material on the substrate to form a dielectric layer, wherein one or more reactants excited by the first plasma react with a silicon-containing precursor to deposit the dielectric material, wherein the silicon-containing precursor further comprises carbon and is supplied directly to the second plasma region; and

    curing the dielectric layer by forming a second plasma in the second plasma region, wherein one or more carbon-containing species is removed from the dielectric layer.

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