Package of MEMS device and method for fabricating the same

• US 8,357,560 B2
• Filed: 05/18/2009
• Issued: 01/22/2013
• Est. Priority Date: 06/14/2006
• Status: Active Grant

• Current Assignee: Atria Technologies Inc. (Wi-LAN Inc.)
• Original Assignee: Magnachip Semiconductor Limited (Magnachip Semiconductor)
• Inventors: Pyo, Sung-Gyu, Kim, Dong-Joon
• Primary Examiner(s): AU, BAC H
• Application Number:
  US12/453,653
• Publication Number:
  US 20090233395A1
• Time in Patent Office: 1,345 Days
• Field of Search: 438 50- 55, 438/64, 438/68, 438/462
• US Class Current: 438/51
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate

Abstract

A package of a micro-electro-mechanical systems (MEMS) device includes a cap wafer, a plurality of bonding bumps formed over the cap wafer, a plurality of array bumps arrayed on an outer side of the bonding bumps, and an MEMS device wafer over which a plurality of first outer pads are formed corresponding to the array bumps, wherein the array bumps are bonded to the respective outer pads when the cap wafer and the MEMS device wafer are bonded together.

Claims

1. A method for fabricating a package of a micro-electro-mechanical systems (MEMS) device, the method comprising:

forming a MEMS device wafer, the forming of the MEMS device wafer comprising forming a first array mark, the formed MEMS device wafer comprising first outer pads adjacent to the formed first array mark;

forming a cap wafer, the forming of the cap wafer comprising forming a second array mark corresponding to the first array mark, the formed cap wafer comprising bonding bumps, array bumps respectively corresponding to the first outer pads, and inner interconnection lines configured to respectively couple the array bumps to the bonding bumps;

bonding the formed cap wafer to the formed MEMS device wafer based on the formed second array mark corresponding to the formed first array mark and the array bumps respectively corresponding to the first outer pads;

removing the formed second array mark from the bonded cap wafer, the removing of the formed second array mark comprising removing a portion of the cap wafer that is not bonded to the MEMS device wafer; and

removing the formed first array mark from the bonded MEMS device wafer, the removing of the formed first array mark comprising removing a portion of the MEMS device wafer that is not bonded to the cap wafer.

2. The method of claim 1, wherein the forming of the MEMS device wafer further comprises forming an insulation layer on a silicon on insulator substrate, forming a silicon-based layer on the formed insulation layer, forming trenches in the formed silicon-based layer, the forming of the first array mark being based on one of the formed trenches, extending respective bottom portions of the formed trenches to form isolated first supporting layers, isolated second supporting layers, barrier walls, and a moving part, the formed first and second supporting layers being used to support the first outer pads and first inner pads, respectively, and forming metal pads on the formed first and second supporting layers, the formed barrier walls, and the formed moving part.

3. The method of claim 2, wherein the metal pads are formed in a single layer structure including one selected from a first group consisting of Ti, TiW, Ni, Cu, W, Au, Pt, Ag, Al, NiV, and CrV, or a stack structure including one selected from the first group and one selected from a second group consisting of Au, Cu, and NI.

4. The method of claim 2, wherein the metal pads are formed in an under bump metallization (UBM) layer/Cu/solder cap structure or an UBM layer/Au/solder cap structure.

5. The method of claim 4, wherein the under bump metallization (UBM) layer formed in a single layer structure including one selected from a first group consisting of Ti, TiW, Ni, Cu, W, Au;

Pt, Ag, Al, NiV, and CrV, or a stack structure including one selected from the first group and one selected from a second group consisting of Au, Cu, and NI.

6. The method of claim 1, wherein the forming of the cap wafer further comprises forming second inner pads, second outer pads, and the inner interconnection lines on a silicon oxide layer, the formed inner interconnection lines respectively coupling the formed second inner pads to the formed second outer pads, forming an insulation layer covering the formed second inner pads, the formed second outer pads, and the formed inner interconnection lines, planarizing the formed insulation layer based on chemical mechanical polishing (CMP), forming first and second via holes respectively exposing the formed second inner and outer pads, forming first and second plugs respectively filling the formed first and second via holes, simultaneously forming the bonding bumps, the array bumps, and a sealing line, the formed bonding bumps and the formed array bumps being respectively coupled to the formed first and second plugs, and the formed sealing line being between the formed bonding bumps and the formed array bumps, and

wherein the forming of the second array mark comprises etching the formed insulation layer, the formed second array mark being adjacent to the formed array bumps.

7. The method of claim 6, wherein the bonding bumps, the array bumps, and the sealing line are formed in a single layer structure including one selected from a first group consisting of Ti, TiW, Ni, Cu, W, Au, Pt, Ag, Al, NiV, and CrV, or a stack structure including one selected from the first group and one selected from a second group consisting of Au, Cu, and NI.

8. The method of claim 6, wherein the bonding bumps, the array bumps, and the sealing line are formed in an under bump metallization (UBM) layer/Cu/solder cap structure or an UBM layer/Au/solder cap structure.

9. The method of claim 8, wherein the under bump metallization (UBM) layer is formed in a single layer structure including one selected from a first group consisting of Ti, TiW, Ni, Cu, W, Au, Pt, Ag, Al, NiV, and CrV, or a stack structure including one selected from the first group and one selected from a second group consisting of Au, Cu, and NI.

10. The method of claim 6, wherein the formed bonding bumps comprise a thickness of about 10 μ

m to 30 μ

m and a width of about 10 μ

m to 100 μ

m.

11. The method of claim 1, wherein the removing of the formed second array mark comprises grinding a rear surface of the bonded cap wafer.

12. The method of claim 1, wherein the removing of the formed second array mark comprises sawing the bonded cap wafer.

13. The method of claim 1, wherein the removing of the formed first array mark comprises grinding a rear surface of the bonded MEMS device wafer.

14. The method of claim 1, wherein the removing of the formed first array mark comprises sawing the bonded MEMS device wafer.

15. The method of claim 1, wherein the array bumps are arrayed on an outer side of the bonding bumps.

16. The method of claim 1, wherein metal patterns of the formed cap wafer comprise a second inner pad, a second outer pad, and one of the inner interconnection lines.

17. The method of claim 1, wherein the removing of the formed second array mark further comprises removing a portion of the bonded cap wafer that does not include the array bumps, and

wherein the removing of the formed first array mark further comprises removing a portion of the bonded MEMS device wafer that does not include the first outer pads.

18. A method for fabricating a package of a micro-electro-mechanical systems (MEMS) device, the method comprising:

forming a MEMS device wafer, the forming of the MEMS device wafer comprising forming a first array mark, the formed MEMS device wafer comprising first outer pads adjacent to the formed first array mark;

forming a cap wafer, the forming of the cap wafer comprising forming a second array mark corresponding to the first array mark, the formed cap wafer comprising bonding bumps, array bumps respectively corresponding to the first outer pads, and inner interconnection lines configured to respectively couple the array bumps to the bonding bumps;

forming a sealing line between the bonding bumps and the array bumps to encompass the bonding bumps;

bonding the formed cap wafer to the formed MEMS device wafer based on the formed second array mark corresponding to the formed first array mark and the array bumps respectively corresponding to the first outer pads;

removing the formed second array mark from the bonded cap wafer, the removing of the formed second array mark comprising removing a portion of the cap wafer that is not bonded to the MEMS device wafer; and

removing the formed first array mark from the bonded MEMS device wafer, the removing of the formed first array mark comprising removing a portion of the MEMS device wafer that is not bonded to the cap wafer.