Method of fabricating backside illuminated image sensor
First Claim
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1. A method comprising:
- providing a substrate having a front surface, a back surface, an active region, and an alignment region;
forming a detectable fine alignment mark at the front surface of the substrate in the alignment region by performing registration from the back surface using a global alignment mark at the front surface of the substrate in the alignment region; and
processing the active region of the substrate from the back surface by performing registration from the back surface using the detectable fine alignment mark as a reference.
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Abstract
A method for fabricating a backside illuminated image sensor is provided. An exemplary method can include providing a substrate having a front surface and a back surface; forming an alignment mark at the front surface of the substrate, wherein the alignment mark is detectable for alignment from the back surface; and processing the substrate from the back surface by performing registration from the back surface and using the alignment mark as a reference.
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Citations
20 Claims
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1. A method comprising:
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providing a substrate having a front surface, a back surface, an active region, and an alignment region; forming a detectable fine alignment mark at the front surface of the substrate in the alignment region by performing registration from the back surface using a global alignment mark at the front surface of the substrate in the alignment region; and processing the active region of the substrate from the back surface by performing registration from the back surface using the detectable fine alignment mark as a reference. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 16)
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11. A method for fabricating a backside illuminated image sensor comprising:
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providing a substrate having a front surface and a back surface; forming an alignment mark at the front surface of the substrate; forming a material layer free of silicon over the alignment mark, the material layer being substantially planar with the back surface of the substrate, such that the alignment mark is detectable for alignment from the back surface; and processing the substrate from the back surface by performing registration from the back surface using the alignment mark at the front surface of the substrate as a reference. - View Dependent Claims (12, 13, 14, 15, 17)
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18. A method for fabricating a backside illuminated image sensor comprising:
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providing a semiconductor substrate having a first surface and a second surface that is opposite the first surface; forming a first alignment mark, a second alignment mark, and a metal interconnect structure at the first surface of the semiconductor substrate; and forming an organic material layer over the second alignment mark, wherein the second alignment mark is optically visible through the organic material layer from the second surface of the semiconductor substrate. - View Dependent Claims (19, 20)
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Specification