Thin film transistor and manufacturing method thereof
First Claim
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1. A thin film transistor comprising:
- an insulation substrate;
a gate electrode formed on an upper surface of the insulation substrate;
a gate insulating film formed on the upper surface of the insulation substrate and an upper surface of the gate electrode;
an interlayer insulating film formed on an upper surface of the gate insulating film, having an opening which is formed in a formation region of the gate electrode in top view;
a semiconductor film formed on the interlayer insulating film around the opening so as to cover the opening; and
a drain electrode and a source electrode formed on the semiconductor film so as to face each other with the opening disposed therebetween,wherein the interlayer insulating film contains nitrides in an amount larger than that in the gate insulating film, andwherein the semiconductor film includes a microcrystalline semiconductor film or a polycrystalline semiconductor film formed on semiconductor crystalline nuclei which are formed on the gate insulating film and the interlayer insulating film and contain at least Ge.
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Abstract
A bottom gate-type thin film transistor includes a gate insulating film, an interlayer insulating film formed on the gate insulating film, having an opening which is formed in a formation region of a gate electrode, and a semiconductor film formed on the interlayer insulating film so as to cover the opening. The interlayer insulating film contains nitrides in an amount larger than that in the gate insulating film, and the semiconductor film includes a microcrystalline semiconductor film or a polycrystalline semiconductor film formed on semiconductor crystalline nuclei which are formed on the gate insulating film and the interlayer insulating film and contain at least Ge.
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Citations
7 Claims
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1. A thin film transistor comprising:
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an insulation substrate; a gate electrode formed on an upper surface of the insulation substrate; a gate insulating film formed on the upper surface of the insulation substrate and an upper surface of the gate electrode; an interlayer insulating film formed on an upper surface of the gate insulating film, having an opening which is formed in a formation region of the gate electrode in top view; a semiconductor film formed on the interlayer insulating film around the opening so as to cover the opening; and a drain electrode and a source electrode formed on the semiconductor film so as to face each other with the opening disposed therebetween, wherein the interlayer insulating film contains nitrides in an amount larger than that in the gate insulating film, and wherein the semiconductor film includes a microcrystalline semiconductor film or a polycrystalline semiconductor film formed on semiconductor crystalline nuclei which are formed on the gate insulating film and the interlayer insulating film and contain at least Ge. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification