Organic EL device

• US 8,357,961 B2
• Filed: 09/29/2009
• Issued: 01/22/2013
• Est. Priority Date: 10/03/2008
• Status: Active Grant

• Current Assignee: Japan Display Central Incorporated (Japan Display Incorporated)
• Original Assignee: Japan Display Central Incorporated (Japan Display Incorporated)
• Inventors: Hanari, Jun
• Primary Examiner(s): Matthews, Colleen
• Assistant Examiner(s): YUSHINA, GALINA G
• Application Number:
  US12/569,268
• Publication Number:
  US 20100084642A1
• Time in Patent Office: 1,211 Days
• Field of Search: 257/40, 257/80, 257/291, 257/292, 257/443, 257/E51.022, 257/E51.368, 257/59, 257/72, 257/79, 257/290, 257/294, 257/E31.095
• US Class Current: 257/294
• CPC Class Codes: H10K 59/126 Shielding, e.g. light-blocking means over the TFTs
• CPC Class Codes: H10K 59/13 comprising photosensors that control luminance

Abstract

An organic EL device includes an array substrate including an insulating substrate and an organic EL element which is disposed above the insulating substrate, a sealing substrate which is disposed on that side of the array substrate, which faces the organic EL element, and is attached to the array substrate, a light sensor which is provided in the array substrate and includes a light-sensing part which receives incident light via the sealing substrate, and a light-shield layer which is disposed between the light sensor and the sealing substrate, and includes an opening portion which is formed right above the light-sensing part of the light sensor.

Claims

1. An organic EL device comprising:

an array substrate including an insulating substrate and an organic EL element which is disposed above the insulating substrate;

a sealing substrate which is disposed on that side of the array substrate that faces the organic EL element, and is attached to the array substrate;

a light sensor which is provided in the array substrate, is disposed above the insulating substrate, and includes a light-sensing part which receives incident light via the sealing substrate; and

a light-shield layer which is disposed between the light sensor and the sealing substrate, and includes an opening portion which is formed right above the light-sensing part of the light sensor,

wherein the organic EL element is of a top-emission type that emits light from the sealing substrate side,

the organic EL element includes a first electrode which is disposed above the insulating substrate and including a reflective layer, an organic layer which is disposed above the first electrode, and a second electrode which is disposed above the organic layer, and

the light-shield layer is formed of a same material in a same layer as the reflective layer of the first electrode.

2. The organic EL device according to claim 1, wherein the sealing substrate has an outer surface on which a display surface, which displays an image formed by light emitted from the organic EL element, is formed.

3. The organic EL device according to claim 1, wherein the light sensor includes a semiconductor layer which is disposed above the insulating substrate, and an anode and a cathode which are put in contact with the semiconductor layer, and the semiconductor layer, which is exposed from the anode and the cathode, forms the light-sensing part.

4. The organic EL device according to claim 3, wherein the opening portion, which is formed in the light-shield layer, is formed to have a size equal to a size of the light-sensing part or a size smaller than the size of the light-sensing part.

5. The organic EL device according to claim 3, wherein the light-shield layer is formed right above the anode and the cathode of the light sensor and extends toward an outside of the anode and the cathode.

6. An organic EL device comprising:

an insulating substrate;

a first insulation film disposed above the insulating substrate;

a first semiconductor layer disposed on the first insulation film;

a second semiconductor layer which is disposed on the first insulation film and includes a light-sensing part;

a second insulation film which covers the first semiconductor layer and the second semiconductor layer and is disposed on the first insulation film;

a gate electrode which is disposed on the second insulation film right above the first semiconductor layer;

a third insulation film which covers the gate electrode and is disposed on the second insulation film;

a source electrode and a drain electrode which are disposed on the third insulation film and are put in contact with the first semiconductor layer;

an anode and a cathode which are disposed on the third insulation film, are put in contact with the second semiconductor layer, and expose the light-sensing part;

a fourth insulation film which covers the source electrode, the drain electrode, the anode and the cathode, and is disposed on the third insulation film;

a first electrode which includes a reflective layer disposed on the fourth insulation film, and is connected to the drain electrode;

a light-shield layer which is disposed on the fourth insulation film right above the anode and the cathode, is formed of the same material as the reflective layer, and includes an opening portion which is formed right above the light-sensing part;

an organic layer disposed on the first electrode; and

a second electrode disposed on the organic layer.

7. The organic EL device according to claim 6, further comprising a partition wall which is disposed along a peripheral edge of the first electrode and covers the light-shield layer.

8. The organic EL device according to claim 6, wherein the organic layer includes a phosphorescent material.

9. The organic EL device according to claim 6, further comprising a protection film which covers the second electrode and is formed of an inorganic compound.

10. The organic EL device according to claim 9, further comprising a sealing substrate disposed above the protection film.

11. The organic EL device according to claim 10, further comprising a resin layer disposed between the protection film and the sealing substrate.