Parallel fault detection

• US 8,359,494 B2
• Filed: 12/18/2002
• Issued: 01/22/2013
• Est. Priority Date: 12/18/2002
• Status: Active Grant

• Current Assignee: MediaTek, Inc.
• Original Assignee: GlobalFoundries, Inc.
• Inventors: Coss, Elfido Jr., Adams, Ernest D. III, Chong, Robert J., Castle, Howard E., Sonderman, Thomas J., Pasadyn, Alexander J.
• Primary Examiner(s): Riad, Amine
• Application Number:
  US10/323,272
• Publication Number:
  US 20040123182A1
• Time in Patent Office: 3,688 Days
• Field of Search: 714/25, 714/47, 714/52, 438/5, 438/17, 438/10, 324/765, 700/121
• US Class Current: 714/25
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method and an apparatus are provided for parallel fault detection. The method comprises receiving data associated with processing of a workpiece by a first processing tool, receiving data associated with processing of a workpiece by a second processing tool and comparing at least a portion of the received data to a common fault model to determine if a fault associated with at least one of the processing of the workpiece by the first processing tool and processing of the workpiece by the second processing tool occurred.

Claims

1. A method, comprising:

receiving data associated with processing of a workpiece by a first processing tool;

receiving data associated with processing of a workpiece by a second processing tool; and

comparing at least a portion of the received data to a fault model common to both of the processing tools to determine if a fault associated with at least one of the processing of the workpiece by the first processing tool and processing of the workpiece by the second processing tool occurred.

2. The method of claim 1, wherein comparing the at least the portion of the received data comprises comparing the portion of the received data to a plurality of common fault models.

3. The method of claim 2, wherein comparing the portion of the received data to the plurality of common fault models comprises comparing the portion of the received data to the plurality of common fault models representing at least one of process recipe steps or tool states of the first and second processing tools.

4. The method of claim 1, further comprising receiving data associated with processing of a workpiece by a third processing tool and further comprising comparing the received data associated with the processing of the workpiece by the third process tool to the common fault model to determine if a fault occurred.

5. The method of claim 1, wherein receiving the data associated with the processing of the workpiece comprises receiving the data associated with the processing of a semiconductor wafer by the first processing tool.

6. The method of claim 1, wherein receiving the data comprises receiving metrology data associated with the processing of the wafer by the first processing tool and processing of the wafer by the second processing tool.

7. An apparatus, comprising:

an interface adapted to receive trace data associated with processing of workpieces by the first and second processing tools; and

a control unit communicatively coupled to the interface, the control unit adapted to detect a fault associated with at least one of the first and second processing tool based on comparing at least a portion of the received trace data to a fault model representative of an acceptable operational range of at least the first and second processing tools.

8. The apparatus of claim 7, wherein the workpiece is a semiconductor wafer.

9. The apparatus of claim 7, wherein the control unit is adapted to detect the fault based on comparing the portion of the received trace data to a plurality of fault models.

10. The apparatus of claim 9, wherein the plurality of fault models are representative of at least one of process recipe steps and tool states of the first and second processing tool.

11. The apparatus of claim 9, wherein the plurality of fault models have a hierarchical order.

12. The apparatus of claim 7, wherein the interface is further adapted to receive trace data associated with the processing of a workpiece by a third processing tool and wherein the control unit is adapted to detect a fault associated with at least one of the first processing tool, second processing tool, and third processing tool based on comparing at least a portion of the received trace data to the fault model.

13. The apparatus of claim 7, wherein the interface is a network interface and wherein the control unit is further adapted to update the fault model based on at least a portion of the trace data.

14. An apparatus, comprising:

means for receiving data associated with processing of a workpiece by a first processing tool;

means for receiving data associated with processing of a workpiece by a second processing tool; and

means for comparing at least a portion of the received data to a common fault model to determine if a fault associated with at least one of the processing of the workpiece by the first processing tool and processing of the workpiece by the second processing tool occurred.

15. An article comprising one or more machine-readable storage media containing instructions that when executed enable a processor to:

receive data associated with processing of a workpiece by a first processing tool and receive data associated with processing of a workpiece by a second processing tool; and

compare at least a portion of the received data to a fault model to determine if a fault associated with the processing of the workpiece by the first processing tool occurred, wherein the fault model is representative of the first and the second processing tool.

16. The article of claim 15, wherein the instructions when executed enable the processor to compare at least a portion of the received data to the fault model to determine if a fault associated with the processing of the workpiece by the second processing tool occurred.

17. The article of claim 15, wherein the instructions when executed enable the processor to compare the portion of the received data to a plurality of fault models.

18. The article of claim 17, wherein the instructions when executed enable the processor to compare the portion of the received data to the plurality of fault models that are representative of at least one of processing recipe steps and tool states of the first and second processing tools.

19. The article of claim 15, wherein the instructions when executed enable the processor to receive trace data associated with the processing of a workpiece by a third processing tool and to detect a fault associated with the processing of the workpiece by the third processing tool using the fault model.

20. A system, comprising:

a first processing tool adapted to process a wafer;

a second processing tool adapted to process a wafer; and

a fault detection unit adapted to;

receive data associated with the processing of the wafer by the first processing tool and by the second processing tool; and

detect a fault associated with at least one of the first and second processing tool based on comparing at least a portion of the received data to a fault model, wherein the fault model is representative of an acceptable operational range of at least the first and second processing tools.

21. The system of claim 20, wherein an advanced process control framework is coupled between the first and second processing tools and the fault detection unit.