Harsh operating environment RFID tag assemblies and methods of manufacturing thereof
First Claim
1. A radio frequency identification (RFID) tag assembly comprising:
- an RFID semiconductor chip having an antenna interface mounted on a mounting surface of a mounting substrate and having a predetermined operating frequency;
a conductor electrically coupled to the antenna interface of the RFID semiconductor chip and formed on the mounting surface of the mounting substrate;
an antenna electrically coupled to the conductor, the antenna including a first radiating element lying in a first plane and a second radiating element lying in a second plane, the second plane being at an angle relative to the first plane; and
an enclosure having a body defining a cavity with a closed end and an opening, the cavity being dimensioned for receiving the mounting substrate with the RFID semiconductor chip, the conductor, and the first and second radiating elements, the mounting substrate being positioned proximate to the closed end of the cavity;
a reflector defining a reflective plane spaced apart from and substantially parallel to the first plane, said reflector being positioned proximate to the opening of the cavity at a spaced apart distance from the first plane with the reflective plane being a distance of about ¼
of a wavelength of the predetermined operating frequency; and
a seal for closing the opening and sealing the cavity.
1 Assignment
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Accused Products
Abstract
A radio frequency identification (RFID) tag assembly and method of manufacturing the assembly including an RFID semiconductor chip having an antenna interface mounted on a mounting substrate and having a predetermined operating frequency, a conductor coupled to the antenna interface and formed on the mounting substrate, an antenna electrically coupled to the conductor having a first radiating element lying in a first plane and a second radiating element lying in a second plane that is at an angle relative to the first plane, and an enclosure having a body with a cavity dimensioned for receiving the mounting substrate and RFID semiconductor chip, the conductor, and the first and second radiating elements, the mounting substrate being positioned proximate to the closed end of the cavity and a seal for closing the opening and sealing the cavity.
81 Citations
32 Claims
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1. A radio frequency identification (RFID) tag assembly comprising:
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an RFID semiconductor chip having an antenna interface mounted on a mounting surface of a mounting substrate and having a predetermined operating frequency; a conductor electrically coupled to the antenna interface of the RFID semiconductor chip and formed on the mounting surface of the mounting substrate; an antenna electrically coupled to the conductor, the antenna including a first radiating element lying in a first plane and a second radiating element lying in a second plane, the second plane being at an angle relative to the first plane; and an enclosure having a body defining a cavity with a closed end and an opening, the cavity being dimensioned for receiving the mounting substrate with the RFID semiconductor chip, the conductor, and the first and second radiating elements, the mounting substrate being positioned proximate to the closed end of the cavity; a reflector defining a reflective plane spaced apart from and substantially parallel to the first plane, said reflector being positioned proximate to the opening of the cavity at a spaced apart distance from the first plane with the reflective plane being a distance of about ¼
of a wavelength of the predetermined operating frequency; anda seal for closing the opening and sealing the cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A radio frequency identification (RFID) tag assembly comprising:
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means for processing received radio frequency identification requests and generating responses to such requests; means for receiving and transmitting radio frequency energy in a first plane at a predetermined operating frequency between the means for processing and a remote transceiver; means for receiving and transmitting radio frequency energy in a second plane at a predetermined operating frequency between the means for processing and a remote transceiver, the second plane being at an angle relative to the first plane; an enclosure having a body defining a cavity with a closed end and an opening, the cavity being dimensioned to receive and enclose the means for processing and means for receiving and transmitting in a first plane and means for receiving and transmitting in a second plane; means for closing and sealing the cavity of the enclosure including the means for processing and means for receiving and transmitting in a first plane and means for receiving and transmitting in a second plane; and means for reflecting a portion of the radio frequency energy at the predetermined operating frequency between the remote transceiver and both the means for receiving and transmitting in a first plane and the means for receiving and transmitting in a second plane, said means for reflecting including a reflector defining a reflective plane spaced apart from and substantially parallel to the first plane of the means for receiving and transmitting, said reflector being positioned proximate to the opening of the cavity at a spaced apart distance from the first plane of the means for receiving and transmitting with the reflective plane being a distance of about ¼
of a wavelength of the predetermined operating frequency.
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17. A method of manufacturing an RFID tag assembly for use in a harsh operating environment comprising:
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structuring an antenna electrically coupled to an RFID semiconductor chip having an antenna interface with a conductor, the RFID semiconductor chip operating at a predetermined operating frequency, said structuring forming the antenna to have a first radiating element lying in a first plane and a second radiating element lying in a second plane at an angle relative to the first plane; forming an enclosure having a body defining a cavity with a closed end and an opening, the body being formed from a material that does not conduct or absorb a substantial amount of energy at the predetermined operating frequency, the cavity dimensioned for receiving and enclosing the RFID semiconductor chip, conductor and structured antenna positioned proximate to the closed end of the cavity; mounting the RFID semiconductor chip, conductor and first and second radiating elements of the antenna within the cavity proximate to the closed end of the cavity; placing a reflector having a substantially planar reflecting plane spaced apart from and substantially parallel to the first plane, the reflector having a body composed of reflecting material configured for reflecting the predetermined operating frequency, the reflector being mounted proximate to the opening to the cavity;
the reflector defining a reflective plane spaced apart from and substantially parallel to the first plane containing the first radiating element, said reflector being positioned proximate to the opening of the cavity at a spaced apart distance from the first plane containing the first radiating element with the reflective plane being a distance of about ¼
of a wavelength of the predetermined operating frequency; andclosing the opening of the cavity containing the RFID semiconductor chip, conductor, reflector and antenna, said closing including sealing the opening. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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Specification