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Harsh operating environment RFID tag assemblies and methods of manufacturing thereof

  • US 8,360,331 B2
  • Filed: 05/18/2011
  • Issued: 01/29/2013
  • Est. Priority Date: 01/29/2010
  • Status: Active Grant
First Claim
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1. A radio frequency identification (RFID) tag assembly comprising:

  • an RFID semiconductor chip having an antenna interface mounted on a mounting surface of a mounting substrate and having a predetermined operating frequency;

    a conductor electrically coupled to the antenna interface of the RFID semiconductor chip and formed on the mounting surface of the mounting substrate;

    an antenna electrically coupled to the conductor, the antenna including a first radiating element lying in a first plane and a second radiating element lying in a second plane, the second plane being at an angle relative to the first plane; and

    an enclosure having a body defining a cavity with a closed end and an opening, the cavity being dimensioned for receiving the mounting substrate with the RFID semiconductor chip, the conductor, and the first and second radiating elements, the mounting substrate being positioned proximate to the closed end of the cavity;

    a reflector defining a reflective plane spaced apart from and substantially parallel to the first plane, said reflector being positioned proximate to the opening of the cavity at a spaced apart distance from the first plane with the reflective plane being a distance of about ¼

    of a wavelength of the predetermined operating frequency; and

    a seal for closing the opening and sealing the cavity.

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