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Ultra high speed signal transmission/reception

  • US 8,362,481 B2
  • Filed: 04/13/2010
  • Issued: 01/29/2013
  • Est. Priority Date: 05/08/2007
  • Status: Expired due to Fees
First Claim
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1. An integrated circuit package comprising:

  • an integrated circuit chip;

    a device;

    a multilayered structure mounted between the integrated circuit chip and the device, and the integrated circuit chip, the device and the multilayered structure being permanently packaged together, and the multilayered structure comprising;

    signal pathways that transfer signals between the integrated circuit chip and the device; and

    at least one signal pathway comprising a first wireless coupling element in the multilayered structure that is in communication with a second wireless coupling element in the integrated circuit chip, the device, or the multilayered structure.

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