Ultra high speed signal transmission/reception

• US 8,362,481 B2
• Filed: 04/13/2010
• Issued: 01/29/2013
• Est. Priority Date: 05/08/2007
• Status: Expired due to Fees

• Current Assignee: Scanimetrics, Inc.
• Original Assignee: Scanimetrics, Inc.
• Inventors: Sellathamby, Christopher V., Slupsky, Steven H., Moore, Brian
• Primary Examiner(s): TRAN, MINH LOAN
• Application Number:
  US12/759,363
• Publication Number:
  US 20110254123A1
• Time in Patent Office: 1,022 Days
• Field of Search: 257/48, 257/528, 257/531, 257/685, 257/728, 257/E23.067, 257/E23.071, 257/E23.174, 324/762.02, 324/762.03
• US Class Current: 257/48
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: H01L 2224/02166 Collar structures
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05552 in top view
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05567 the external layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2225/06506 Wire or wire-like electrical connections between devices
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06568 : the devices decreasing in size, e.g. pyramidical stack
• CPC Class Codes: H01L 23/48 : Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/49822 : Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/5227 : Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/645 : Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0655 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/10271 : Silicon-germanium [SiGe]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1421 : RF devices
• CPC Class Codes: H01L 2924/1431 : Logic devices
• CPC Class Codes: H01L 2924/1434 : Memory
• CPC Class Codes: H01L 2924/1436 : Dynamic random-access memory [DRAM]
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/1515 : Shape
• CPC Class Codes: H01L 2924/15151 : the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/15174 : in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15321 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16251 : Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

There is provided, in combination, an integrated circuit chip, a device, and a multilayered structure mounted between the integrated circuit chip and the device. The multilayered structure has signal pathways that transfer signals between the integrated circuit chip and the device, and at least one signal pathway with a first wireless coupling element in the multilayered structure that is in communication with a second wireless coupling element in one of the integrated circuit chip, the device, and the multilayered structure.

Claims

1. An integrated circuit package comprising:

an integrated circuit chip;

a device;

a multilayered structure mounted between the integrated circuit chip and the device, and the integrated circuit chip, the device and the multilayered structure being permanently packaged together, and the multilayered structure comprising;

signal pathways that transfer signals between the integrated circuit chip and the device; and

at least one signal pathway comprising a first wireless coupling element in the multilayered structure that is in communication with a second wireless coupling element in the integrated circuit chip, the device, or the multilayered structure.

2. The integrated circuit package of claim 1, wherein the wireless coupling element is an inductor.

3. The integrated circuit package of claim 1, further comprising a third wireless coupling element in another of the integrated circuit chip, the device, and the multilayered structure in communication with the first wireless coupling element or the second wireless coupling element.

4. The integrated circuit package of claim 1, further comprising more than one integrated circuit chip mounted to the multilayered structure.

5. The integrated circuit package of claim 4, wherein at least two integrated circuit chips are stacked above the multilayered structure.

6. The integrated circuit package of claim 5, wherein the at least one signal pathway is a bus arrangement that transfers signals between two or more of the integrated circuit chips.

7. The integrated circuit package of claim 1, wherein the multilayered structure is a multilayered package.

8. The integrated circuit package of claim 1, wherein the multilayered structure is integrally formed with the device.

9. The integrated circuit package of claim 1, wherein the multilayered structure is permanently bonded to the integrated circuit chip and the device.

10. The integrated circuit package of claim 1, wherein the last one signal pathway is a differential signal pathway.

11. An integrated circuit package comprising:

a plurality of integrated circuit chips;

a device;

a multilayered structure mounted between the plurality of integrated circuit chips and the device, and the plurality of integrated circuit chips, the device and the multilayered structure being permanently packaged together with one another,

the multilayered structure comprising;

a plurality of signal pathways for transferring signal between the plurality of integrated circuit chips and the device; and

at least one of the signal pathways comprising a first wireless coupling element of the multilayered structure which communicates with a second wireless coupling element in the plurality of integrated circuit chips, the device, or the multilayered structure.