Ultra high speed signal transmission/reception
First Claim
Patent Images
1. An integrated circuit package comprising:
- an integrated circuit chip;
a device;
a multilayered structure mounted between the integrated circuit chip and the device, and the integrated circuit chip, the device and the multilayered structure being permanently packaged together, and the multilayered structure comprising;
signal pathways that transfer signals between the integrated circuit chip and the device; and
at least one signal pathway comprising a first wireless coupling element in the multilayered structure that is in communication with a second wireless coupling element in the integrated circuit chip, the device, or the multilayered structure.
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Abstract
There is provided, in combination, an integrated circuit chip, a device, and a multilayered structure mounted between the integrated circuit chip and the device. The multilayered structure has signal pathways that transfer signals between the integrated circuit chip and the device, and at least one signal pathway with a first wireless coupling element in the multilayered structure that is in communication with a second wireless coupling element in one of the integrated circuit chip, the device, and the multilayered structure.
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Citations
11 Claims
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1. An integrated circuit package comprising:
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an integrated circuit chip; a device; a multilayered structure mounted between the integrated circuit chip and the device, and the integrated circuit chip, the device and the multilayered structure being permanently packaged together, and the multilayered structure comprising; signal pathways that transfer signals between the integrated circuit chip and the device; and at least one signal pathway comprising a first wireless coupling element in the multilayered structure that is in communication with a second wireless coupling element in the integrated circuit chip, the device, or the multilayered structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An integrated circuit package comprising:
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a plurality of integrated circuit chips; a device; a multilayered structure mounted between the plurality of integrated circuit chips and the device, and the plurality of integrated circuit chips, the device and the multilayered structure being permanently packaged together with one another, the multilayered structure comprising; a plurality of signal pathways for transferring signal between the plurality of integrated circuit chips and the device; and at least one of the signal pathways comprising a first wireless coupling element of the multilayered structure which communicates with a second wireless coupling element in the plurality of integrated circuit chips, the device, or the multilayered structure.
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Specification