Solid state emitter packages including accessory lens

• US 8,362,499 B2
• Filed: 01/18/2011
• Issued: 01/29/2013
• Est. Priority Date: 11/09/2009
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: van de Ven, Antony Paul, Negley, Gerald H.
• Primary Examiner(s): TRAN, MINH LOAN
• Application Number:
  US13/008,898
• Publication Number:
  US 20110133223A1
• Time in Patent Office: 742 Days
• Field of Search: 257/89, 257/98, 257/99, 257/E33.066, 257/E33.072
• US Class Current: 257/89
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 2224/4554 Coating
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/48471 the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12032 Schottky diode

Abstract

A solid state emitter package may include at least one electrically conductive path associated with the solid state emitter package that is not in electrical communication with any solid state emitter of the solid state emitter package, with such electrically conductive path being susceptible to inclusion of a jumper or a control element. A solid state emitter package includes a principally red solid state emitter having peak emissions within 590 nm to 680 nm, a principally blue solid state emitter having peak emissions within 400 nm to 480 nm, and at least one of a common leadframe, common substrate, and common reflector, with the package being devoid of any principally green solid state emitters having peak emissions between 510 nm and 575 nm.

Claims

1. A solid state emitter package comprising:

at least two solid state emitters; and

at least two conductive leads in electrical communication with one another, wherein the at least two conductive leads are not in electrically conductive communication with any solid state emitter of the at least two solid state emitters.

2. The solid state emitter package of claim 1, wherein the at least two conductive leads are disposed on different sides of the solid state emitter package.

3. The solid state emitter package of claim 1, wherein the at least two conductive leads are in electrical communication with at least one control element.

4. The solid state emitter package of claim 3, wherein the at least one control element is adapted to control or affect operation of at least one solid state emitter of the at least two solid state emitters.

5. The solid state emitter package of claim 3, wherein the at least one control element is adapted to control or affect operation of at least one electrically operated element that is spatially separated from the solid state emitter package.

6. The solid state emitter package of claim 3, wherein the at least one control element comprises a sensor.

7. The solid state emitter package of claim 3, wherein the at least one control element comprises any of a switch, a transistor, a current regulating element, and a voltage regulating element.

8. The solid state emitter package of claim 1, comprising a plurality of additional electrical leads, wherein current is independently controllable to each solid state emitter of the at least two solid state emitters using the plurality of additional electrical leads.

9. The solid state emitter package of claim 1, wherein the at least two solid state emitters comprise non-white solid state emitters.

10. The solid state emitter package of claim 1, wherein each solid state emitter of the at least two solid state emitters is arranged with lateral edge spacing of less than about 1.0 mm from at least one adjacent solid state emitter of the at least two solid state emitters.

11. The solid state emitter package of claim 1, wherein the at least two solid state emitters comprises at least two solid state emitters having peak emission wavelengths at least about 50 nm apart.

12. The solid state emitter package of claim 1, wherein the at least two conductive leads are in electrical communication with one another through an electrically conductive path including a jumper.

13. The solid state emitter package of claim 1, wherein the at least two conductive leads are in electrical communication with a sensor.

14. A light emitting device, including the solid state emitter package of claim 1, and at least one solid state emitter that is spatially separated from the solid state emitter package and that is in electrical communication with the at least two conductive leads.

15. A lamp or light fixture comprising the light emitting device of claim 14.

20. The solid state emitter package of claim 1, wherein the at least two second conductive leads are in electrical communication with a sensor.

16. A solid state emitter package comprising:

at least two solid state emitters;

at least two first conductive leads in electrical communication with the plurality of solid state emitters; and

at least two second conductive leads in electrical communication with one another, wherein the at least two second conductive leads are not in electrically conductive communication with any solid state emitter of the at least two solid state emitters.

17. The solid state emitter package of claim 16, wherein the at least two second conductive leads are in electrical communication with at least one control element.

18. The solid state emitter package of claim 17, wherein the at least one control element is adapted to control or affect operation of at least one solid state emitter of the at least two solid state emitters.

19. The solid state emitter package of claim 17, wherein the at least one control element comprises any of a sensor, a switch, a transistor, a current regulating element, and a voltage regulating element.