Chip package and method for forming the same
First Claim
1. A chip package, comprising:
- a substrate having an upper surface and a lower surface and having at least a side surface;
at least a trench extending from the upper surface towards the lower surface and extending from the side surface towards an inner portion of the substrate, wherein a width of the trench near the upper surface is not equal to a width of the trench near the lower surface;
at least an insulating layer located on a sidewall of the trench;
at least a conducting pattern located on the insulating layer, wherein the side surface is separated from the conducting pattern in the trench by a predetermined distance such that a portion of the insulating layer is exposed; and
at least a conducting region electrically connected to the conducting pattern.
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Accused Products
Abstract
An embodiment of the invention provides a chip package which includes a substrate having an upper surface and a lower surface and having at least a side surface, and at least a trench extending from the upper surface towards the lower surface and extending from the side surface towards an inner portion of the substrate, wherein a width of the trench near the upper surface is not equal to a width of the trench near the lower surface, and at least an insulating layer located on a sidewall of the trench, and at least a conducting pattern located on the insulating layer, wherein the side surface is separated from the conducting pattern in the trench by a predetermined distance such that a portion of the insulating layer is exposed, and at least a conducting region electrically connected to the conducting pattern.
19 Citations
10 Claims
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1. A chip package, comprising:
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a substrate having an upper surface and a lower surface and having at least a side surface; at least a trench extending from the upper surface towards the lower surface and extending from the side surface towards an inner portion of the substrate, wherein a width of the trench near the upper surface is not equal to a width of the trench near the lower surface; at least an insulating layer located on a sidewall of the trench; at least a conducting pattern located on the insulating layer, wherein the side surface is separated from the conducting pattern in the trench by a predetermined distance such that a portion of the insulating layer is exposed; and at least a conducting region electrically connected to the conducting pattern. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification