Junction barrier Schottky diode with enforced upper contact structure and method for robust packaging
First Claim
1. A semiconductor junction barrier Schottky (JBS-SKY) diode with enforced upper contact structure (EUCS), the JBS-SKY diode comprising, referencing an X-Y-Z Cartesian coordinate system:
- a semiconductor substrate (SCST) with its major plane lying parallel to the X-Y plane;
an active device zone (ACDZ) atop the SCST and having a built-in JBS-SKY diode with its major device current flowing parallel to the Z-axis;
a peripheral guarding zone (PRGZ) atop the SCST and being located in an adjacent and surrounding relationship to the ACDZ, said PRGZ being structured for an increased breakdown voltage of the built-in JBS-SKY diode;
said ACDZ comprising an active lower semiconductor structure (ALSS) and an enforced active upper contact structure (EUCS) atop the ALSS with the juncture between ALSS and EUCS forming said JBS-SKY diode;
said EUCS comprising;
a top contact metal (TPCM) extending downwards and in electrical conduction with bottom of the EUCS; and
an embedded bottom supporting structure (EBSS), being embedded inside the TPCM and being made of a hard material, said EBSS further extending downwards till the bottom of the EUCSsuch that, upon encountering a downward mechanical bonding force onto the TPCM during later packaging of the JBS-SKY diode, the EBSS acts to enforce the EUCS against an otherwise potential micro cracking of the TPCM degrading the leakage current of the built-in JBS-SKY diode.
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Abstract
A semiconductor junction barrier Schottky (JBS-SKY) diode with enforced upper contact structure (EUCS) is disclosed. Referencing an X-Y-Z coordinate, the JBS-SKY diode has semiconductor substrate (SCST) parallel to X-Y plane. Active device zone (ACDZ) atop SCST and having a JBS-SKY diode with Z-direction current flow. Peripheral guarding zone (PRGZ) atop SCST and surrounding the ACDZ. The ACDZ has active lower semiconductor structure (ALSS) and enforced active upper contact structure (EUCS) atop ALSS. The EUC has top contact metal (TPCM) extending downwards and in electrical conduction with bottom of EUCS; and embedded bottom supporting structure (EBSS) inside TPCM and made of a hard material, the EBSS extending downwards till bottom of the EUCS. Upon encountering bonding force onto TPCM during packaging of the JBS-SKY diode, the EBSS enforces the EUCS against an otherwise potential micro cracking of the TPCM degrading the leakage current of the JBS-SKY diode.
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Citations
23 Claims
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1. A semiconductor junction barrier Schottky (JBS-SKY) diode with enforced upper contact structure (EUCS), the JBS-SKY diode comprising, referencing an X-Y-Z Cartesian coordinate system:
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a semiconductor substrate (SCST) with its major plane lying parallel to the X-Y plane; an active device zone (ACDZ) atop the SCST and having a built-in JBS-SKY diode with its major device current flowing parallel to the Z-axis; a peripheral guarding zone (PRGZ) atop the SCST and being located in an adjacent and surrounding relationship to the ACDZ, said PRGZ being structured for an increased breakdown voltage of the built-in JBS-SKY diode; said ACDZ comprising an active lower semiconductor structure (ALSS) and an enforced active upper contact structure (EUCS) atop the ALSS with the juncture between ALSS and EUCS forming said JBS-SKY diode; said EUCS comprising; a top contact metal (TPCM) extending downwards and in electrical conduction with bottom of the EUCS; and an embedded bottom supporting structure (EBSS), being embedded inside the TPCM and being made of a hard material, said EBSS further extending downwards till the bottom of the EUCS such that, upon encountering a downward mechanical bonding force onto the TPCM during later packaging of the JBS-SKY diode, the EBSS acts to enforce the EUCS against an otherwise potential micro cracking of the TPCM degrading the leakage current of the built-in JBS-SKY diode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of making a semiconductor junction barrier Schottky (JBS-SKY) diode with enforced upper contact structure (EUCS), the JBS-SKY diode comprising, referencing an X-Y-Z Cartesian coordinate system:
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a semiconductor substrate (SCST) parallel to the X-Y plane; an active device zone (ACDZ) atop the SCST and having a built-in JBS-SKY diode; a peripheral guarding zone (PRGZ) atop the SCST and in adjacent and surrounding relationship to the ACDZ; the ACDZ comprising an active lower semiconductor structure (ALSS) and an enforced active upper contact structure (EUCS) atop the ALSS jointly forming the JBS-SKY diode, the EUCS comprising; an embedded bottom supporting structure (EBSS) comprising a two dimensional grid of separated upward pointing EBSS bumps made of a hard insulating material; and a top contact metal (TPCM) extending downwards with the lower portion of TPCM comprising a grid of downward pointing TPCM fingers complementary to and embedding the separated EBSS bumps such that they act to enforce the EUCS against micro cracking of the TPCM during later packaging of the JBS-SKY diode; the method comprising; providing an SCST, partitioning it into an ACDZ and a PRGZ and making a partial JBS-SKY diode atop with; a semiconductor drift layer (SDFL), of N type conductivity atop the SCST, having numerous surface junction barrier pockets (SJBP) of P+ type conductivity built into the SDFL thus forming the ALSS therewith; and a completed PRGZ with numerous peripheral guard rings PPGR built into the SDFL; forming a lower barrier metal layer (LBML) atop the ACDZ; forming the grid of EBSS bumps atop the LMBL; forming an upper barrier metal layer (UBML) atop the LBML; and depositing and patterning the TPCM. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23)
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Specification