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Junction barrier Schottky diode with enforced upper contact structure and method for robust packaging

  • US 8,362,585 B1
  • Filed: 07/15/2011
  • Issued: 01/29/2013
  • Est. Priority Date: 07/15/2011
  • Status: Active Grant
First Claim
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1. A semiconductor junction barrier Schottky (JBS-SKY) diode with enforced upper contact structure (EUCS), the JBS-SKY diode comprising, referencing an X-Y-Z Cartesian coordinate system:

  • a semiconductor substrate (SCST) with its major plane lying parallel to the X-Y plane;

    an active device zone (ACDZ) atop the SCST and having a built-in JBS-SKY diode with its major device current flowing parallel to the Z-axis;

    a peripheral guarding zone (PRGZ) atop the SCST and being located in an adjacent and surrounding relationship to the ACDZ, said PRGZ being structured for an increased breakdown voltage of the built-in JBS-SKY diode;

    said ACDZ comprising an active lower semiconductor structure (ALSS) and an enforced active upper contact structure (EUCS) atop the ALSS with the juncture between ALSS and EUCS forming said JBS-SKY diode;

    said EUCS comprising;

    a top contact metal (TPCM) extending downwards and in electrical conduction with bottom of the EUCS; and

    an embedded bottom supporting structure (EBSS), being embedded inside the TPCM and being made of a hard material, said EBSS further extending downwards till the bottom of the EUCSsuch that, upon encountering a downward mechanical bonding force onto the TPCM during later packaging of the JBS-SKY diode, the EBSS acts to enforce the EUCS against an otherwise potential micro cracking of the TPCM degrading the leakage current of the built-in JBS-SKY diode.

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