Ultra high speed signal transmission/reception interconnect

• US 8,362,587 B2
• Filed: 05/08/2008
• Issued: 01/29/2013
• Est. Priority Date: 05/08/2007
• Status: Expired due to Fees

• Current Assignee: Scanimetrics, Inc.
• Original Assignee: Scanimetrics, Inc.
• Inventors: Sellatmamby, Christopher V., Slupsky, Steven H., Moore, Brian
• Primary Examiner(s): Soward, Ida M
• Application Number:
  US12/599,218
• Publication Number:
  US 20110057291A1
• Time in Patent Office: 1,727 Days
• Field of Search: 257/379, 257/516, 257/528, 257/531, 257/904, 257/E21.022
• US Class Current: 257/531
• CPC Class Codes: G08C 17/04 using magnetically coupled devices
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 23/58 Structural electrical arrangements for semiconductor devices not otherwise provided for , e.g. in combination with batteries H01L23/49593, H01L23/49596 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/1423 Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H04B 5/26 using coils

Abstract

An interconnect for transmitting an electric signal between electronic devices includes a first coupling element electromagnetically coupled to, and immediately juxtaposed to, a second coupling element. The first coupling element is mounted on and is electrically connected to a first electronic device having a first integrated circuit. The second coupling element may be mounted on and electrically connected to the first electronic device, and electrically connected to an interconnect on a second electronic device, or the second coupling element may be mounted on and electrically connected to the second electronic device.

Claims

1. An interconnect for transmitting an electric signal between electronic devices, comprising:

a first inductive coil inductively coupled to, and immediately juxtaposed to, a second inductive coil;

the first inductive coil being mounted on and electrically connected within a layer of a first integrated circuit in a first electronic device, and the second inductive coil being mounted on and electrically connected within a layer of a second integrated circuit in a second electronic device, each of the first electronic device and the second electronic device having a first face and a second face parallel to the layers of the first and second integrated circuits, the first face of the first electronic device being immediately adjacent to the first face of the second electronic device;

the first inductive coil and the second inductive coil being separated by a dielectric barrier;

at least one signal converter connected to at least one of the first inductive coil and the second inductive coil, the signal converter comprising one of a RF carrier wave modulator, a RF carrier wave demodulator, an ultra-wide band pulse to digital modulator and an ultra-wide band pulse to digital demodulator.

2. The interconnect of claim 1, wherein the dielectric barrier comprises at least one of a solid dielectric material and air.

3. The interconnect of claim 1, wherein the dielectric barrier comprises a shield component for shielding against external signals.

4. The interconnect of claim 1, wherein the first inductive coil is embedded in the corresponding electronic device.

5. The interconnect of claim 1, wherein the second inductive coil is recessed from the first face of the second electronic device.

6. The interconnect of claim 1, wherein at least one of the first inductive coil and the second inductive coil is monolithically formed in the corresponding electronic device.

7. The interconnect of claim 6, wherein the RF carrier is a continuous wave.

8. The interconnect of claim 1, wherein at least one of the first inductive coil and the second inductive coil are connected to a differential input or a differential output in the corresponding integrated circuit.

9. The interconnect of claim 1, further comprising a third inductive coil electromagnetically coupled to, and immediately juxtaposed to, a fourth inductive coil, the third inductive coil being electrically connected to the second inductive coil, such that the second and the third inductive coils are interstitial elements.

10. The interconnect of claim 1, wherein the first inductive coil and the second inductive coil are connected to components in the corresponding integrated circuit that permit bi-directional communication.

11. The interconnect of claim 1, wherein the first inductive coil and the second inductive coil are connected by a resistance of more than 100,000 ohms to provide DC restoration.

12. The interconnect of claim 1, wherein the integrated circuit of at least one of the electronic devices is positioned at least partially between the second face and the corresponding inductive coil.

13. The interconnect of claim 1, wherein the first electronic device and the second electronic device are mounted to a common substrate.

14. The interconnect of claim 1, wherein at least one of the first electronic device and the second electronic device are mounted to a movable substrate.