Integrated capacitor with cabled plates
First Claim
1. A capacitor in an integrated circuit (“
- IC”
) comprising;
a distribution grid, associated with a first node of the capacitor, formed in a first patterned metal layer of a plurality of metal layers of the integrated circuit, the plurality of metal layers comprising successive metal layers separated by dielectric layers;
a first vertical conductive filament connected to and extending away from the distribution grid along a first axis in a first direction, wherein the first vertical conductive filament is electrically connected to the first node only through the distribution grid;
a second vertical conductive filament connected to and extending away from the distribution grid along the first axis in a second direction opposite the first direction, wherein the second vertical conductive filament is electrically connected to the first node only through the distribution grid;
a first grid plate, associated with a second node of the capacitor, formed in a second patterned metal layer which is a next successive metal layer adjacent to the first patterned metal layer, the first grid plate surrounding the first vertical conductive filament in the second patterned metal layer; and
a second grid plate, associated with the second node of the capacitor, formed in a third patterned metal layer which is a next successive metal layer adjacent to the second patterned metal layer, the second patterned metal layer disposed between the first patterned metal layer and the third patterned metal layer, the second grid plate surrounding the first vertical conductive filament in the third patterned metal layer.
1 Assignment
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Accused Products
Abstract
A capacitor in an integrated circuit (“IC”) has a distribution grid formed in a first patterned metal layer of the integrated circuit and a first vertical conductive filament connected to and extending away from the distribution grid along a first direction. A second vertical conductive filament is connected to the distribution grid and extends in the opposite direction. First and second grid plates are formed in the metal layers above and below the first patterned metal layer. The grid plates surround the first and second vertical conductive filaments. The distribution grid, first vertical conductive filament and second vertical conductive filament are connected to and form a portion of a first node of the capacitor and the first grid plate and the second grid plate are connected to and form a portion of a second node of the capacitor.
123 Citations
15 Claims
-
1. A capacitor in an integrated circuit (“
- IC”
) comprising;a distribution grid, associated with a first node of the capacitor, formed in a first patterned metal layer of a plurality of metal layers of the integrated circuit, the plurality of metal layers comprising successive metal layers separated by dielectric layers; a first vertical conductive filament connected to and extending away from the distribution grid along a first axis in a first direction, wherein the first vertical conductive filament is electrically connected to the first node only through the distribution grid; a second vertical conductive filament connected to and extending away from the distribution grid along the first axis in a second direction opposite the first direction, wherein the second vertical conductive filament is electrically connected to the first node only through the distribution grid; a first grid plate, associated with a second node of the capacitor, formed in a second patterned metal layer which is a next successive metal layer adjacent to the first patterned metal layer, the first grid plate surrounding the first vertical conductive filament in the second patterned metal layer; and a second grid plate, associated with the second node of the capacitor, formed in a third patterned metal layer which is a next successive metal layer adjacent to the second patterned metal layer, the second patterned metal layer disposed between the first patterned metal layer and the third patterned metal layer, the second grid plate surrounding the first vertical conductive filament in the third patterned metal layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
- IC”
Specification