Electronic devices with extended metallization layer on a passivation layer
First Claim
1. An electronic device, comprising:
- a wafer having a non-active area;
an insulating layer formed on the wafer;
a passivation layer covering the insulating layer;
a first pad positioned in the insulating layer;
an extended metallization layer extending on said passivation layer from said first pad to a position directly above the non-active area of said wafer; and
a through-silicon via positioned in the wafer, in correspondence with said first pad, and in contact with said extended metallization layer.
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Accused Products
Abstract
A method performs electrical testing and assembly of an electronic device on a wafer and comprising a pad made in an oxide layer covered by a passivation layer. The method includes connecting the electronic device to a testing apparatus; providing said electronic device with a metallization layer extending on the passivation layer from the pad to a non-active area of said wafer. The method comprises-performing the electrical testing on wafer of the electronic device by placing a probe of on a portion of the extended metallization layer; performing the cut of said wafer, reducing the extension of the metallization layer to the edge of the electronic device; embedding the device inside a package, forming on the metallization layer an electrical connection configured to connect the metallization layer to a circuit in said package.
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Citations
17 Claims
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1. An electronic device, comprising:
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a wafer having a non-active area; an insulating layer formed on the wafer; a passivation layer covering the insulating layer; a first pad positioned in the insulating layer; an extended metallization layer extending on said passivation layer from said first pad to a position directly above the non-active area of said wafer; and a through-silicon via positioned in the wafer, in correspondence with said first pad, and in contact with said extended metallization layer. - View Dependent Claims (2, 3, 4)
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5. A multichip device, comprising:
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a package that includes a support element; a first electronic device that includes; a substrate having an edge; a metallization layer positioned on the substrate and extended to the edge of the substrate; and an electrical connection positioned on said metallization layer and configured to establish an electrical connection between the metallization layer and the support element; and a second electronic device in stacked configuration with said first electronic device, wherein said metallization layer includes a blind via extending into said passivation layer. - View Dependent Claims (6, 7)
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8. An electronic device, comprising:
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a semiconductor wafer having first and second device areas and a non-active area between the device areas; an insulating layer formed on the device areas and on the non-active area of the wafer; a passivation layer covering the insulating layer and positioned over the device areas and on the non-active area of the wafer; a first pad positioned in the insulating layer and above the first device area; and a first extended metallization layer extending on said passivation layer from said first pad to a first portion of the passivation layer directly above the non-active area of said wafer, the first extended metallization layer not being connected to any conductive structure directly above or in the non-active area of said wafer. - View Dependent Claims (9, 10, 11, 12, 13)
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14. An electronic device, comprising:
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a wafer having a non-active area; a insulating layer formed on the wafer; a passivation layer covering the insulating layer; a first pad positioned in the insulating layer; and an extended metallization layer extending on said passivation layer from said first pad to a position directly above the non-active area of said wafer, wherein said metallization layer includes a blind via extending into said passivation layer. - View Dependent Claims (15, 16, 17)
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Specification