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3D semiconductor device including field repairable logics

  • US 8,362,800 B2
  • Filed: 10/13/2010
  • Issued: 01/29/2013
  • Est. Priority Date: 10/13/2010
  • Status: Active Grant
First Claim
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1. A system comprising:

  • a semiconductor device comprising a first transistor layer and a second transistor layer overlaying the first transistor layer, anda plurality of circuits each performing a comparison between a signal generated by transistors of the first transistor layer and a signal generated by transistors of the second transistor layer;

    wherein said first transistor layer comprises a plurality of flip-flops each having an input and an output,wherein the inputs or the outputs are selectively coupleable to the second transistor layer, and are connectable to either output of a logic circuit constructed by said second transistors or to at least one flip-flop constructed by said second transistors,wherein the plurality of flip-flop inputs or outputs are selectively coupled to the second transistor layer through a plurality of multiplexers, andwherein the at least one flip-flop input or output is selectively coupled to the first transistor layer through the plurality of multiplexers.

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