Multi-directional receiving antenna array

• US 8,362,966 B2
• Filed: 07/20/2011
• Issued: 01/29/2013
• Est. Priority Date: 05/16/2007
• Status: Active Grant

• Current Assignee: AT&T Intellectual Property, Inc. (AT&T, Inc.)
• Original Assignee: AT&T Intellectual Property I LP (AT&T, Inc.)
• Inventors: Tischer, Steven N.
• Primary Examiner(s): MANCUSO, HUEDUNG XUAN CAO
• Application Number:
  US13/187,152
• Publication Number:
  US 20110273359A1
• Time in Patent Office: 559 Days
• Field of Search: 343/810, 343/813, 343820-821, 455/456, 455/457
• US Class Current: 343/810
• CPC Class Codes: H01Q 1/1235 Collapsible supports; Means for erecting a rigid antenna
• CPC Class Codes: H01Q 1/125 Means for positioning
• CPC Class Codes: H01Q 21/0087 Apparatus or processes specially adapted for manufacturing antenna arrays manufacturing waveguides H01P11/00
• CPC Class Codes: H01Q 21/28 Combinations of substantially independent non-interacting antenna units or systems multiple beam H01Q25/00
• CPC Class Codes: H01Q 5/40 Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements
• CPC Class Codes: H01Q 9/285 Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

Techniques for providing multi-directional receiving antenna arrays are described herein. According to an embodiment, an apparatus includes an antenna array including multiple antennas and an orientation system. The orientation system includes multiple orientation marks and multiple alignment marks. At least one of the multiple antennas is configured to be positioned toward a respective station transmitter location based at least partially on an alignment of one of the multiple orientation marks relative to one of the multiple alignment marks.

Claims

1. An apparatus comprising:

a substrate;

a mounting bracket configured to secure the substrate to a surface;

a bow tie antenna, separate from the substrate, mounted to the mounting bracket; and

multiple conductive elements disposed on the substrate, the substrate including reduction lines to indicate non-utilized conductive elements,

wherein the multiple conductive elements are configured to be shaped to yield an antenna array operable to receive very high frequency (VHF) signals, ultra high frequency (UHF) signals, or a combination thereof by being trimmed along the reduction lines on the substrate.

2. The apparatus as recited in claim 1 wherein each of the multiple conductive elements is configured to be rotated to face a station transmitter location.

3. The apparatus as recited in claim 1 wherein the multiple conductive elements are insulated from others of the multiple conductive elements.

4. The apparatus as recited in claim 1 wherein the substrate includes indicia identifying each of the multiple conductive elements.

5. The apparatus as recited in claim 1 wherein the substrate includes one or more bow tie antennas.

6. An apparatus comprising:

a substrate;

multiple conductive elements disposed on the substrate, wherein the multiple conductive elements are configured to be shaped to yield an antenna array operable to receive very high frequency (VHF) signals, ultra high frequency (UHF) signals, or a combination thereof and wherein the substrate is foldable;

a mounting bracket configured to secure the substrate to a surface; and

a bow tie antenna, separate from the substrate, mounted to the mounting bracket.

7. A method of customizing a multi-directional receiving antenna array comprising:

removing non-utilized conductive elements from a substrate that includes multiple conductive elements and respective non-conductive elements insulating the conductive elements;

removing a plurality of non-conductive elements;

folding the substrate to thereby reduce a height of the substrate;

securing the substrate to a surface using a mounting bracket; and

mounting a bow tie antenna, separate from the substrate, to the mounting bracket.

8. The method as recited in claim 7 further comprising removing respective portions of the one or more of the conductive elements by trimming along reduction lines on the substrate.

9. The method as recited in claim 7 further comprising providing indicia identifying each of the multiple.