Passive, low-profile heat transferring system

• US 8,363,411 B2
• Filed: 03/18/2011
• Issued: 01/29/2013
• Est. Priority Date: 03/18/2011
• Status: Active Grant

• Current Assignee: Dish Technologies LLC (Dish Network Corporation)
• Original Assignee: Eldon Technology Limited (Dish Network Corporation)
• Inventors: Stephens, Matthew, Tailor, Bhavesh, Marlow, Stewart, Legg, Robert
• Primary Examiner(s): SMITH, COURTNEY L
• Application Number:
  US13/051,930
• Publication Number:
  US 20120236506A1
• Time in Patent Office: 683 Days
• Field of Search: 361/688, 361701-722, 361751-752, 361/760
• US Class Current: 361/719
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff

Abstract

A media content receiving device, such as a set top box, includes a thermally conductive chassis having at least one panel with opposing surfaces. One of the opposing surfaces is exposed to an ambient environment. A circuit board located within the chassis includes at least one integrated circuit chip. A thermally conductive heat transferring unit is bonded to and in thermal conductive contact with the chip. The heat transferring unit is arranged to transfer heat from the chip to the at least one panel of the chassis while minimizing radiant heat transfer proximate the chip. The heat transferring unit may be biased toward the panel.

Claims

1. A system comprising:

a thermally conductive chassis having at least one panel with a first opposing surface and a second opposing surface, and wherein the first opposing surface is external to the thermally conductive chassis and is exposed to an ambient environment, and wherein the second opposing surface is internal to the thermally conductive chassis;

a circuit board located within the chassis, the circuit board having at least one integrated circuit chip;

a thermal interface material disposed between the at least one integrated circuit chip and the thermally conductive chassis, wherein a first side of the thermal interface material is in thermally conductive contact with the at least one integrated circuit chip, and wherein the thermal interface material is a polymer solder hybrid;

a thermally conductive heat transferring unit disposed between the thermal interface material and the thermally conductive chassis, and wherein a first side of the thermally conductive heat transferring unit is in thermally conductive contact with an opposing second side of the thermal interface material;

a gap filler material located between the heat transferring unit and a top panel of the chassis, wherein the gap filler material is in adhesive contact with a second opposing surface of the top panel, wherein the gap filler material is different from the thermal interface material and wherein the filler material is in thermally conductive contact with the second side of the thermal interface material, and

wherein the thermally conductive heat transferring unit is arranged to transfer heat from the at least one integrated circuit chip to the at least one panel of the chassis while minimizing radiant heat build-up proximate the at least one integrated circuit chip.

2. The system of claim 1, wherein the chassis includes a periphery region having a thickness that is greater than a top panel thickness.

3. The system of claim 1, further comprising:

a biasing member located between the circuit board and a bottom panel of the chassis, the biasing member configured to urge the thermally conductive heat transferring unit into thermally conductive contact with a top panel of the chassis.

4. The system of claim 1, further comprising:

a die being cooled arranged in the at least one integrated circuit chip and wherein the heat transferring unit is also in thermally conductive contact with the die being cooled.

12. The system of claim 1, wherein the first side of the thermally conductive heat transferring unit has at least a first side portion and a second side portion, wherein the first side portion of the thermally conductive heat transferring unit is in adhesive contact with the opposing second side of the thermal interface material, wherein at least the second side portion of the thermally conductive heat transferring unit is polished so as to minimize radiant heat emission from the thermally conductive heat transferring unit proximate to the at least one integrated circuit chip.

13. The system of claim 1, wherein the polished second side portion of the thermally conductive heat transferring unit is not in adhesive contact with the opposing second side of the thermal interface material and is not in contact with the at least one integrated circuit chip.

5. A chassis for a set top box comprising:

a top panel defined by a top panel thickness, an interior surface, and an exterior surface exposed to an ambient environment;

a periphery region of the chassis adjacent to a periphery of the top panel and having a periphery region thickness that is greater than the top panel thickness; and

a heat spreader disposed between the interior surface of the chassis and at least one integrated circuit chip,

wherein the heat spreader is defined by a first surface facing the interior surface of the chassis,

wherein the heat spreader is defined by a second surface opposing the first surface and facing the at least one integrated circuit chip,

wherein at least a portion of the second surface of the heat spreader is polished to minimize radiant heat transfer from the heat spreader towards the at least one integrated circuit chip,

wherein the heat spreader is in thermal contact with the chassis and the at least one integrated circuit chip,

wherein the heat spreader thermally conducts heat generated by the at least one integrated circuit chip into at least one of the top panel or periphery region for dissipation to the ambient environment.

6. The chassis of claim 5, further comprising a gap filling, physically compressible thermally conductive material located between the heat spreader and the top panel, wherein the compressible material is thermally conductive.

7. The chassis of claim 5, further comprising:

a plurality of side panels,

wherein the periphery region extends from the top panel into an edge of each of the plurality of adjacent side panels of the chassis,

wherein the top panel, the periphery region, and the plurality of side panels are formed as an integral, die cast chassis body, and

wherein the greater thickness of the periphery region pulls heat from the top panel.

14. The chassis of claim 5,

wherein the first surface of the heat spreader is in thermal contact with the chassis via an intervening gap filler material that is a thermally conductive, electrically insulating tape having on at least one side an adhesive tack to adhesively affix the thermal interface material to the interior surface of the top panel,

wherein the second surface of the heat spreader is in thermal contact with at least one integrated circuit chip disposed on a circuit board that is inside the chassis via an intervening gap filler material that is a polymer solder hybrid, and

wherein the heat spreader thermally conducts heat generated by the at least one integrated circuit chip into at least one of the top panel or periphery region for dissipation to the ambient environment.

15. The chassis of claim 5, wherein the polished portion of the second side of the thermally conductive heat transferring unit is not in adhesive contact with the opposing second side of the thermal interface material.

16. The chassis of claim 5, wherein the polished portion of the second side of the thermally conductive heat transferring unit is not in contact with the at least one integrated circuit chip.

8. A method for transferring heat out of a media content receiving device, the method comprising:

conductively transferring heat from an integrated circuit chip into a thermal interface material that is in thermally conductive contact with the integrated circuit chip, wherein the thermal interface material is a first material that is a phase change material;

conductively transferring the heat from the thermal interface material into a heat spreader that is in thermally conductive contact with the thermal interface material and that is located proximate the integrated circuit chip;

conductively transferring the heat from the heat spreader to a gap filler material, wherein the gap filler material is a material different from the thermal interface material, and wherein the gap filler material is defined by a first surface and an opposing second surface in thermally conductive contact with the heat spreader,

conductively transferring the heat from the gap filler material to a chassis panel of the media content receiving device, wherein the chassis panel is in thermally conductive contact with the gap filler material, and wherein the first surface of the gap filler material is adhesively affixed to an internal surface of the chassis panel; and

transferring the heat from the chassis panel to an ambient environment.

9. The method of claim 8, wherein conductively transferring the heat from the integrated circuit chip into the heat spreader comprises transferring the heat from a die being cooled arranged on the at least one integrated circuit chip.

10. The method of claim 8, further comprising:

biasing the heat spreader toward the chassis panel.

11. The method of claim 8, wherein conductively transferring the heat from the gap filler material to the chassis panel comprises transferring the heat to a top panel of the chassis.

17. The method of claim 8, wherein the phase change material of the thermal interface material is a polymer solder hybrid.

18. The method of claim 8, wherein the heat spreader is defined by a first side and an opposing second side, wherein the second side of the heat spreader is in contact with the gap filler material, wherein a first portion of the first side of the thermally conductive heat transferring unit is in contact with the thermal interface material, wherein at least a second portion of the first side of the thermally conductive heat transferring unit is polished to minimize radiant heat build-up from the thermally conductive heat transferring unit proximate to the at least one integrated circuit chip.

19. The method of claim 8, wherein the polished portion of the first side of the thermally conductive heat transferring unit is not in contact with the at least one integrated circuit chip.