Assembly to provide thermal cooling

• US 8,363,413 B2
• Filed: 09/13/2010
• Issued: 01/29/2013
• Est. Priority Date: 09/13/2010
• Status: Active Grant

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Paquette, Jeffrey, Cheyne, Scott R., Ellsworth, Joseph R.
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US12/880,350
• Publication Number:
  US 20120063098A1
• Time in Patent Office: 869 Days
• Field of Search: None
• US Class Current: 361/721
• CPC Class Codes: H01L 23/4332 Bellows
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01Q 1/02 Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
• CPC Class Codes: H01Q 21/0087 Apparatus or processes specially adapted for manufacturing antenna arrays manufacturing waveguides H01P11/00
• CPC Class Codes: H01Q 21/06 Arrays of individually energised antenna units similarly polarised and spaced apart
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant

Abstract

In one aspect, an assembly to provide thermal cooling includes a first member having a first channel configured to receive a cooling fluid, a second member having a second channel configured to receive the cooling fluid and a first plurality of hollow and flexible conduits connecting the first and second members. Each of the first plurality of hollow and flexible conduits is configured to provide a path for the cooling fluid to flow between the first and second channels.

Claims

1. An active, electronically scanned array (AESA) panel architecture system comprising:

a first daughter board comprising antenna elements;

a first thermal spreader attached to the antenna elements of the first daughter board;

a second daughter board comprising antenna elements;

a second thermal spreader attached to the antenna elements of the second daughter board;

a board assembly comprising;

a mother board; and

an RF interface board attached to the mother board and in direct contact with the first and second daughter boards;

a cold-plate assembly in direct contact with the first thermal spreader and the second thermal spreader and comprising;

a first cold-plate having a first channel configured to receive a cooling fluid;

a second cold-plate having a second channel configured to receive the cooling fluid and in direct contact with the first thermal spreader;

a third cold-plate having a third channel configured to receive the cooling fluid and in direct contact with the second thermal spreader;

a first plurality of hollow and flexible conduits connecting the first and second cold-plates, each of the first plurality of hollow and flexible conduits configured to provide a path for the cooling fluid to flow between the first and second channels; and

a second plurality of hollow and flexible conduits connecting the first and third cold-plates, each of the second plurality of hollow and flexible conduits configured to provide a path for the cooling fluid to flow between the first and third channels.

2. The system of claim 1 wherein at least one of the first plurality of hollow and flexible conduits is one of a flexible bellow, a hose or a sliding rigid tube.

3. The system of claim 1, further comprising a boss attached to the first member and extending through the daughter card, the thermal spreader to the board assembly.

4. The system of claim 3, wherein the boss includes threads, and further comprising a fastener secures the board assembly by engaging the threads of the boss.

5. The system of claim 1, further comprising a spring disposed between the first and second cold-plates.

6. The system of claim 5, wherein the first plate includes threads, and further comprising a fastener attaching the board assembly to the first cold-plate by engaging the threads on the first cold-plate.