Thick doped adhesive tape to enhance backscatter X-ray detectability

• US 8,366,848 B2
• Filed: 07/01/2011
• Issued: 02/05/2013
• Est. Priority Date: 07/01/2011
• Status: Active Grant

• Current Assignee: The Boeing Co.
• Original Assignee: The Boeing Co.
• Inventors: Toh, Chin H., Engel, James E.
• Primary Examiner(s): Lee, Katarzyna Wyrozebski
• Assistant Examiner(s): Rivera, Joshel
• Application Number:
  US13/174,911
• Publication Number:
  US 20130000814A1
• Time in Patent Office: 585 Days
• Field of Search: 156/60, 156/64, 156/378, 156/379, 156/247, 156/702, 378/86, 378/87
• US Class Current: 156/64
• CPC Class Codes: C09J 11/04 inorganic
• CPC Class Codes: C09J 2301/408 additives as essential feature of the adhesive layer
• CPC Class Codes: C09J 2301/41 additives as essential feature of the carrier layer
• CPC Class Codes: C09J 7/205 characterised by the backing impregnating composition
• CPC Class Codes: C09J 7/21 Paper; Textile fabrics
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1105 Delaminating process responsive to feed or shape at delamination
• CPC Class Codes: Y10T 428/266 of base or substrate
• CPC Class Codes: Y10T 428/28 Web or sheet containing structurally defined element or component and having an adhesive outermost layer
• CPC Class Codes: Y10T 428/2848 Three or more layers

Abstract

Doped adhesive tape is used during the manufacture of aircraft, including positioning marks, covering orifices from debris, allowing locations to be marked. Any doped adhesive tape inadvertently left in sub-assemblies during the manufacturing process can be detected using backscatter X-ray inspection technology. Detection is facilitated in one embodiment by making the tape thicker, to produce an increased mass density, and in another embodiment by adding a dopant comprising an element that is readily detected by the backscatter X-ray technology. The element can be iodine, and can be incorporated into the backing layer or the adhesive layer of the tape during manufacturing. The use of both thicker tape and a dopant can be used in combination to facilitate detection. If the doped adhesive tape is detected after components are assembled using a backscatter X-ray inspection device, then the doped adhesive tape is removed.

Claims

1. A method for using doped adhesive tape comprising:

applying the doped adhesive tape to a first component being assembled, wherein the doped adhesive tape comprises a dopant facilitating detection by a backscatter X-ray inspection process;

assembling the first component with a second component; and

subjecting the assembled first component and the second component to the backscatter X-ray inspection process.

2. The method of claim 1, further comprising:

determining that the doped adhesive tape is present on the first component; and

removing the doped adhesive tape from the first component in response to determining that the doped adhesive tape is present on the first component.

3. The method of claim 2, wherein the doped adhesive tape is not readily visible after the first component and the second component have been assembled.

4. The method of claim 3, wherein the tape is of a thickness greater than 20 mils.

5. The method of claim 3, wherein the dopant comprises iodine.

6. The method of claim 3, where determining that the doped adhesive tape is present on the first component involves visually analyzing an X-ray image of the first component using a backscatter X-ray inspection device.