Fin-like field effect transistor (FinFET) device and method of manufacturing same
First Claim
1. A method comprising:
- providing a semiconductor substrate;
forming a fin structure over the semiconductor substrate, the fin structure at least partially embedded within a dielectric layer and including a first semiconductor material portion over the semiconductor substrate and a second semiconductor material portion over the first semiconductor material portion;
forming a gate structure over a portion of the fin structure and the dielectric layer, such that the gate structure traverses the fin structure, thereby separating a source region and a drain region of the fin structure, wherein the source and drain regions of the fin structure define a channel therebetween;
after forming the gate structure, removing the second semiconductor material portion from the source and drain regions of the fin structure, wherein removing the second semiconductor material portion from the source and drain regions of the fin structure includes forming a trench in the source and drain regions of the fin structure, the trench extending below a top surface of the dielectric layer; and
after removing the second semiconductor material portion, forming a third material portion in the source and drain regions of the fin structure.
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0 Petitions
Accused Products
Abstract
A FinFET device and method for fabricating a FinFET device is disclosed. An exemplary method includes providing a semiconductor substrate; forming a fin structure over the semiconductor substrate, the fin structure including a first material portion over the semiconductor substrate and a second material portion over the first material portion; forming a gate structure over a portion of the fin structure, such that the gate structure traverses the fin structure, thereby separating a source region and a drain region of the fin structure, wherein the source and drain regions of the fin structure define a channel therebetween; removing the second material portion from the source and drain regions of the fin structure; and after removing the second material portion, forming a third material portion in the source and drain regions of the fin structure.
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Citations
19 Claims
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1. A method comprising:
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providing a semiconductor substrate; forming a fin structure over the semiconductor substrate, the fin structure at least partially embedded within a dielectric layer and including a first semiconductor material portion over the semiconductor substrate and a second semiconductor material portion over the first semiconductor material portion; forming a gate structure over a portion of the fin structure and the dielectric layer, such that the gate structure traverses the fin structure, thereby separating a source region and a drain region of the fin structure, wherein the source and drain regions of the fin structure define a channel therebetween; after forming the gate structure, removing the second semiconductor material portion from the source and drain regions of the fin structure, wherein removing the second semiconductor material portion from the source and drain regions of the fin structure includes forming a trench in the source and drain regions of the fin structure, the trench extending below a top surface of the dielectric layer; and after removing the second semiconductor material portion, forming a third material portion in the source and drain regions of the fin structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method comprising:
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providing a semiconductor substrate; forming a first fin structure and a second fin structure over the semiconductor substrate, the first and second fin structures including a first material portion and a second material portion, wherein the first and second fin structures each include a source region, a drain region, and a channel defined between the source and drain regions; forming a first trench in the source and drain regions of the first fin structure; forming a second trench in the source and drain regions of the second fin structure, wherein the forming the second trench in the source and drain regions of the second fin structure includes partially removing the second material portion from the source and drain regions of the second fin structure; forming a third material portion in the first trench of the first fin structure; and forming a fourth material portion in the second trench of the second fin structure, wherein the forming the fourth material portion in the second trench includes epitaxially growing a semiconductor material over a remaining second material portion. - View Dependent Claims (11, 12, 13, 19)
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14. A method comprising:
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forming a fin over a semiconductor substrate and at least partially embedded within a dielectric layer, the fin including a first semiconductor material portion disposed over the semiconductor substrate and a second semiconductor material portion disposed over the first semiconductor material portion; forming a gate structure over the fin, such that the gate structure traverses the fin, thereby separating a source region and a drain region of the fin, wherein the source and drain regions of the fin define a channel region therebetween; removing the second semiconductor material portion from the source and drain regions of the fin to form a trench extending below a top surface of the dielectric layer in the source and drain regions of the fin; and forming a third semiconductor material portion in the source and drain regions of the fin. - View Dependent Claims (15, 16, 17, 18)
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Specification