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Partitioned through-layer via and associated systems and methods

  • US 8,367,538 B2
  • Filed: 10/06/2010
  • Issued: 02/05/2013
  • Est. Priority Date: 08/31/2007
  • Status: Active Grant
First Claim
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1. A method for manufacturing a substrate, the method comprising:

  • forming a hole through a non-conductive layer, the hole including a sidewall;

    after forming the hole, depositing a conductive layer on at least a portion of the sidewall and at least one of a top-side and a bottom-side of the non-conductive layer; and

    forming partitions within the hole that separate the conductive layer into a first interconnect within the hole and a second interconnect within the hole that is electrically isolated form the first interconnect.

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