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Low profile electrical interposer of woven structure and method of making same

  • US 8,367,942 B2
  • Filed: 10/27/2009
  • Issued: 02/05/2013
  • Est. Priority Date: 10/27/2009
  • Status: Expired due to Fees
First Claim
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1. An electrical interposer for connecting two electronic devices, comprising:

  • a plurality of first insulating cores with undulating structure extending in a first direction, each first core having first peaks and first valleys alternately arranged in the first direction, each of the first peaks being electrically connected with a corresponding neighboring first valley through conductive member on the outer surface of the first insulating cores but said first peaks being insulated from each other; and

    a plurality of second insulating cores with undulating structure extending in a second direction angular with the first direction, each second core having second peaks and second valleys alternately arranged in the second direction;

    each of the second peaks being electrically connected with a corresponding neighboring second valley through conductive member on the outer surface of the second insulating cores but said second peaks being insulated from each other;

    wherein the first cores and the second cores interlace with each other to reach a woven structure with the first peaks and the second peaks jointly constituting an upper interface, and the first valleys and the second valleys jointly constituting a lower interface.

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