III-nitride materials including low dislocation densities and methods associated with the same
First Claim
1. A semiconductor structure comprising:
- a III-nitride material region having a screw dislocation density of less than about 108/cm2 throughout the entire volume of the III-nitride material region and having an edge dislocation density of greater than about 108/cm2.
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Abstract
Semiconductor structures including one, or more, III-nitride material regions (e.g., gallium nitride material region) and methods associated with such structures are provided. The III-nitride material region(s) advantageously have a low dislocation density and, in particular, a low screw dislocation density. In some embodiments, the presence of screw dislocations in the III-nitride material region(s) may be essentially eliminated. The presence of a strain-absorbing layer underlying the III-nitride material region(s) and/or processing conditions can contribute to achieving the low screw dislocation densities. In some embodiments, the III-nitride material region(s) having low dislocation densities include a gallium nitride material region which functions as the active region of the device. The low screw dislocation densities of the active device region (e.g., gallium nitride material region) can lead to improved properties (e.g., electrical and optical) by increasing electron transport, limiting non-radiative recombination, and increasing compositional/growth uniformity, amongst other effects.
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Citations
6 Claims
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1. A semiconductor structure comprising:
a III-nitride material region having a screw dislocation density of less than about 108/cm2 throughout the entire volume of the III-nitride material region and having an edge dislocation density of greater than about 108/cm2. - View Dependent Claims (2, 3, 4, 5, 6)
Specification