Trench MOS device with Schottky diode and method for manufacturing same
First Claim
1. A semiconductor device comprising:
- a first semiconductor region of a first conductivity type and a first conductivity concentration;
a first trench including a metal layer in contact with said first semiconductor region to form a metal-semiconductor junction;
a second semiconductor region adjacent to said first semiconductor region and the metal-semiconductor junction, the second semiconductor region having a second conductivity type and a second conductivity concentration, wherein said second semiconductor region forms a PN junction with said first semiconductor region; and
a third semiconductor region of said second semiconductor type and said second semiconductor concentration that is adjacent to said second semiconductor region and said metal layer and extends below a portion of a bottom of said first trench,wherein said third semiconductor region extends said PN junction to form an extended PN junction portion, andwherein said PN junction curves upward at a first angle toward the first trench, said extended PN junction portion curves upward at a second angle to the first trench, and said second angle is different from said first angle.
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Accused Products
Abstract
In one embodiment the present invention includes a semiconductor device. The semiconductor device comprises a first semiconductor region, a second semiconductor region and a trench region. The first semiconductor region is of a first conductivity type and a first conductivity concentration. The trench region includes a metal layer in contact with the first semiconductor region to form a metal-semiconductor junction. The second semiconductor region is adjacent to the first semiconductor region that has a second conductivity type and a second conductivity concentration. The second semiconductor region forms a PN junction with the first semiconductor region, and the trench region has a depth such that the metal-semiconductor junction is proximate to the PN junction.
10 Citations
12 Claims
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1. A semiconductor device comprising:
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a first semiconductor region of a first conductivity type and a first conductivity concentration; a first trench including a metal layer in contact with said first semiconductor region to form a metal-semiconductor junction; a second semiconductor region adjacent to said first semiconductor region and the metal-semiconductor junction, the second semiconductor region having a second conductivity type and a second conductivity concentration, wherein said second semiconductor region forms a PN junction with said first semiconductor region; and a third semiconductor region of said second semiconductor type and said second semiconductor concentration that is adjacent to said second semiconductor region and said metal layer and extends below a portion of a bottom of said first trench, wherein said third semiconductor region extends said PN junction to form an extended PN junction portion, and wherein said PN junction curves upward at a first angle toward the first trench, said extended PN junction portion curves upward at a second angle to the first trench, and said second angle is different from said first angle. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method comprising:
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forming a first semiconductor region of a first conductivity type and a first conductivity concentration within a second semiconductor region of a second conductivity type and a second conductivity concentration; etching a first trench through said first semiconductor region; forming a third semiconductor region of a first conductivity type at a bottom left portion and a bottom right portion of said first trench in said second semiconductor region, adding a metal layer within said first trench such that said metal layer contacts said second semiconductor region to form a metal-semiconductor junction, wherein said metal-layer contacts said second semiconductor region and said third semiconductor region between said bottom left portion and said bottom right portion of said first trench; wherein said first semiconductor region forms a PN junction with said second semiconductor region, wherein said third semiconductor region extends said PN junction to form an extended PN junction portion, and wherein said PN junction curves upward at a first angle toward the first trench, said extended PN junction portion curves upward at a second angle to the first trench, and said second angle is different from said first angle, and wherein said first trench has a depth such that said metal-semiconductor junction is adjacent to said PN junction. - View Dependent Claims (9, 10, 11, 12)
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Specification