Wafer scale package for high power devices
First Claim
Patent Images
1. A wafer scale package comprising:
- a plurality of laterally spaced semiconductor packages separated by separation streets;
each of said semiconductor packages comprising a semiconductor die having first and second parallel surfaces and a support can;
said support can comprising an insulation body having top and bottom parallel surfaces with corresponding top and bottom conductive layers;
said top conductive layer having a depression therein defining a web surface and an upstanding rim portion extending around at least a portion of the periphery said web surface;
said die being disposed in said depression, said insulation body being severable in said separation streets to separate said semiconductor packages from one another.
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Abstract
A semiconductor device package is formed of DBC in which thinned MOSgated and/or diode die are soldered to the bottom of an etched depression in the upper conductive layer. A via in the insulation layer of the DBC is filled with a conductive material to form a resistive shunt. Plural packages may be formed in a DBC card and may be separated individually or in clusters. The individual packages are mounted in various arrays on a support DBC board and heat sink. Integrated circuits may be mounted on the assembly and connected to the die for control of the die conduction.
17 Citations
11 Claims
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1. A wafer scale package comprising:
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a plurality of laterally spaced semiconductor packages separated by separation streets; each of said semiconductor packages comprising a semiconductor die having first and second parallel surfaces and a support can; said support can comprising an insulation body having top and bottom parallel surfaces with corresponding top and bottom conductive layers; said top conductive layer having a depression therein defining a web surface and an upstanding rim portion extending around at least a portion of the periphery said web surface; said die being disposed in said depression, said insulation body being severable in said separation streets to separate said semiconductor packages from one another. - View Dependent Claims (2, 3, 4, 5)
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6. A wafer scale package comprising:
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a plurality of laterally spaced semiconductor packages separated by separation streets; each of said semiconductor packages comprising a semiconductor die having first and second surfaces and first and second electrodes on each of said first and second surfaces, respectively, and a support can for supporting said semiconductor die; said support can comprising an insulation body having top and bottom parallel surfaces and top and bottom conductive layers on said top and bottom surfaces respectively; said top conductive layer having a depression therein defining a web surface and a rim portion, said die being disposed in said depression with said second electrode mechanically and electrically fixed to said web surface; said insulation body being severable in said separation streets to separate said semiconductor packages from one another. - View Dependent Claims (7, 8, 9, 10, 11)
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Specification