×

Method and system for hybrid integration of an opto-electronic integrated circuit

  • US 8,368,995 B2
  • Filed: 03/30/2011
  • Issued: 02/05/2013
  • Est. Priority Date: 10/13/2009
  • Status: Active Grant
First Claim
Patent Images

1. An opto-electronic integrated circuit comprising:

  • a substrate comprising a silicon material;

    a set of optical transmitters, each comprising;

    a gain medium coupled to the substrate, wherein the gain medium includes a compound semiconductor material;

    an optical modulator optically coupled to the gain medium;

    a waveguide disposed in the substrate and optically coupled to the gain medium;

    a first wavelength selective element characterized by a first reflectance spectrum and disposed in the substrate;

    a second wavelength selective element characterized by a second reflectance spectrum and disposed in the substrate;

    an optical coupler disposed in the substrate and joining the first wavelength selective element, the second wavelength selective element, and the waveguide; and

    an output mirror;

    a set of optical receivers, each comprising;

    a waveguide disposed in the silicon material;

    an optical detector bonded to the silicon material; and

    a bonding region disposed between the silicon material and the optical detector, wherein the bonding region comprises;

    a metal-assisted bond at a first portion of the bonding region, wherein the metal-assisted bond includes an interface layer positioned between the silicon material and the optical detector; and

    a direct semiconductor-semiconductor bond at a second portion of the bonding region; and

    control electronics disposed in the substrate and electrically coupled to the set of optical transmitters and the set of optical receivers.

View all claims
  • 3 Assignments
Timeline View
Assignment View
    ×
    ×