Method and system for hybrid integration of an opto-electronic integrated circuit
First Claim
1. An opto-electronic integrated circuit comprising:
- a substrate comprising a silicon material;
a set of optical transmitters, each comprising;
a gain medium coupled to the substrate, wherein the gain medium includes a compound semiconductor material;
an optical modulator optically coupled to the gain medium;
a waveguide disposed in the substrate and optically coupled to the gain medium;
a first wavelength selective element characterized by a first reflectance spectrum and disposed in the substrate;
a second wavelength selective element characterized by a second reflectance spectrum and disposed in the substrate;
an optical coupler disposed in the substrate and joining the first wavelength selective element, the second wavelength selective element, and the waveguide; and
an output mirror;
a set of optical receivers, each comprising;
a waveguide disposed in the silicon material;
an optical detector bonded to the silicon material; and
a bonding region disposed between the silicon material and the optical detector, wherein the bonding region comprises;
a metal-assisted bond at a first portion of the bonding region, wherein the metal-assisted bond includes an interface layer positioned between the silicon material and the optical detector; and
a direct semiconductor-semiconductor bond at a second portion of the bonding region; and
control electronics disposed in the substrate and electrically coupled to the set of optical transmitters and the set of optical receivers.
3 Assignments
0 Petitions
Accused Products
Abstract
An opto-electronic integrated circuit (OEIC) includes an SOI substrate, a set of composite optical transmitters, a set of composite optical receivers, and control electronics disposed in the substrate and electrically coupled to the set of composite optical transmitters and receivers. Each of the composite optical transmitters includes a gain medium including a compound semiconductor material and an optical modulator. Each of the composite optical receivers includes a waveguide disposed in the SOI substrate, an optical detector bonded to the SOI substrate, and a bonding region disposed between the SOI substrate and the optical detector. The bonding region includes a metal-assisted bond at a first portion of the bonding region and a direct semiconductor-semiconductor bond at a second portion of the bonding region. The OEIC also includes control electronics disposed in the SOI substrate and electrically coupled to the set of composite optical transmitters and the set of composite optical receivers.
92 Citations
20 Claims
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1. An opto-electronic integrated circuit comprising:
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a substrate comprising a silicon material; a set of optical transmitters, each comprising; a gain medium coupled to the substrate, wherein the gain medium includes a compound semiconductor material; an optical modulator optically coupled to the gain medium; a waveguide disposed in the substrate and optically coupled to the gain medium; a first wavelength selective element characterized by a first reflectance spectrum and disposed in the substrate; a second wavelength selective element characterized by a second reflectance spectrum and disposed in the substrate; an optical coupler disposed in the substrate and joining the first wavelength selective element, the second wavelength selective element, and the waveguide; and an output mirror; a set of optical receivers, each comprising; a waveguide disposed in the silicon material; an optical detector bonded to the silicon material; and a bonding region disposed between the silicon material and the optical detector, wherein the bonding region comprises; a metal-assisted bond at a first portion of the bonding region, wherein the metal-assisted bond includes an interface layer positioned between the silicon material and the optical detector; and a direct semiconductor-semiconductor bond at a second portion of the bonding region; and control electronics disposed in the substrate and electrically coupled to the set of optical transmitters and the set of optical receivers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An opto-electronic integrated circuit comprising:
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an SOI substrate including a silicon substrate, an oxide layer disposed on the silicon substrate, and a silicon layer disposed on the oxide layer; a set of composite optical transmitters, each of the composite optical transmitters including; a waveguide disposed in the silicon layer; a gain medium optically coupled to the silicon layer, wherein the gain medium includes a compound semiconductor material; an output mirror; and an optical modulator optically coupled to the output mirror; and a set of composite optical receivers, each of the composite optical receivers including; a waveguide disposed in the silicon layer; an optical detector bonded to the silicon layer, wherein the optical detector includes a compound semiconductor material; and a bonding region disposed between the silicon layer and the optical detector, wherein the bonding region comprises; a metal-assisted bond at a first portion of the bonding region, wherein the metal-assisted bond includes an interface layer positioned between the silicon layer and the optical detector; and a direct semiconductor-semiconductor bond at a second portion of the bonding region; and control electronics disposed in the substrate and electrically coupled to the set of composite optical transmitters and the set of composite optical receivers. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification