Printing plate and method for fabricating the same

• US 8,372,749 B2
• Filed: 03/09/2011
• Issued: 02/12/2013
• Est. Priority Date: 11/04/2004
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: Kim, Chul Ho
• Primary Examiner(s): Norton, Nadine
• Assistant Examiner(s): Dahimene, Mahmoud
• Application Number:
  US13/044,216
• Publication Number:
  US 20110159689A1
• Time in Patent Office: 706 Days
• Field of Search: 216/41, 430/312, 438/674, 257/E21.158
• US Class Current: 438/674
• CPC Class Codes: B41C 1/02 Engraving; Heads therefor recording on record carriers, heads therefor G11B
• CPC Class Codes: B41N 1/006 made entirely of inorganic materials other than natural stone or metals, e.g. ceramics, carbide materials, ferroelectric materials
• CPC Class Codes: B41N 1/12 non-metallic other than stone , e.g. printing plates or foils comprising inorganic materials in an organic matrix B41N1/003, B41N1/006 take precedence
• CPC Class Codes: H10K 71/13 using printing techniques, e.g. ink-jet printing or screen printing
• CPC Class Codes: H10K 71/611 using printing deposition, e.g. ink jet printing
• CPC Class Codes: Y10T 428/2457 Parallel ribs and/or grooves

Abstract

A printing plate and method for fabricating the same is disclosed. A metal layer is first formed on a glass substrate. The metal layer is then patterned in a predetermined shape. The glass substrate is next etched to a predetermined depth using the patterned metal layer as a mask and the metal layer removed. If necessary, additional metal layers have the same or different patterns may be formed on the glass substrate and the glass substrate etched after each metal layer is formed thereon until a desired etching depth in the glass is achieved.

Claims

1. A method of fabricating at least one of a semiconductor device or an LCD device, the method comprising:

providing a printing plate containing a first glass substrate with a plurality of grooves etched in a predetermined shape on the surface;

printing a predetermined material on a surface of the printing plate by rolling a first printing roll along the surface of the printing plate;

transferring the predetermined material in a desired pattern on the surface of the printing plate to a second printing roll by rolling the second printing roll along the surface of the printing plate; and

printing the predetermined material in the desired pattern on a surface of a second substrate by rolling the second printing roll on the second substrate,

wherein the providing the printing plate comprises;

forming a first metal layer on the first glass substrate including a first region and a second region apart from the first region;

patterning the first metal layer in a predetermined shape;

dry etching the first glass substrate to a first depth using a patterned first metal layer as a first etch mask;

removing the patterned first metal layer, thereby performing one cycle, wherein a number of repetitions of the one cycle depends on a thickness of the first metal layer and an etching depth of the first glass substrate;

forming a second metal layer on the etched first glass substrate;

patterning the second metal layer in the same area as the patterned first metal layer; and

dry etching the etched first glass substrate to a second depth formed within the same region as the first depth using the patterned second metal layer as a second etch mask identical to the first etch mask,

wherein the first and second metal layers are etched when the first glass substrate is etched, an etching rate of the first and the second metal layer is lower than the etching rate of the first glass substrate and the etching ratio of the first and the second metal layer to the first glass substrate is about 1;

4 to about 1;

10.

2. The method of claim 1, wherein the second substrate comprises a glass substrate.

3. The method of claim 1, wherein the first printing roll is entirely coated with the predetermined material prior to rolling the first printing roll along the surface of the printing plate.

4. The method of claim 1, wherein the second substrate is an LCD substrate.

5. The method of claim 1, wherein the second substrate is a semiconductor substrate.

6. A method of fabricating at least one of a semiconductor device or an LCD device, the method comprising:

providing a printing plate containing a first substrate with a plurality of grooves etched in a predetermined shape on the surface, wherein at least one of grooves having a wider width than that of the other grooves has deeper depth than that of the other grooves;

printing a predetermined material on a surface of the printing plate by rolling a first printing roll along the surface of the printing plate;

transferring the predetermined material in a desired pattern on the surface of the printing plate to a second printing roll by rolling the second printing roll along the surface of the printing plate; and

printing the predetermined material in the desired pattern on a surface of a second substrate by rolling the second printing roll on the second substrate,

wherein the providing the printing plate comprises;

forming a first metal layer on a glass substrate including a first region and a second region apart from the first region;

patterning the first metal layer in a predetermined shape to expose the glass substrate of the first region and the second region;

dry etching the glass substrate of the first region and the second region to a first depth using a patterned first metal layer as a first etch mask;

removing the patterned first metal layer, thereby performing one cycle, wherein a number of repetitions of the one cycle depends on a thickness of the first metal layer and an etching depth of the glass substrate;

forming a second metal layer on the etched glass substrate;

patterning the second metal layer to expose the glass substrate of the first region excluding the second region;

dry etching the etched glass substrate of the first region excluding the second region to a second depth using a patterned second metal layer as a second etch mask;

wherein the first and second metal layers are etched when the glass substrate is etched, an etching rate of the first and the second metal layer is lower than the etching rate of the glass substrate and the etching ratio of the first and the second metal layer to the glass substrate is about 1;

4 to about 1;

10.

7. The method of claim 6, wherein the first depth of the second region is different from the second depth of the first region.

8. The method of claim 6, wherein the first printing roll is entirely coated with the predetermined material prior to rolling the first printing roll along the surface of the printing plate.