Sensor device having a structure element
First Claim
Patent Images
1. A sensor device, comprising:
- a first semiconductor chip having a sensing region;
a carrier; and
a structure element arranged between the first semiconductor chip and the carrier, the structure element having an inlet on a first side of the structure element and an outlet on a second side of the structure element, the second side perpendicular to the first side, and the outlet being in fluid connection with the inlet and the sensing region.
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Abstract
A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element.
56 Citations
12 Claims
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1. A sensor device, comprising:
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a first semiconductor chip having a sensing region; a carrier; and a structure element arranged between the first semiconductor chip and the carrier, the structure element having an inlet on a first side of the structure element and an outlet on a second side of the structure element, the second side perpendicular to the first side, and the outlet being in fluid connection with the inlet and the sensing region. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A sensor device, comprising:
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a first semiconductor chip having a sensing region; a carrier; and a porous structure element arranged between the first semiconductor chip and the carrier, the porous structure element comprising an interconnected network of pores. - View Dependent Claims (8, 9, 10, 11, 12)
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Specification