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Sensor device having a structure element

  • US 8,373,240 B2
  • Filed: 01/26/2012
  • Issued: 02/12/2013
  • Est. Priority Date: 03/12/2009
  • Status: Active Grant
First Claim
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1. A sensor device, comprising:

  • a first semiconductor chip having a sensing region;

    a carrier; and

    a structure element arranged between the first semiconductor chip and the carrier, the structure element having an inlet on a first side of the structure element and an outlet on a second side of the structure element, the second side perpendicular to the first side, and the outlet being in fluid connection with the inlet and the sensing region.

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