Probe card assembly and kit, and methods of making same

• US 8,373,428 B2
• Filed: 08/04/2009
• Issued: 02/12/2013
• Est. Priority Date: 11/16/1993
• Status: Expired due to Fees

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Eldridge, Benjamin N., Grube, Gary W., Khandros, Igor Y., Mathieu, Gaetan L.
• Primary Examiner(s): PATEL, PARESH H
• Application Number:
  US12/535,070
• Publication Number:
  US 20090291573A1
• Time in Patent Office: 1,288 Days
• Field of Search: None
• US Class Current: 324/754.14
• CPC Class Codes: B23K 20/004 Wire welding
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: C25D 21/02 Heating or cooling
• CPC Class Codes: C25D 5/22 Electroplating combined with mechanical treatment during the deposition
• CPC Class Codes: C25D 5/605 Surface topography of the layers, e.g. rough, dendritic or nodular layers
• CPC Class Codes: C25D 7/123 Semiconductors first coated with a seed layer or a conductive layer
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/4889 Connection or disconnection of other leads to or from wire-like parts, e.g. wires
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/85201 : Compression bonding
• CPC Class Codes: H01L 2225/0651 : Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06527 : Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06555 : Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
• CPC Class Codes: H01L 2225/06572 : Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/12 : Structure, shape, material or disposition of the bump connectors prior to the connecting process
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/72 : Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01045 : Rhodium [Rh]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01051 : Antimony [Sb]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/068 : wherein the coefficient of thermal expansion is important
• CPC Class Codes: H05K 2201/1031 : Surface mounted metallic connector elements
• CPC Class Codes: H05K 2201/10318 : Surface mounted metallic pins
• CPC Class Codes: H05K 2201/10757 : Bent leads
• CPC Class Codes: H05K 2201/10878 : Means for retention of a lead in a hole
• CPC Class Codes: H05K 2201/10909 : Materials of terminal, e.g. of leads or electrodes of components
• CPC Class Codes: H05K 2201/10946 : Leads attached onto leadless component after manufacturing the component
• CPC Class Codes: H05K 3/20 : by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/308 : Adaptations of leads connectors to printed circuits H01R12/00
• CPC Class Codes: H05K 3/326 : the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/3421 : Leaded components
• CPC Class Codes: H05K 3/3426 : characterised by the leads
• CPC Class Codes: H05K 3/368 : parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 3/4015 : using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49222 : forming array of contacts or terminals

Abstract

A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer'"'"'s range of adjustment, by virtue of the interposer'"'"'s inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.

Claims

1. A probe card assembly comprising:

a space transformer substrate comprising a first surface, a second surface opposite the first surface, first electrically conductive terminals disposed on the first surface, and second electrically conductive terminals disposed on the second surface;

electrically conductive resilient contact structures mounted to the first terminals;

a printed circuit board comprising a third surface, a fourth surface opposite the third surface, and third electrically conductive terminals disposed on the third surface, the circuit board being mechanically coupled to the space transformer substrate in a stack;

a plurality of free-standing electrical connectors exhibiting at least elastic deformation behavior and connecting the second terminals and the third terminals, wherein the space transformer substrate and the printed circuit board are electrically connected in the stack; and

adjustors that change a spacing between one or more portions of the space transformer substrate and the printed circuit board, with the electrical connectors maintaining the electrical connection between the space transformer substrate and the printed circuit board regardless of the spacing.

2. The probe card assembly of claim 1, wherein the contact structures comprise contact tips disposed to contact terminals of an electronic device to be tested.

3. The probe card assembly of claim 2, wherein the adjustors impede movement of the space transformer substrate with respect to the printed circuit board in response to forces on the contact tips.

4. The probe card assembly of claim 2, wherein each of the contact structures further comprises an elongate, spring body that extends away from the first surface of the space transformer substrate, one of the contact tips being attached to an end of each of the spring bodies.

5. The probe card assembly of claim 1, wherein at least one of the adjustors abuts the second surface of the space transformer substrate without coupling to the space transformer substrate while the space transformer substrate and the printed circuit board are coupled in the stack and the electrical connectors electrically connect the second terminals and the third terminals.

6. The probe card assembly of claim 1 further comprising a spring structure positioned with respect to the space transformer substrate to apply spring biasing forces to the space transformer substrate that bias the space transformer substrate toward the printed circuit board while the space transformer substrate and the printed circuit board are coupled in the stack and the electrical connectors electrically connect the second terminals and the third terminals.

7. The probe card assembly of claim 6, wherein each of the adjustors is configured to be selectively:

driven toward the second surface of the space transformer substrate and thereby push a part of the space transformer substrate away from the printed circuit board against the biasing forces of the spring structure; and

retracted away from the second surface of the space transformer substrate and thereby allow the part of the space transformer substrate to be moved by the biasing forces of the spring structure toward the printed circuit board.

8. The probe card assembly of claim 6, wherein the spring structure presses the space transformer substrate against the adjustors while the space transformer substrate and the printed circuit board are coupled in the stack and the electrical connectors electrically connect the second terminals and the third terminals.

9. The probe card assembly of claim 8 further comprising an actuator plate disposed adjacent the fourth surface of the printed circuit board and attached to the spring structure while the space transformer substrate and the printed circuit board are coupled in the stack and the electrical connectors electrically connect the second terminals and the third terminals.

10. The probe card assembly of claim 9, wherein the adjustors extend from the actuator plate through the printed circuit board to the space transformer substrate while the space transformer substrate and the printed circuit board are coupled in the stack and the electrical connectors electrically connect the second terminals and the third terminals.

11. The probe card assembly of claim 10, wherein the spring structure presses the second surface of the space transformer substrate against the adjustors while the space transformer substrate and the printed circuit board and the electrical connectors electrically connect the second terminals and the third terminals.

12. The probe card assembly of claim 11, wherein each adjustor comprises a differential screw comprising a threaded outer element that threads into a threaded hole in the actuator plate and a threaded inner element that threads into a threaded bore in the outer element and extends toward the space transformer substrate.

13. The probe card assembly of claim 12, wherein for each differential screw, the outer element is rotatable with respect to the actuator plate and the inner element.

14. The probe card assembly of claim 13, wherein each adjustor further comprises a pivot sphere disposed between and physically contacting an end of the inner element and the second surface of the space transformer substrate while the space transformer substrate and the printed circuit board are coupled in the stack and the electrical connectors electrically connect the second terminals and the third terminals.

15. The probe card assembly of claim 1 wherein:

the contact structures are disposed in a pattern to contact terminals of an electronic device to be tested,

the first terminals and the second terminals are electrically connected through the space transformer substrate, and

the third terminals are electrically connected through the printed circuit board to communications connectors connectable to a tester for controlling testing of the electronic device.

16. The probe card assembly of claim 15, wherein while the space transformer substrate and the printed circuit board are coupled in the stack, the electrical connectors are sufficiently flexible and resilient to electrically connect the second terminals and the third terminals as the adjustors are moved and thereby alter the orientation of the first surface of the space transformer substrate with respect to the printed circuit board.

17. The probe card assembly of claim 15, wherein:

the electrical connectors comprise first elongate, resilient interconnection elements that extend away from a surface of an interposer substrate and second elongate, resilient interconnection elements that extend away from an opposite surface of the interposer substrate, and

the first interconnection elements are electrically connected through the interposer substrate to the second interconnection elements.

18. The probe card assembly of claim 17, wherein the interposer substrate is disposed between the printed circuit board and the space transformer substrate in the stack.

19. The probe card assembly of claim 17, wherein:

each of the first interconnection elements and each of the second interconnection elements comprises a core structure and a coating on the core structure, and

a yield strength of the coating is at least twice a yield strength of the core structure.

20. The probe card assembly of claim 1, wherein:

each of the contact structures comprises a core structure and a coating on the core structure, and

a yield strength of the coating is at least twice a yield strength of the core structure.

21. The probe card assembly of claim 1, wherein the space transformer substrate comprises a circuitized, multi-layer ceramic substrate.

22. The probe card assembly of claim 21, wherein the printed circuit board comprises a circuit board substrate.