Method and apparatus for interrogating an electronic component

• US 8,373,429 B2
• Filed: 09/09/2008
• Issued: 02/12/2013
• Est. Priority Date: 03/07/2006
• Status: Expired due to Fees

• Current Assignee: Scanimetrics, Inc.
• Original Assignee: Scanimetrics, Inc.
• Inventors: Slupsky, Steven, Sellathamby, Christopher
• Primary Examiner(s): PATEL, PARESH H
• Application Number:
  US12/207,458
• Publication Number:
  US 20090066356A1
• Time in Patent Office: 1,617 Days
• Field of Search: None
• US Class Current: 324/754.31
• CPC Class Codes: G01R 1/07 Non contact-making probes
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: G01R 31/303 of integrated circuits G01R31/305 - G01R31/315 take precedence
• CPC Class Codes: G01R 31/31724 Test controller, e.g. BIST state machine for scan test G01R31/318555
• CPC Class Codes: G01R 31/318572 Input/Output interfaces
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/30107 Inductance

Abstract

A method and apparatus for interrogating an electronic component, includes a body having an interface for an interrogating device to use as a conduit in reliably performing multiple discrete interrogations of the electronic component without the interrogating device physically touching the electronic component.

Claims

1. A method for interrogating an electronic component, comprising:

providing an electronic component comprising multiple discrete circuits on a substrate;

providing a body functioning as a test access port or system access port, the body having an interface with an antenna for communication with a non-contact wireless interrogating device, the body having a logic circuit for converting instructions from the non-contact wireless interrogating device into control signals, communication signals or both to be applied to the electronic component, the body being separate and distinct from the interrogating device and the discrete circuits of the electronic component;

securing the body to the substrate of the electronic component and hardwiring the body to at least one discrete circuit of the electronic component, the body being carried by the electronic component;

performing multiple discrete interrogations of the discrete circuits via the interface of the body without the interrogating device physically touching the electronic component;

packaging the electronic component in an integrated circuit package after at least one discrete interrogation has been performed.

2. The apparatus of claim 1, wherein the body enables the multiple discrete circuits to be interrogated at least one of in parallel or in series, or individually.

3. An apparatus for interrogating an electronic component, comprising:

an electronic component comprising multiple discrete circuits on a substrate suitable for being packaged in an integrated circuit package

a body functioning as a test access port or system access port secured to and carried by the substrate, the body being hardwired to at least one discrete circuit of the electronic component, the body being separate and distinct from an interrogating device and the discrete circuits of the electronic component, the body having an interface with an antenna for wireless communication with the interrogating device, the body having a logic circuit for converting instructions from the non-contact wireless interrogating device into control signals, communication signals or both to be applied to the discrete circuits.

4. The apparatus of claim 3, wherein the body is a bare die mounted to the substrate.

5. The apparatus of claim 3, wherein the body is incorporated within an integrated circuit that performs other functions.

6. The apparatus of claim 3, wherein the body is integrally formed within the substrate.

7. The apparatus of claim 3, wherein the body is a discrete component positioned upon an integrated circuit.

8. The apparatus of claim 3, wherein the interface includes at least one of a transmitter, a receiver, or a transceiver.

9. The apparatus of claim 8, wherein the interface includes at least one transceiver having a separate transmitter circuit and a separate receiver circuit.

10. The apparatus of claim 3, wherein wireless communication includes one of capacitive coupling, inductive coupling, or electromagnetic waves.

11. The apparatus of claim 3, wherein the logic circuit includes a pattern generator.

12. The apparatus of claim 3, wherein the body has an output verification circuit for verifying the outputs of the electronic component.

13. The apparatus of claim 3, wherein the body has at least one of an analog to digital converter or a digital to analog converter.

14. The apparatus of claim 3, wherein the interface comprises a wireless communication block having a transmitter and a receiver.

15. The apparatus of claim 3, wherein at least one of the body and the electronic component includes a wired input adapted to receive at least one of data and power.

16. The apparatus of claim 15, wherein the wired input is contact pad.

17. The apparatus of claim 15, wherein the wired input is a multi-contact panel.

18. The apparatus of claim 3, wherein the body is wirebonded to the electronic component.

19. The apparatus of claim 3, wherein the body is in a flipchip arrangement with the electronic component.

20. The apparatus of claim 3, wherein the interface comprises multiple antennas connected for communicating with an interrogating device in parallel across multiple channels.

21. The apparatus of claim 3, wherein the electronic component comprises an integrated circuit package that includes the body, the substrate and the discrete circuits.

22. The apparatus of claim 3, wherein at least one of the body and the electronic component comprises a wireless power input for wirelessly receiving power.