Hermetically sealed glass package and method of manufacture

• US 8,375,744 B2
• Filed: 11/27/2006
• Issued: 02/19/2013
• Est. Priority Date: 12/06/2005
• Status: Expired due to Fees

• Current Assignee: Corning Incorporated
• Original Assignee: Corning Incorporated
• Inventors: Becken, Keith James, Logunov, Stephan Lvovich, Zhang, Aiyu, Bayne, John
• Primary Examiner(s): Daniels, Matthew
• Assistant Examiner(s): Szewczyk, Cynthia
• Application Number:
  US11/992,370
• Publication Number:
  US 20100126898A1
• Time in Patent Office: 2,276 Days
• Field of Search: 65/36
• US Class Current: 65/36
• CPC Class Codes: B65B 7/00 Closing containers or receptacles after filling
• CPC Class Codes: C03C 27/06 Joining glass to glass by processes other than fusing fusing C03B23/20; units for use as elements for closing wall or like openings and comprising two or more parallel glass panes in spaced relationship, the panes being permanently secured together E06B3/66
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants

Abstract

A method for manufacturing a hermetically sealed package is provided, the method comprising the steps of: using a laser to heat a frit, disposed in a pattern between two substrates, such that the heated frit forms a hermetic seal which connects the substrates and further comprising: directing the laser to enter the frit pattern, then to trace the frit pattern, then to retrace a portion of the frit pattern, and then to exit the frit pattern; and selecting an initial laser power which, when the laser enters the frit pattern, is insufficient to heat the frit to form a hermetic seal; then increasing the laser power over a first section of the frit pattern to a target laser power at least sufficient to heat the frit to form a hermetic seal; and then decreasing the laser power over a second section of the frit pattern until the laser power is insufficient to heat the frit to form a hermetic seal before the laser exits the frit pattern.

Claims

1. A method for manufacturing a hermetically sealed package comprising:

traversing a closed path over a surface of a glass assembly comprising first and second glass plates with a laser beam to heat a frit disposed between the first and second plates, wherein traversing the closed path comprises the steps of;

a) providing the laser beam at an initial laser power that is insufficient to heat the frit to form a hermetic seal;

b) increasing the laser power from the initial laser power at a first location to a target laser power at a second location downstream from the first location relative to a direction of the traverse about the closed path, wherein the target laser power is at least sufficient to cause the frit to form a hermetic seal;

c) maintaining the laser beam at the target laser power while the laser beam completes traversing the closed path to the first location;

d) maintaining the laser beam at the target laser power while the laser beam continues to traverse downstream past the first location to a third location downstream from the first location relative to the direction of traverse; and

then

e) decreasing the laser power from the third location until the laser power is insufficient to heat the frit to form a hermetic seal at a fourth location, a predetermined distance downstream from the third location relative to the direction of traverse, wherein the heating melts the frit and seals the glass assembly to form a hermetically sealed package.

2. The method of claim 1 wherein the distance between the first location and the second location, over which the laser power is increased, is at least about 3 mm in length.

3. The method of claim 1 wherein the distance between the third location and the fourth location, over which the laser power is decreased, is at least about 5 mm in length.

4. The method of claim 1, wherein the third location is located either at the second location or downstream of the second location relative to the direction of traverse.

5. The method of claim 1, wherein the third location is located upstream of the second location relative to the direction of traverse.

6. A method for manufacturing a hermetically sealed package comprising:

traversing a closed path over a surface of a glass assembly comprising first and second glass plates with a laser beam to heat a frit disposed between the first and second plates, wherein traversing the closed path comprises the steps of;

a) providing the laser beam at an initial laser power that is insufficient to heat the frit to form a hermetic seal;

b) increasing the laser power from the initial laser power at a first location to a target laser power at a second location downstream from the first location relative to a direction of the traverse about the closed path, wherein the target laser power is at least sufficient to cause the frit to form a hermetic seal;

c) maintaining the laser beam at the target laser power while the laser beam completes traversing the closed path to the first location; and

then

d) decreasing the laser power from the first location until the laser power is insufficient to heat the frit to form a hermetic seal at a third location, a predetermined distance downstream from the first location relative to the direction of traverse, wherein the heating melts the frit and seals the glass assembly to form a hermetically sealed package.

7. The method of claim 6 wherein the distance between the first location and the second location, over which the laser power is increased, is at least about 3 mm in length.

8. The method of claim 6 wherein the distance between the first location and the third location, over which the laser power is decreased, is at least about 5 mm in length.