Retaining ring and articles for carrier head

• US 8,376,813 B2
• Filed: 02/10/2010
• Issued: 02/19/2013
• Est. Priority Date: 09/08/2000
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Bennett, Doyle E., Nagengast, Andrew J., Chen, Hung Chih
• Primary Examiner(s): Eley, Timothy V
• Application Number:
  US12/703,591
• Publication Number:
  US 20100144255A1
• Time in Patent Office: 1,105 Days
• Field of Search: 451/285, 451/286, 451/287, 451/288, 451/289, 451/290, 451/397, 451/398, 451/402, 451/442
• US Class Current: 451/442
• CPC Class Codes: B24B 37/30 for single side lapping of plane surfaces
• CPC Class Codes: B24B 37/32 Retaining rings

Abstract

A carrier head for chemical mechanical polishing that has a base, a mounting assembly connected to the base having a surface for contacting a substrate, and a retaining ring secured to the base. The retaining ring can include perfluoroalkoxy, polyetherketoneketone, polybenzimidazole, a semi-crystalline thermoplastic polyester, or a long molecular chain molecule produced from poly-paraphenylene terephthalamide.

Claims

1. A retaining ring for a chemical mechanical polishing head, comprising:

an upper portion configured to be secured to a base; and

a lower portion having a bottom surface to contact a polishing pad during polishing, wherein the upper portion and the lower portion are the same material and include a blend of semi-crystalline thermoplastic polyester and polytetrafluoroethylene.

2. The retaining ring of claim 1, wherein the upper portion and the lower portion consist of the blend of semi-crystalline thermoplastic polyester and polytetrafluoroethylene.

3. The retaining ring of claim 1, wherein the upper portion and the lower portion include at least one of graphite or carbon fibers.

4. A carrier head for chemical mechanical polishing, comprising:

a base;

a mounting assembly attached to the base having a surface for contacting a substrate; and

a retainer having an upper portion configured to be secured to the base and a lower portion having a bottom surface to contact a polishing pad during polishing, wherein the upper portion and the lower portion are the same material and include a blend of semi-crystalline thermoplastic polyester and polytetrafluoroethylene.

5. The carrier head of claim 4, wherein the upper portion and the lower portion consist of the blend of semi-crystalline thermoplastic polyester and polytetrafluoroethylene.

6. The carrier head of claim 4, wherein the upper portion and the lower portion include at least one of graphite or carbon fibers.