Semiconductor chip assembly with post/base heat spreader and horizontal signal routing
First Claim
1. A semiconductor chip assembly, comprising:
- a semiconductor device;
an adhesive that includes an opening;
a heat spreader that includes a post and a base, wherein the post is adjacent to the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; and
a substrate that includes a pad, a terminal, a routing line, first and second vias and a dielectric layer, wherein the pad and the terminal extend above the dielectric layer, the routing line extends below the dielectric layer, the vias each extend through the dielectric layer to the routing line, an electrically conductive path between the pad and the terminal includes the first via, the routing line and the second via, and an aperture extends through the substrate;
wherein the semiconductor device is mounted on the heat spreader, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base;
wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap and is sandwiched between the post and the dielectric layer, between the base and the dielectric layer and between the base and the routing line;
wherein the substrate is mounted on the adhesive and extends above the base, and the routing line is embedded in the adhesive; and
wherein the post extends into the opening and the aperture and above the dielectric layer, and the base extends below the semiconductor device, the adhesive and the substrate.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly through an opening in the adhesive into an aperture in the substrate, and the base extends laterally from the post. The adhesive extends between the post and the substrate and between the base and the substrate. The substrate includes first and second conductive layers and a dielectric layer therebetween and provides horizontal signal routing between a pad and a terminal at the first conductive layer.
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Citations
35 Claims
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1. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post and a base, wherein the post is adjacent to the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; and a substrate that includes a pad, a terminal, a routing line, first and second vias and a dielectric layer, wherein the pad and the terminal extend above the dielectric layer, the routing line extends below the dielectric layer, the vias each extend through the dielectric layer to the routing line, an electrically conductive path between the pad and the terminal includes the first via, the routing line and the second via, and an aperture extends through the substrate; wherein the semiconductor device is mounted on the heat spreader, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap and is sandwiched between the post and the dielectric layer, between the base and the dielectric layer and between the base and the routing line; wherein the substrate is mounted on the adhesive and extends above the base, and the routing line is embedded in the adhesive; and wherein the post extends into the opening and the aperture and above the dielectric layer, and the base extends below the semiconductor device, the adhesive and the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post, a base and a cap, wherein the post is adjacent to and integral with the base, extends above the base in an upward direction and thermally connects the base and the cap, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, and the cap extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post; and a substrate that includes first and second conductive layers, first and second vias and a dielectric layer, wherein the first conductive layer contacts and extends above the dielectric layer, the second conductive layer contacts and extends below the dielectric layer, a pad and a terminal include selected portions of the first conductive layer and contact and extend above the dielectric layer, a routing line includes a selected portion of the second conductive layer and contacts and extends below the dielectric layer, the vias each contact and extend through the dielectric layer between the conductive layers, an electrically conductive path between the pad and the terminal includes in sequence the first via, the routing line and the second via, and an aperture extends through the substrate; wherein the semiconductor device is mounted on the cap, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap, is sandwiched between the post and the dielectric layer in the gap, is sandwiched between the base and the dielectric layer and between the base and the second conductive layer outside the gap, covers the substrate in the downward direction and surrounds the post in the lateral directions; wherein the substrate is mounted on the adhesive and extends above the base, and the second conductive layer is embedded in the adhesive; and wherein the post extends into the opening and the aperture and above and below the dielectric layer, the cap contacts and overlaps the adhesive and the base extends below the semiconductor device, the adhesive and the substrate and covers the semiconductor device, the post, the cap, the substrate and the adhesive in the downward direction. - View Dependent Claims (17, 18, 19, 20)
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21. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post, a base and a cap, wherein the post is adjacent to and integral with the base, extends above the base in an upward direction and thermally connects the base and the cap, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, and the cap extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post; a substrate that includes first and second conductive layers, first and second vias and a dielectric layer, wherein the first conductive layer contacts and extends above the dielectric layer, the second conductive layer contacts and extends below the dielectric layer, a pad and a terminal include selected portions of the first conductive layer and contact and extend above the dielectric layer, a routing line includes a selected portion of the second conductive layer and contacts and extends below the dielectric layer, the vias each contact and extend through the dielectric layer between the conductive layers, an electrically conductive path between the pad and the terminal includes in sequence the first via, the routing line and the second via, and an aperture extends through the substrate; wherein the semiconductor device is mounted on the cap, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap, contacts and is sandwiched between the post and the dielectric layer in the gap, contacts and is sandwiched between the base and the dielectric layer and between the base and the second conductive layer outside the gap, covers the substrate in the downward direction, covers and surrounds the post in the lateral directions, extends laterally from the post to or beyond the terminal and extends to peripheral edges of the assembly; wherein the substrate is mounted on the adhesive, extends above the base and is spaced from the post and the base, and the second conductive layer is embedded in the adhesive; and wherein the post extends into the opening and the aperture and above the dielectric layer and is coplanar with the adhesive above the dielectric layer and above bottom surfaces of the pad and the terminal and below top surfaces of the pad and the terminal, the cap contacts and overlaps the adhesive and is coplanar with the pad and the terminal above the adhesive and the dielectric layer at a surface that faces in the upward direction, and the base extends below the semiconductor device, the adhesive and the substrate, covers the semiconductor device, the post, the cap, the substrate and the adhesive in the downward direction, supports the substrate and extends to peripheral edges of the assembly. - View Dependent Claims (22, 23, 24, 25)
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26. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; and a substrate that includes a pad, a terminal, a routing line, first and second vias and a dielectric layer, wherein the pad and the terminal extend above the dielectric layer, the routing line extends below the dielectric layer, the vias each extend through the dielectric layer to the routing line, an electrically conductive path between the pad and the terminal includes in sequence the first via, the routing line and the second via, and an aperture extends through the substrate; wherein the semiconductor device is mounted on the heat spreader, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, contacts the post and the base, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap and is sandwiched between the post and the dielectric layer, between the base and the dielectric layer and between the base and the routing line; wherein the substrate is mounted on the adhesive, extends above the base and is spaced from the post and the base, and the routing line is embedded in the adhesive; and wherein the post extends into the opening and the aperture and above and below the dielectric layer and is coplanar with the adhesive above the dielectric layer and above a bottom surface of the pad and below a top surface of the pad, and the base extends below the semiconductor device, the adhesive and the substrate. - View Dependent Claims (27, 28, 29, 30)
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31. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; and a substrate that includes a pad, a terminal, a routing line, first and second vias and a dielectric layer, wherein the pad and the terminal contact and extend above the dielectric layer and have the same thickness and are coplanar with one another at a surface that faces in the upward direction, the routing line contacts and extends below the dielectric layer, the vias each contact and extend through the dielectric layer to the routing line, an electrically conductive path between the pad and the terminal includes in sequence the first via, the routing line and the second via, and an aperture extends through the substrate; wherein the semiconductor device is mounted on the heat spreader, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, and contacts and is sandwiched between the post and the dielectric layer in the gap, between the base and the dielectric layer outside the gap and between the base and the routing line outside the gap; wherein the substrate is mounted on the adhesive, extends above the base and is spaced from the post and the base, and the routing line is embedded in the adhesive; and wherein the post extends into the opening and the aperture and is coplanar with the adhesive above the dielectric layer and above bottom surfaces of the pad and the terminal and below top surfaces of the pad and the terminal and is coplanar with the adhesive below the dielectric layer at the base, the post and the adhesive in combination fill the aperture, and the base extends below the semiconductor device, the adhesive and the substrate, covers the semiconductor device, the post, the substrate and the adhesive in the downward direction and extends to peripheral edges of the assembly. - View Dependent Claims (32, 33, 34, 35)
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Specification