Semiconductor chip assembly with post/base heat spreader and horizontal signal routing

• US 8,378,372 B2
• Filed: 09/11/2009
• Issued: 02/19/2013
• Est. Priority Date: 03/25/2008
• Status: Expired due to Fees

• Current Assignee: Bridge Semiconductor Corporation
• Original Assignee: Bridge Semiconductor Corporation
• Inventors: Wang, Chia-Chung, Lin, Charles W. C.
• Primary Examiner(s): Lee, Eugene
• Assistant Examiner(s): Jiang, Fang-Xing
• Application Number:
  US12/557,540
• Publication Number:
  US 20100001309A1
• Time in Patent Office: 1,257 Days
• Field of Search: 257/99, 257/98, 257/E33.001, 298/27, 438/22, 438/26, 438/112
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32188 the layer connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 33/483 : Containers
• CPC Class Codes: H01L 33/642 : characterized by the shape
• CPC Class Codes: H05K 1/0204 : using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 2201/09054 : Raised area or protrusion of metal substrate
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2203/0369 : Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
• CPC Class Codes: H05K 3/0061 : onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly through an opening in the adhesive into an aperture in the substrate, and the base extends laterally from the post. The adhesive extends between the post and the substrate and between the base and the substrate. The substrate includes first and second conductive layers and a dielectric layer therebetween and provides horizontal signal routing between a pad and a terminal at the first conductive layer.

Claims

1. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes an opening;

a heat spreader that includes a post and a base, wherein the post is adjacent to the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; and

a substrate that includes a pad, a terminal, a routing line, first and second vias and a dielectric layer, wherein the pad and the terminal extend above the dielectric layer, the routing line extends below the dielectric layer, the vias each extend through the dielectric layer to the routing line, an electrically conductive path between the pad and the terminal includes the first via, the routing line and the second via, and an aperture extends through the substrate;

wherein the semiconductor device is mounted on the heat spreader, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base;

wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap and is sandwiched between the post and the dielectric layer, between the base and the dielectric layer and between the base and the routing line;

wherein the substrate is mounted on the adhesive and extends above the base, and the routing line is embedded in the adhesive; and

wherein the post extends into the opening and the aperture and above the dielectric layer, and the base extends below the semiconductor device, the adhesive and the substrate.

2. The assembly of claim 1, wherein the semiconductor device is an LED package that includes an LED chip.

3. The assembly of claim 1, wherein the semiconductor device is an LED package that includes an LED chip, is electrically connected to the pad using a first solder joint and is thermally connected to the post using a second solder joint.

4. The assembly of claim 1, wherein the adhesive contacts the post and the dielectric layer in the gap and contacts the base, the dielectric layer and the routing line outside the gap.

5. The assembly of claim 1, wherein the adhesive covers the substrate in the downward direction and covers and surrounds the post in the lateral directions.

6. The assembly of claim 1, wherein the adhesive fills the gap and the space between the base and the substrate where the substrate overlaps the base.

7. The assembly of claim 1, wherein the adhesive is contained in the space between the heat spreader and the substrate.

8. The assembly of claim 1, wherein the adhesive extends to peripheral edges of the assembly.

9. The assembly of claim 1, wherein the post is integral with the base.

10. The assembly of claim 1, wherein the post is coplanar with the adhesive above the dielectric layer.

11. The assembly of claim 1, wherein the post has a diameter that decreases as it extends upwardly from the base to its flat top.

12. The assembly of claim 1, wherein the base covers the semiconductor device, the post, the substrate and the adhesive in the downward direction and extends to peripheral edges of the assembly.

13. The assembly of claim 1, wherein the substrate is spaced from the post and the base.

14. The assembly of claim 1, wherein the heat spreader includes a cap that extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post and that contacts and overlaps the adhesive.

15. The assembly of claim 14, wherein the cap has a rectangular or square shape and the top of the post has a circular shape.

16. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes an opening;

a heat spreader that includes a post, a base and a cap, wherein the post is adjacent to and integral with the base, extends above the base in an upward direction and thermally connects the base and the cap, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, and the cap extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post; and

a substrate that includes first and second conductive layers, first and second vias and a dielectric layer, wherein the first conductive layer contacts and extends above the dielectric layer, the second conductive layer contacts and extends below the dielectric layer, a pad and a terminal include selected portions of the first conductive layer and contact and extend above the dielectric layer, a routing line includes a selected portion of the second conductive layer and contacts and extends below the dielectric layer, the vias each contact and extend through the dielectric layer between the conductive layers, an electrically conductive path between the pad and the terminal includes in sequence the first via, the routing line and the second via, and an aperture extends through the substrate;

wherein the semiconductor device is mounted on the cap, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base;

wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap, is sandwiched between the post and the dielectric layer in the gap, is sandwiched between the base and the dielectric layer and between the base and the second conductive layer outside the gap, covers the substrate in the downward direction and surrounds the post in the lateral directions;

wherein the substrate is mounted on the adhesive and extends above the base, and the second conductive layer is embedded in the adhesive; and

wherein the post extends into the opening and the aperture and above and below the dielectric layer, the cap contacts and overlaps the adhesive and the base extends below the semiconductor device, the adhesive and the substrate and covers the semiconductor device, the post, the cap, the substrate and the adhesive in the downward direction.

17. The assembly of claim 16, wherein the semiconductor device is an LED package that includes an LED chip, is electrically connected to the pad using a first solder joint and is thermally connected to the cap using a second solder joint.

18. The assembly of claim 16, wherein the semiconductor device is a semiconductor chip that is electrically connected to the pad using a wire bond and is thermally connected to the cap using a die attach.

19. The assembly of claim 16, wherein the substrate is spaced from the post and the base, and the adhesive fills the gap and the space between the base and the substrate where the substrate overlaps the base.

20. The assembly of claim 16, wherein the post has a diameter that decreases as it extends upwardly from the base to the cap.

21. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes an opening;

a heat spreader that includes a post, a base and a cap, wherein the post is adjacent to and integral with the base, extends above the base in an upward direction and thermally connects the base and the cap, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, and the cap extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post;

a substrate that includes first and second conductive layers, first and second vias and a dielectric layer, wherein the first conductive layer contacts and extends above the dielectric layer, the second conductive layer contacts and extends below the dielectric layer, a pad and a terminal include selected portions of the first conductive layer and contact and extend above the dielectric layer, a routing line includes a selected portion of the second conductive layer and contacts and extends below the dielectric layer, the vias each contact and extend through the dielectric layer between the conductive layers, an electrically conductive path between the pad and the terminal includes in sequence the first via, the routing line and the second via, and an aperture extends through the substrate;

wherein the semiconductor device is mounted on the cap, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base;

wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap, contacts and is sandwiched between the post and the dielectric layer in the gap, contacts and is sandwiched between the base and the dielectric layer and between the base and the second conductive layer outside the gap, covers the substrate in the downward direction, covers and surrounds the post in the lateral directions, extends laterally from the post to or beyond the terminal and extends to peripheral edges of the assembly;

wherein the substrate is mounted on the adhesive, extends above the base and is spaced from the post and the base, and the second conductive layer is embedded in the adhesive; and

wherein the post extends into the opening and the aperture and above the dielectric layer and is coplanar with the adhesive above the dielectric layer and above bottom surfaces of the pad and the terminal and below top surfaces of the pad and the terminal, the cap contacts and overlaps the adhesive and is coplanar with the pad and the terminal above the adhesive and the dielectric layer at a surface that faces in the upward direction, and the base extends below the semiconductor device, the adhesive and the substrate, covers the semiconductor device, the post, the cap, the substrate and the adhesive in the downward direction, supports the substrate and extends to peripheral edges of the assembly.

22. The assembly of claim 21, wherein the semiconductor device is an LED package that includes an LED chip, is mounted on the cap and the pad, is electrically connected to the pad using a first solder joint and is thermally connected to the cap using a second solder joint.

23. The assembly of claim 21, wherein the semiconductor device is a semiconductor chip that is mounted on the cap, is electrically connected to the pad using a wire bond and is thermally connected to the cap using a die attach.

24. The assembly of claim 21, wherein the substrate is spaced from the post and the base and the adhesive fills the gap and the space between the base and the substrate where the base overlaps the substrate and is contained in the space between the heat spreader and the substrate.

25. The assembly of claim 21, wherein the post has a diameter that decreases as it extends upwardly from the base to the cap and the post, the base and the cap include copper.

26. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes an opening;

a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; and

a substrate that includes a pad, a terminal, a routing line, first and second vias and a dielectric layer, wherein the pad and the terminal extend above the dielectric layer, the routing line extends below the dielectric layer, the vias each extend through the dielectric layer to the routing line, an electrically conductive path between the pad and the terminal includes in sequence the first via, the routing line and the second via, and an aperture extends through the substrate;

wherein the semiconductor device is mounted on the heat spreader, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base;

wherein the adhesive is mounted on and extends above the base, contacts the post and the base, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap and is sandwiched between the post and the dielectric layer, between the base and the dielectric layer and between the base and the routing line;

wherein the substrate is mounted on the adhesive, extends above the base and is spaced from the post and the base, and the routing line is embedded in the adhesive; and

wherein the post extends into the opening and the aperture and above and below the dielectric layer and is coplanar with the adhesive above the dielectric layer and above a bottom surface of the pad and below a top surface of the pad, and the base extends below the semiconductor device, the adhesive and the substrate.

27. The assembly of claim 26, wherein the adhesive contacts the post and the dielectric layer in the gap, contacts the base, the dielectric layer and the routing line outside the gap, covers the substrate in the downward direction, covers and surrounds the post in the lateral directions, fills the gap, fills the space between the base and the substrate where the substrate overlaps the base, is contained in the space between the heat spreader and the substrate and extends to peripheral edges of the assembly.

28. The assembly of claim 26, wherein the post has a cut-off conical shape in which its diameter decreases as it extends upwardly from the base.

29. The assembly of claim 26, wherein the heat spreader includes a cap that extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post and the cap contacts and overlaps the adhesive and is coplanar with the pad and the terminal above the adhesive and the dielectric layer at a surface that faces in the upward direction.

30. The assembly of claim 29, wherein the post is copper, the base, the cap, the pad and the terminal consist of copper and a plated contact that provides a surface finish on the copper and the cap is copper where it is adjacent to the post.

31. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes an opening;

a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; and

a substrate that includes a pad, a terminal, a routing line, first and second vias and a dielectric layer, wherein the pad and the terminal contact and extend above the dielectric layer and have the same thickness and are coplanar with one another at a surface that faces in the upward direction, the routing line contacts and extends below the dielectric layer, the vias each contact and extend through the dielectric layer to the routing line, an electrically conductive path between the pad and the terminal includes in sequence the first via, the routing line and the second via, and an aperture extends through the substrate;

wherein the semiconductor device is mounted on the heat spreader, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base;

wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, and contacts and is sandwiched between the post and the dielectric layer in the gap, between the base and the dielectric layer outside the gap and between the base and the routing line outside the gap;

wherein the substrate is mounted on the adhesive, extends above the base and is spaced from the post and the base, and the routing line is embedded in the adhesive; and

wherein the post extends into the opening and the aperture and is coplanar with the adhesive above the dielectric layer and above bottom surfaces of the pad and the terminal and below top surfaces of the pad and the terminal and is coplanar with the adhesive below the dielectric layer at the base, the post and the adhesive in combination fill the aperture, and the base extends below the semiconductor device, the adhesive and the substrate, covers the semiconductor device, the post, the substrate and the adhesive in the downward direction and extends to peripheral edges of the assembly.

32. The assembly of claim 31, wherein the adhesive covers the substrate in the downward direction, covers and surrounds the post in the lateral directions, fills the gap, fills the space between the base and the substrate where the substrate overlaps the base, is contained in the space between the heat spreader and the substrate and extends to peripheral edges of the assembly.

33. The assembly of claim 31, wherein the post has a cut-off conical shape in which its diameter decreases as it extends upwardly from the base.

34. The assembly of claim 31, wherein the heat spreader includes a cap that extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post and the cap contacts and overlaps the adhesive and is coplanar with the pad and the terminal above the adhesive and the dielectric layer at a surface that faces in the upward direction.

35. The assembly of claim 34, wherein the post is copper, the base, the cap, the pad and the terminal consist of copper and a plated contact that provides a surface finish on the copper and the cap is copper where it is adjacent to the post.