Semiconductor light emitting device packages including submounts

• US 8,378,374 B2
• Filed: 01/12/2010
• Issued: 02/19/2013
• Est. Priority Date: 04/27/2006
• Status: Active Grant

• Current Assignee: CREE Led Incorporated (Smart Global Holdings Incorporated)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Loh, Ban P., Medendorp, Nicholas Jr., Keller, Bernd
• Primary Examiner(s): Parker, Kenneth
• Assistant Examiner(s): Chen, Yu
• Application Number:
  US12/685,883
• Publication Number:
  US 20100109029A1
• Time in Patent Office: 1,134 Days
• Field of Search: 257/88, 257 98-100, 257/675, 257/676, 257/93, 257/91, 257/706, 257/720, 257/725, 257/E33.058, 257/E33.075, 313/500, 313/505
• US Class Current: 257/99
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.

Claims

1. A package for a light emitting device, comprising:

a package body including a first side surface and a second side surface opposite the first side surface and a central region exposing a plurality of die attach pads;

a plurality of first electrical leads extending from the first side surface of the package body; and

a plurality of second electrical leads extending from the second side surface of the package body;

wherein respective ones of the first electrical leads are electrically connected to corresponding ones of the plurality of die attach pads;

the package further comprising an electrically insulating submount on the central region of the package body, wherein the plurality of die attach pads are on the electrically insulating submount;

a heatsink member that extends through the central region and contacts the electrically insulating submount;

a plurality of light emitting diode chips mounted on corresponding ones of the die attach pads; and

a plurality of wirebond connections from the second electrical leads directly to corresponding ones of the light emitting diode chips.

2. The package of claim 1, further comprising:

a reflector cup surrounding the central region of the package body.

3. The package of claim 1, further comprising a recess in the central region of the package body, the recess exposing at least portions of the plurality of first electrical leads.

4. The package of claim 3, wherein the recess comprises a first recess, the package further comprising a second recess in the central region of the package body, the second recess exposing at least portions of the plurality of second electrical leads.

5. The package of claim 1, further comprising:

a plurality of wirebond connections between the first electrical leads and corresponding ones of the die attach pads.

6. The package of claim 1, wherein the plurality of light emitting diode chips are electrically isolated from one another.

7. The package of claim 1, wherein the package body is molded to a leadframe including the plurality of first leads and the plurality of second leads.

8. The package of claim 1, wherein the package body includes respective upper and lower surfaces, wherein the heatsink member extends from the upper surface to the lower surface of the package body.

9. The package of claim 1, wherein the die attach pads comprise a first die attach pad including a first die mounting region proximate the first side surface of the package body and a second die attach pad including a second die mounting region proximate the second side surface of the body;

wherein the first die mounting region is between the second die mounting region and the first electrical leads; and

wherein the second die attach pad includes an extension region that extends away from the second die mounting region past the first die mounting region towards the first side surface of the package body.

10. The package of claim 1, wherein the plurality of light emitting diode chips comprise first electrical contacts in contact with the submount and second electrical contacts opposite the submount, wherein the plurality of wirebond connections between the second electrical leads and the corresponding ones of the light emitting diode chips are made to the second electrical contacts opposite the submount.