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Semiconductor light emitting device packages including submounts

  • US 8,378,374 B2
  • Filed: 01/12/2010
  • Issued: 02/19/2013
  • Est. Priority Date: 04/27/2006
  • Status: Active Grant
First Claim
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1. A package for a light emitting device, comprising:

  • a package body including a first side surface and a second side surface opposite the first side surface and a central region exposing a plurality of die attach pads;

    a plurality of first electrical leads extending from the first side surface of the package body; and

    a plurality of second electrical leads extending from the second side surface of the package body;

    wherein respective ones of the first electrical leads are electrically connected to corresponding ones of the plurality of die attach pads;

    the package further comprising an electrically insulating submount on the central region of the package body, wherein the plurality of die attach pads are on the electrically insulating submount;

    a heatsink member that extends through the central region and contacts the electrically insulating submount;

    a plurality of light emitting diode chips mounted on corresponding ones of the die attach pads; and

    a plurality of wirebond connections from the second electrical leads directly to corresponding ones of the light emitting diode chips.

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