High aspect-ratio PN-junction and method for manufacturing the same
First Claim
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1. A semiconductor device comprising:
- a conducting layer;
a plurality of first regions associated with a first dopant over the conducting layer, wherein each of the first regions has at least two sidewall spacers of a second dopant and the at least two sidewalk comprise four sidewalls and the sidewall spacers are in direct contact with first regions to form PN-junctions; and
a plurality of second regions associated with the second dopant formed over the first regions to position the first regions between the conducting layer and the second regions.
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Abstract
A semiconductor device having high-aspect-ratio PN-junctions is provided. The semiconductor device includes a conducting layer. The semiconductor device further includes a plurality of first doped regions formed over the conducting layer. The sidewalls of the doped regions are doped to form PN-junctions. The semiconductor device also includes a plurality of second doped regions over the first doped regions.
17 Citations
15 Claims
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1. A semiconductor device comprising:
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a conducting layer; a plurality of first regions associated with a first dopant over the conducting layer, wherein each of the first regions has at least two sidewall spacers of a second dopant and the at least two sidewalk comprise four sidewalls and the sidewall spacers are in direct contact with first regions to form PN-junctions; and a plurality of second regions associated with the second dopant formed over the first regions to position the first regions between the conducting layer and the second regions. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A semiconductor device comprising:
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a conducting layer; a plurality of regions associated with a first dopant formed on the upper surface of the conducting layer; an isolation layer formed over the plurality of regions associated with the first dopant, the isolation-layer being formed over at least two sidewalls of the plurality of regions associated with the first dopant, is doped with a second dopant, wherein the isolation layer covers the upper surface of the regions associated with the first dopant and the upper surface of the conducting layer in between the regions associated with the first dopant; and a plurality of regions associated with the second dopant formed over the regions associated with the first dopant such that the isolation-layer separates the plurality of regions associated with the first dopant and corresponding regions associated with the second dopant, wherein each of the plurality of regions associated with the first dopant corresponds to one of the plurality of regions associated with the second dopant to form a PIN-junction that is operable as a memory cell. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A semiconductor device comprising:
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a conducting layer; a plurality of first regions associated with a first dopant over the conducting layer, wherein each of the first regions has at least two sidewall spacers of a second dopant and the at least two sidewalls comprise four sidewalk and the sidewall spacers contact to the first regions with a first dopant to increase forward current; and a plurality of second regions associated with the second dopant formed over the first regions to position the first regions between the conducting layer and the second regions.
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Specification