Backside illumination solid-state imaging device
First Claim
1. A backside illumination solid-state imaging device comprising:
- a semiconductor layer;
a first light-receiving unit and a second light-receiving unit which are formed adjacent to each other in the semiconductor layer, convert light applied from a lower surface side of the semiconductor layer into a signal, and store electric charges;
a circuit unit which is formed on an upper surface of the semiconductor layer and reads electric charges stored in the first light-receiving unit and the second light-receiving unit;
an impurity isolation layer which is formed to reach to the upper surface from the lower surface in the semiconductor layer and isolates the first light-receiving unit from the second light-receiving unit; and
a light-shielding film which is formed on part of the lower surface side in the impurity isolation layer so as to extend from the lower surface to the upper surface.
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Accused Products
Abstract
According to one embodiment, a backside illumination solid-state imaging device includes a semiconductor layer, a first light-receiving unit and a second light-receiving unit, a circuit unit, an impurity isolation layer, and a light-shielding film. A first light-receiving unit and a second light-receiving unit are formed adjacent to each other in the semiconductor layer, convert light applied from a lower surface side of the semiconductor layer into a signal, and store electric charges. A circuit unit is formed on an upper surface of the semiconductor layer. An impurity isolation layer is formed to reach to the upper surface from the lower surface in the semiconductor layer and isolates the first light-receiving unit from the second light-receiving unit. A light-shielding film is formed on part of the lower surface side in the impurity isolation layer so as to extend from the lower surface to the upper surface.
29 Citations
19 Claims
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1. A backside illumination solid-state imaging device comprising:
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a semiconductor layer; a first light-receiving unit and a second light-receiving unit which are formed adjacent to each other in the semiconductor layer, convert light applied from a lower surface side of the semiconductor layer into a signal, and store electric charges; a circuit unit which is formed on an upper surface of the semiconductor layer and reads electric charges stored in the first light-receiving unit and the second light-receiving unit; an impurity isolation layer which is formed to reach to the upper surface from the lower surface in the semiconductor layer and isolates the first light-receiving unit from the second light-receiving unit; and a light-shielding film which is formed on part of the lower surface side in the impurity isolation layer so as to extend from the lower surface to the upper surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A backside illumination solid-state imaging device comprising:
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a semiconductor layer; a first light-receiving unit and a second light-receiving unit which are formed adjacent to each other in the semiconductor layer, convert light applied from a lower surface side of the semiconductor layer into a signal, and store electric charges; a circuit unit which is formed on an upper surface of the semiconductor layer and reads electric charges stored in the first light-receiving unit and the second light-receiving unit; a light-shielding film having conductivity which is formed to reach the upper surface from the lower surface in the semiconductor layer and isolates the first light-receiving unit from the second light-receiving unit; and an interconnection which is formed on the lower surface of the semiconductor layer and applies one of a ground voltage and a negative bias to the light-shielding film. - View Dependent Claims (15, 16, 17, 18, 19)
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Specification