Semiconductor device
First Claim
1. A semiconductor device comprising:
- a memory cell array comprising a first memory cell and a second memory cell;
the first memory cell comprising;
a first transistor having a first channel formation region electrically connected to a first bit line through a source or a drain of the first transistor; and
a second transistor having a second channel formation region electrically connected to a gate of the first transistor through a source or a drain of the second transistor, andthe second memory cell comprising;
a third transistor having a third channel formation region electrically connected to a second bit line through a source or a drain of the third transistor; and
a fourth transistor having a fourth channel formation region electrically connected to a gate of the third transistor through a source or a drain of the fourth transistor, anda driver circuit associated with the first memory cell and the second memory cell,wherein a first semiconductor material included in the first channel formation region is selected from the group consisting of silicon, germanium, silicon germanium, silicon carbide, or gallium arsenide, andwherein the first memory cell and the second memory cell are stacked so as to overlap at least partly with each other.
1 Assignment
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Accused Products
Abstract
An object is to provide a semiconductor device with a novel structure in which stored data can be held even when power is not supplied and there is no limit on the number of write operations. The semiconductor device includes a first memory cell including a first transistor and a second transistor, a second memory cell including a third transistor and a fourth transistor, and a driver circuit. The first transistor and the second transistor overlap at least partly with each other. The third transistor and the fourth transistor overlap at least partly with each other. The second memory cell is provided over the first memory cell. The first transistor includes a first semiconductor material. The second transistor, the third transistor, and the fourth transistor include a second semiconductor material.
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Citations
16 Claims
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1. A semiconductor device comprising:
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a memory cell array comprising a first memory cell and a second memory cell; the first memory cell comprising; a first transistor having a first channel formation region electrically connected to a first bit line through a source or a drain of the first transistor; and a second transistor having a second channel formation region electrically connected to a gate of the first transistor through a source or a drain of the second transistor, and the second memory cell comprising; a third transistor having a third channel formation region electrically connected to a second bit line through a source or a drain of the third transistor; and a fourth transistor having a fourth channel formation region electrically connected to a gate of the third transistor through a source or a drain of the fourth transistor, and a driver circuit associated with the first memory cell and the second memory cell, wherein a first semiconductor material included in the first channel formation region is selected from the group consisting of silicon, germanium, silicon germanium, silicon carbide, or gallium arsenide, and wherein the first memory cell and the second memory cell are stacked so as to overlap at least partly with each other. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor device comprising:
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a first memory cell over a substrate, the first memory cell comprising; a first transistor; a second transistor over the first transistor; and a first capacitor over the first transistor, and a second memory cell over the first memory cell, the second memory cell comprising; a third transistor; a fourth transistor over the third transistor; and a second capacitor over the third transistor, wherein the second memory cell overlaps at least partly with the first memory cell, wherein a gate of the first transistor is electrically connected to a source or a drain of the second transistor and the first capacitor, wherein a gate of the third transistor is electrically connected to a source or a drain of the fourth transistor and the second capacitor, and wherein a first semiconductor material included in a first channel formation region of the first transistor is selected from the group consisting of silicon, germanium, silicon germanium, silicon carbide, or gallium arsenide. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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Specification