Pressure sensor and method of assembling same
First Claim
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1. A pressure sensor package, comprising:
- a lead frame having a centrally located void;
a pressure sensing die electrically coupled to the lead frame, wherein the void is located between the lead frame and the pressure sensing die; and
an internal fill material disposed within the void between the lead frame and the pressure sensing die.
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Abstract
A method of packaging a pressure sensing die includes providing a lead frame with lead fingers and attaching the pressure sensing die to the lead fingers such that bond pads of the die are electrically coupled to the lead fingers and a void is formed between the die and the lead fingers. A gel material is dispensed via an underside of the lead frame into the void such that the gel material substantially fills the void. The gel material is then cured and the die and the lead frame are encapsulated with a mold compound. The finished package does not include a metal lid.
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Citations
20 Claims
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1. A pressure sensor package, comprising:
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a lead frame having a centrally located void; a pressure sensing die electrically coupled to the lead frame, wherein the void is located between the lead frame and the pressure sensing die; and an internal fill material disposed within the void between the lead frame and the pressure sensing die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A pressure sensor package, comprising:
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a lead frame; at least one die electrically coupled to the lead frame, wherein a void is located between the lead frame and the at least one die; a gel material disposed within the void between the lead frame and the at least one die; and an encapsulation material substantially surrounding the at least one die and the lead frame. - View Dependent Claims (13, 14)
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15. A method of assembling a pressure sensor package, comprising:
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providing a lead frame having a plurality of lead fingers disposed in at least two opposing rows; attaching a pressure sensing die to a first surface of the lead frame, wherein a void is formed between the die and the rows of lead fingers of the lead frame; electrically coupling bond pads of the pressure sensing die to respective ones of the plurality of lead fingers of the lead frame; dispensing a gel material into the void such that the gel material substantially fills the void and covers an active surface of the pressure sensing die; encapsulating the pressure sensing die and the lead frame with a mold compound, wherein the mold compound covers the pressure sensing die, electrical connections between the pressure sensing die and the lead frame, and the lead frame except that a second surface of the lead fingers of the lead frame is exposed to allow external electrical connection to the pressure sensing die. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification