Integrated circuit package system with image sensor system

• US 8,378,502 B2
• Filed: 10/26/2010
• Issued: 02/19/2013
• Est. Priority Date: 01/04/2006
• Status: Active Grant

• Current Assignee: Stats Chippac Pte. Ltd. (JCET Group Co., Ltd.)
• Original Assignee: Stats Chippac BVI limited (JCET Group Co., Ltd.)
• Inventors: Chow, Seng Guan, Kuan, Heap Hoe
• Primary Examiner(s): Parekh, Nitin
• Application Number:
  US12/912,730
• Publication Number:
  US 20110037136A1
• Time in Patent Office: 847 Days
• Field of Search: 257/100, 257/433, 257/787, 257/778, 257/E25.032, 257/E23.128
• US Class Current: 257/778
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01067 Holmium [Ho]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01327 Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/10156 at the periphery
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

An integrated circuit package system includes: an integrated circuit die including an image sensor system having interconnects connected thereto; and a transparent encapsulant on the integrated circuit die with portions of the interconnects exposed and with only the transparent encapsulant over the image sensor system to comprise an image sensor device.

Claims

1. An integrated circuit package system comprising:

an integrated circuit die including an image sensor system having interconnects connected thereto; and

a transparent encapsulant directly on the integrated circuit die with portions of the interconnects exposed through the encapsulant and with only the transparent encapsulant over the image sensor system to comprise an image sensor device, and a substrate electrically connected to the interconnects through flip-chip bonding, having an aperture provided therein and substrate connectors on a bottom thereof; and

wherein;

the image sensor device is mounted on the substrate at least partially in the aperture and among the substrate connectors.

2. The system as claimed in claim 1, further comprising:

a sealant between the image sensor device and the substrate.

3. The system as claimed in claim 1, further comprising:

a dam around the periphery of the substrate, and

a liquid encapsulant material around the image sensor device and filling the dam.

4. An integrated circuit package system comprising:

an integrated circuit die including image sensor systems having interconnects connected thereto; and

a transparent encapsulant directly on encapsulating the image sensor systems with a notch to expose portions of the interconnects exposed through the encapsulant and with only the transparent encapsulant over the image sensor systems to comprise an image sensor device, and a substrate electrically connected to the interconnects through flip-chip bonding, having an aperture provided therein and substrate connectors on a bottom thereof; and

wherein;

the image sensor device is mounted on the substrate at least partially in the aperture and among the substrate connectors.

5. The system as claimed in claim 4 further comprising:

passive or active devices electrically connected to the substrate;

bonding wires connected to the substrate;

an encapsulant encapsulating the bonding wires; and

wherein;

the image sensor device is mounted face up on the substrate.

6. The system as claimed in claim 4 further comprising:

passive or active devices electrically connected to the substrate;

bonding wires or electrical connections connected to the substrate and the interconnects;

an encapsulant encapsulating the bonding wires; and

wherein;

the image sensor device is mounted face up at least partially in the aperture and among the substrate connectors.

7. The system as claimed in claim 4 further comprising:

a dam around the periphery thereof;

bonding wires connected to the substrate and the interconnects;

a solidified liquid encapsulant material in the dam to cover the bonding wires.