Integrally molded die and bezel structure for fingerprint sensors and the like

• US 8,378,508 B2
• Filed: 03/05/2010
• Issued: 02/19/2013
• Est. Priority Date: 03/05/2010
• Status: Expired due to Fees

• Current Assignee: Apple Inc.
• Original Assignee: AuthenTec Incorporated (Apple Inc.)
• Inventors: Bond, Robert Henry, Kramer, Alan, Gozzini, Giovanni
• Primary Examiner(s): POTTER, ROY KARL
• Application Number:
  US12/718,880
• Publication Number:
  US 20110215484A1
• Time in Patent Office: 1,082 Days
• Field of Search: 257/787, 257/E23.129, 257/688, 257/690, 438/106, 438/127, 382/312
• US Class Current: 257/787
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H10N 39/00 Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00

Abstract

A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure.

Claims

1. A fingerprint sensor device, comprising:

a substrate having a first side and a second side;

a die having formed therein fingerprint sensing circuitry, said die secured to a die-receiving region of said first side of said substrate;

a first conductive bezel secured to a first bezel-receiving region of said first side of said substrate proximate said die-receiving region; and

an encapsulation structure integrally encasing at least a portion of said die and a portion of said first conductive bezel;

wherein said die has a top surface; and

wherein said first conductive bezel has a top surface substantially coplanar with the top surface of said die.

2. The fingerprint sensor of claim 1, wherein said encapsulation structure partially encases said first conductive bezel such that at least the top surface of said first conductive bezel is not encased therewith.

3. The fingerprint sensor of claim 2, wherein said die has formed on a surface thereof a sensor array for sensing a fingerprint pattern of a user, and wherein said encapsulation structure partially encases said die such that said sensor array is uncovered and exposed for physical contact.

4. The fingerprint sensor of claim 3, wherein said sensor array forms a component of a fingerprint strip sensor.

5. The fingerprint sensor of claim 3, wherein said sensor array forms a component of a fingerprint area sensor.

6. The fingerprint sensor of claim 1, wherein said encapsulation structure fully encases said die and first conductive bezel such that a top surface of each of said die and said first conductive bezel are encased by a portion of said encapsulation structure which is relatively thinner that the remainder of said encapsulation structure.

7. The fingerprint sensor of claim 6, wherein said die has formed on a surface thereof a sensor array for capacitively sensing a fingerprint pattern of a user, and wherein said encapsulation structure encases said die such that said sensor array is thinly encased by said encapsulation structure such that the thickness of said encapsulation structure over said sensor array does not reduce the sensitivity of the sensor array in a manner that substantially prevents the possibility of said sensor array to capacitively sense a fingerprint of a finger in physical contact with said encapsulation structure over said sensor array.

8. The fingerprint sensor of claim 7, wherein said sensor array forms a component of a fingerprint strip sensor.

9. The fingerprint sensor of claim 7, wherein said sensor array forms a component of a fingerprint area sensor.

10. The fingerprint sensor of claim 1, further comprising:

a second conductive bezel secured to a second bezel-receiving region of said first side of said substrate;

wherein said encapsulation structure further substantially encloses said second conductive bezel integrally with said die and said first conductive bezel.

11. The fingerprint sensor of claim 10, wherein said first conductive bezel and said second conductive bezel form portions of a bezel frame, and further wherein said bezel frame is physically coupled to said substrate.

12. The fingerprint sensor of claim 11, wherein said bezel frame is electrically coupled to said die by way of said substrate.

13. The fingerprint sensor of claim 1, wherein said first conductive bezel is electrically coupled to said die by way of said substrate.

14. The fingerprint sensor of claim 1, wherein said bezel defines an opening in which said die is located such that said die is surrounded by said bezel.

15. The fingerprint sensor of claim 1, wherein said first side of said substrate is in a first plane, and wherein said die and bezel are positioned relative to one another such that the distance between said first plane and said bezel top surface is greater than the distance between said first plane and said die top surface.

16. The fingerprint sensor of claim 15, wherein said bezel top surface is convex.

17. The fingerprint sensor of claim 1, wherein said first conductive bezel has an arch-shaped side profile having a top surface and two attachment feet having attachment portions, said top surface and said attachment feet defining an interior region therebetween, and further wherein said encapsulation structure includes a portion thereof disposed in and substantially filling said interior region.

18. A fingerprint sensor assembly comprising:

a substrate having a first side and a second side;

a die having formed thereon a fingerprint sensing array, said die secured to a die-receiving region of said first side of said substrate;

a first conductive bezel secured to a first bezel-receiving region of said first side of said substrate proximate said die-receiving region;

a second conductive bezel secured to a second bezel-receiving region of said first side of said substrate proximate said die-receiving region, such that said die receiving region is between said first and second bezel-receiving regions; and

an encapsulation structure integrally encapsulating said die, said first conductive bezel, and said second conductive bezel, said encapsulation structure substantially encasing said die and said first and second conductive bezels such that said fingerprint sensing array and a portion of a top surface of each of said first conductive bezel and said second conductive bezel are not encased by said encapsulation structure and are exposed for physical contact.

19. The fingerprint sensor of claim 18, wherein said first conductive bezel and said second conductive bezel are each electrically coupled to said die by way of said substrate.

20. A method of making a fingerprint sensor device, the method comprising:

securing a die, having fingerprint sensing circuitry therein, to a die-receiving region of a first side of a substrate, the die having a top surface;

securing a first conductive bezel to a first bezel-receiving region of the first side of the substrate adjacent the die-receiving region; and

encasing at least a portion of the die and a portion of the first conductive bezel in an encapsulation structure with a top surface of the first conductive bezel being substantially coplanar with the top surface of the die.

21. The method of claim 20, wherein the encapsulation structure partially encases the first conductive bezel such that at least the top surface of the first conductive bezel is not encased therewith.

22. The method of claim 20, wherein the die includes a sensor array for sensing a fingerprint pattern of a user, and wherein the encapsulation structure partially encases the die such that the sensor array is exposed for physical contact.

23. The method of claim 22, wherein the sensor array defines a component of a fingerprint strip sensor.

24. The method of claim 22, wherein the sensor array defines a component of a fingerprint area sensor.