×

Bus to bus power interconnect

  • US 8,379,374 B2
  • Filed: 07/16/2010
  • Issued: 02/19/2013
  • Est. Priority Date: 07/16/2010
  • Status: Active Grant
First Claim
Patent Images

1. A bus to bus interconnect system, comprising:

  • a via block having first and second interfaces separated by a conductive body, wherein the via block is configured to communicatively couple with a first bus through the first interface and wherein the conductive body is configured to extend through an opening in a bus support panel;

    a first coupling section of a jumper including a first attachment feature, wherein the first attachment feature is configured to facilitate attachment with the second interface of the via block;

    a neck section of the jumper extending perpendicularly from the first coupling section; and

    a second coupling section of the jumper extending from the neck section, wherein the second coupling section includes a second attachment feature configured to facilitate attachment with a second bus, and wherein the first coupling section and the second coupling section each extend away from the neck section in different directions.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×