Method and apparatus for the selective separation of two layers of material using an ultrashort pulse source of electromagnetic radiation
First Claim
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1. A method of separating two layers of material on a substrate in at least a portion of an interface between them comprising:
- thinning at least a portion of one of the layers of material on the substrate by ablation with electromagnetic radiation; and
directing an evanescent wave of electromagnetic radiation into the interface.
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Abstract
A direct-write method, apparatus and end use device for selective separation of at least one layer of material from another layer of material at the interface between them using a beam of electromagnetic radiation from an ultrashort pulse source is disclosed.
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Citations
1 Claim
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1. A method of separating two layers of material on a substrate in at least a portion of an interface between them comprising:
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thinning at least a portion of one of the layers of material on the substrate by ablation with electromagnetic radiation; and directing an evanescent wave of electromagnetic radiation into the interface.
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Specification